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Taiwan Semiconductor Corporation HS1F R3G
- Part No.:
- HS1F R3G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AC, SMA
- Datasheet:
-
HS1F R3G.pdf
- Description:
- DIODE GEN PURP 300V 1A DO214AC
- Quantity:
- Payment:
- Shipping:
Inventory:6,082
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Product details
Overview
HS1F R3G from Taiwan Semiconductor is a 300 V, 1 A high-efficiency surface-mount silicon rectifier diode in DO-214AC (SMA) package, featuring 50 ns reverse recovery time, 1.0 V forward voltage at 1 A, and 30 A peak surge current - used in DC-DC converters and snubber circuits.
For engineers reviewing the HS1F R3G datasheet, HS1F R3G pinout, HS1F R3G application, or HS1F R3G equivalent, key selection criteria include repetitive peak reverse voltage (300 V), fast recovery performance (≤50 ns), thermal resistance (RθJL = 15 °C/W), RoHS/halogen-free compliance, and SMA package compatibility with automated SMT assembly.
Technical Context
This device is a single-die, glass-passivated, planar junction silicon rectifier optimized for high-frequency switching applications. Its fast recovery (trr ≤ 50 ns) and low forward voltage (VF ≤ 1.0 V @ 1 A, 25°C) reduce conduction and switching losses in SMPS topologies.
Designed for operation from –55°C to +150°C junction temperature, it delivers stable reverse leakage (IR ≤ 5 µA @ 25°C, VR = 300 V) and exhibits 20 pF junction capacitance at 1 MHz and 4 V reverse bias - critical for EMI-sensitive snubber and freewheeling designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 300 V - maximum repetitive reverse blocking voltage; defines safe operating range in flyback/clamp circuits |
| IF | 1 A continuous - average forward current rating at TC = 75°C; sets power-handling capability in DC-DC output stages |
| trr | 50 ns - reverse recovery time; enables efficient operation up to ~1 MHz switching frequencies |
| VF | 1.0 V @ 1 A, 25°C - low conduction loss improves system efficiency and reduces thermal load on PCB |
| RθJL | 15 °C/W - junction-to-lead thermal resistance; supports direct heat transfer to copper pad without heatsink |
| IR | 5 µA @ 300 V, 25°C - low leakage ensures minimal standby power loss in high-impedance bias networks |
Pinout & Package
DO-214AC (SMA) surface-mount package with molded plastic body (UL 94V-0), matte tin-plated leads, cathode band polarity marking, and 0.060 g typical weight. Designed for reflow soldering per J-STD-002.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential side of circuit (e.g., switch node in buck converter) |
| Cathode | Forward current exit / reverse blocking terminal | Marked by band; ties to output rail or clamp node; blocks 300 V reverse during off-state |
Key Features
| Feature | Design Value |
|---|---|
| Glass-passivated junction | Enhances humidity resistance and long-term reliability in humid industrial environments |
| Moisture sensitivity level 1 | Enables standard SMT handling without baking; eliminates moisture-related popcorning risk |
| Fast switching (trr ≤ 50 ns) | Reduces switching loss and EMI generation in high-frequency DC-DC converters |
| RoHS and halogen-free | Meets global environmental compliance requirements for consumer, industrial, and automotive end equipment |
Applications
| DC-DC Converter Output Rectification | Snubber Circuit Protection |
|---|---|
Use Scenario: Secondary-side rectification in isolated flyback or forward converters delivering 5–24 V at up to 1 A. IC Role / Device Role / Timing Role: Unidirectional current path enabling energy transfer while blocking reverse voltage spikes. Use Value: 1.0 V VF minimizes conduction loss; 300 V VRRM safely clamps reflected transformer spikes. | Use Scenario: RC snubber across MOSFET drain-source or relay contacts to suppress voltage transients. IC Role / Device Role / Timing Role: Fast-recovery path for transient energy dissipation during turn-off events. Use Value: 50 ns trr ensures rapid turn-on to clamp overshoot before MOSFET breakdown; low IR avoids DC loading. |
| Switching Inverter Freewheeling | LED Driver Flyback Clamp |
Use Scenario: Freewheeling path for inductive loads (e.g., motor windings, solenoids) in H-bridge inverters. IC Role / Device Role / Timing Role: Provides low-loss return path for stored inductor energy during PWM off-time. Use Value: 30 A IFSM withstands high-current kickback; 150°C TJ max supports operation in enclosed enclosures. | Use Scenario: Clamp diode in LED driver flyback topology to protect primary-side switch from reflected voltage. IC Role / Device Role / Timing Role: Reverse-biased blocking element that conducts only during voltage reversal events. Use Value: 300 V VRRM exceeds typical reflected voltage (200–250 V); 20 pF CJ limits capacitive coupling noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-efficiency rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor MUR130 | Same DO-214AC package; 300 V VRRM; 1.3 V VF @ 1 A (higher conduction loss) | Slightly higher VF increases thermal load in high-duty-cycle LED drivers | Prefer HS1F R3G where <1.1 V VF is required for thermal margin |
| Vishay VS-1N5819HM3/85A | Lower VRRM (40 V); Schottky construction; 0.45 V VF; no reverse recovery (trr = N/A) | Not suitable for 300 V blocking; limited to low-voltage (<45 V) DC-DC outputs | Select only for sub-45 V systems needing ultra-low VF; not a voltage-compatible replacement |
Compared with MUR130 and VS-1N5819HM3/85A, HS1F R3G offers optimal balance of 300 V blocking, 1.0 V VF, and 50 ns trr - making it uniquely suited for mid-voltage flyback and snubber use where Schottky limitations or higher VF penalties are unacceptable.
Availability
HS1F R3G is available at Aetrix Electronics and suitable for DC-DC converters, snubber circuits, and freewheeling applications requiring stable component supply, consistent parametric performance, and full RoHS/halogen-free compliance.
Supply support for HS1F R3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete power devices, including rectifiers, TVS diodes, and MOSFETs, with global distribution and AEC-Q200 qualified products.
The HS1x series was designed specifically for high-efficiency, surface-mount AC/DC and DC-DC power conversion - targeting cost-sensitive yet thermally demanding industrial, lighting, and consumer power supplies.
FAQ
What is the maximum junction temperature rating for HS1F R3G?
The HS1F R3G has a maximum junction temperature (TJ) of +150°C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet (Version M2401). This allows reliable operation in enclosed power supplies and industrial environments where ambient temperatures exceed 85°C. Derating curves confirm usable current capacity down to 0.5 A at 125°C case temperature. The HS1F R3G must be mounted on a minimum 5 mm × 5 mm copper pad to achieve specified thermal resistance.
Does HS1F R3G have a specified reverse recovery time, and how is it measured?
Yes, HS1F R3G has a maximum reverse recovery time (trr) of 50 ns, measured under IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A conditions per the datasheet's Electrical Specifications table. This value applies to the HS1A–HS1F subgroup and reflects its fast-switching capability. The HS1F R3G uses a planar junction with optimized lifetime control to achieve this performance - critical for minimizing switching loss in 100–500 kHz SMPS designs.
Is HS1F R3G compatible with lead-free reflow soldering processes?
Yes, HS1F R3G is fully compatible with lead-free reflow soldering. Its matte tin-plated leads meet J-STD-002 solderability requirements, and the DO-214AC (SMA) package is rated for peak reflow temperatures up to 260°C per JEDEC J-STD-020 (MSL Level 1). No pre-baking is required due to its moisture sensitivity level 1 classification - a key advantage over higher-MSL alternatives. The HS1F R3G maintains parameter integrity after standard IPC-7095-compliant reflow profiles.
What does the "R3G" suffix in HS1F R3G indicate?
The "R3G" suffix in HS1F R3G denotes Taiwan Semiconductor's internal packaging and environmental coding: "R" indicates tape-and-reel packaging (7,500 pcs/reel), "3" specifies green molding compound (halogen-free), and "G" confirms RoHS compliance per EU Directive 2011/65/EU. This coding is consistent across the HS1x family and appears in TSC's ordering information tables. The HS1F R3G shares identical electrical and thermal specs with HS1F marked parts lacking the suffix.
How does HS1F R3G compare to HS1G in terms of forward voltage and application suitability?
HS1F R3G has a maximum forward voltage (VF) of 1.0 V at 1 A and 25°C, while HS1G is rated at 1.3 V under identical conditions - a 30% higher conduction loss. This makes HS1F R3G preferable in thermally constrained DC-DC outputs or high-duty-cycle snubbers. Both share the same 300 V vs. 400 V VRRM, so HS1F R3G is selected when 300 V margin suffices and lower VF is prioritized. The HS1F R3G remains electrically and mechanically interchangeable with HS1G in SMA footprints.
HS1F R3G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AC, SMA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 1 V @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 300 V
- Capacitance @ Vr, F:
- 20pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AC (SMA)
- Operating Temperature - Junction:
- -55°C ~ 150°C
HS1F R3G FAQ
1.How can I place an order for HS1F R3G through Aetrix?
Please submit a Request for Quotation (RFQ) for HS1F R3G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HS1F R3G reliable?
The price and inventory of HS1F R3G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HS1F R3G is usually 5 days.
3.What payment methods are accepted for HS1F R3G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HS1F R3G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HS1F R3G?
HS1F R3G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HS1F R3G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HS1F R3G?
For technical support, including HS1F R3G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HS1F R3G requirements.
6.How does Aetrix verify that HS1F R3G is sourced from the original manufacturer or authorized distributors?
All HS1F R3G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HS1F R3G meets industry standards.
7.What is the process for return or replacement of HS1F R3G?
All HS1F R3G units undergo pre-shipment inspection (PSI). If there is an issue with HS1F R3G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HS1F R3G part is unused and in its original packaging.
Return procedure for HS1F R3G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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