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Taiwan Semiconductor Corporation HS3F
- Part No.:
- HS3F
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AB, SMC
- Datasheet:
-
HS3F.pdf
- Description:
- DIODE GEN PURP 300V 3A DO214AB
- Quantity:
- Payment:
- Shipping:
Inventory:2,990
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Product details
Overview
HS3F from Taiwan Semiconductor is a 3 A, 300 V high-efficiency surface-mount silicon rectifier diode in DO-214AB (SMC) package, featuring 1.0 V max forward voltage at 3 A and 50 ns reverse recovery time, used for high-frequency rectification in switching-mode power supplies.
For engineers reviewing the HS3F datasheet, HS3F pinout, HS3F application, or HS3F equivalent, key selection criteria include peak repetitive reverse voltage (300 V), forward surge current rating (150 A), junction-to-ambient thermal resistance (60 °C/W), moisture sensitivity level (J-STD-020 Level 1), and RoHS/halogen-free compliance.
Technical Context
The HS3F is a single-die, glass-passivated, planar junction silicon rectifier optimized for high-frequency operation. Its 50 ns reverse recovery time and low forward voltage drop support efficient energy transfer in SMPS and DC-DC converters.
Designed for automated placement and reflow soldering, it uses matte tin-plated leads compliant with J-STD-002 and meets JESD 201 Class 2 whisker resistance. Polarity is marked by a cathode band on the DO-214AB body.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 300 V - Maximum repetitive reverse blocking voltage; defines safe operating range in bridge or freewheeling configurations |
| IF | 3 A - Continuous average forward current; determines steady-state power handling without heatsinking below 60 °C/W ambient rise |
| IFSM | 150 A - Non-repetitive surge rating (8.3 ms half-sine); supports inrush current tolerance in AC/DC front-ends |
| VF @ 3 A | ≤1.0 V - Low conduction loss at rated current; reduces power dissipation and improves system efficiency |
| trr | ≤50 ns - Fast recovery enables high-frequency switching (>100 kHz) with minimal switching loss and EMI generation |
| RθJA | 60 °C/W - Thermal resistance from junction to ambient; guides PCB copper area and layout for thermal management |
| Junction Temp | −55 to +150 °C - Wide operating temperature range supports industrial and telecom environments |
Pinout & Package
Package: DO-214AB (SMC), molded plastic case with matte tin-plated leads, UL 94V-0 rated compound, cathode indicated by band.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (lead 1) | Forward current entry point | Connected to lower-potential side of load or source in rectifier/freewheeling path |
| Cathode (lead 2) | Forward current exit / reverse blocking terminal | Marked by band; connects to output rail or switch node; blocks up to 300 V reverse bias |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Enhances long-term reliability under humidity and thermal cycling; eliminates need for conformal coating in IPC Class 2 environments |
| Low profile DO-214AB (SMC) | Enables compact board layouts and compatibility with standard SMT pick-and-place equipment and reflow profiles |
| J-STD-020 Level 1 moisture sensitivity | Allows unlimited floor life before reflow; eliminates baking requirement and simplifies manufacturing logistics |
| RoHS & halogen-free | Meets IEC 61249-2-21 and EU RoHS Directive; supports green product compliance for global OEM shipments |
Applications
| Server Power Supply Rectification | Telecom DC-DC Converter Output Stage |
|---|---|
Use Scenario: High-density 48 V input to 12 V/5 V isolated DC-DC modules in 1U server PSUs. IC Role / Device Role / Timing Role: Output rectifier in synchronous or quasi-resonant flyback topology. Use Value: 50 ns trr minimizes switching loss during high-frequency (200–500 kHz) operation, improving efficiency by ~0.8% over slower 100 ns alternatives. | Use Scenario: Secondary-side rectification in telecom brick converters delivering ±12 V and 3.3 V rails. IC Role / Device Role / Timing Role: Freewheeling diode across transformer secondary windings. Use Value: 1.0 V VF at 3 A reduces conduction loss by 0.3 W vs. 1.3 V diodes, lowering thermal stress on adjacent MOSFETs and magnetics. |
| Industrial Motor Drive Snubber Network | LED Driver Bridge Input Stage |
Use Scenario: RC snubber clamp diode across IGBTs in 3-phase inverter stages for HVAC compressors. IC Role / Device Role / Timing Role: Fast-recovery clamp path for inductive turn-off voltage spikes. Use Value: 150 A IFSM withstands transient surges from motor back-EMF; 300 V VRRM provides margin above 277 VAC line peaks. | Use Scenario: Input bridge rectifier in constant-current LED drivers for street lighting (120/277 VAC input). IC Role / Device Role / Timing Role: Primary AC-to-DC conversion element in full-wave bridge configuration. Use Value: DO-214AB package allows direct integration into compact aluminum-core PCBs; 60 °C/W RθJA enables natural convection cooling without heatsinks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-efficiency rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-3EYH03-M3/45 | Same DO-214AB package, 300 V VRRM, but 1.15 V VF @ 3 A and 75 ns trr | Slightly higher conduction and switching loss; suitable where cost sensitivity outweighs 0.15 V/25 ns trade-off | Select when supply chain diversification is prioritized and 0.5% efficiency loss is acceptable |
| ON Semiconductor MUR330 | DO-201AD package (larger), same 300 V/3 A rating, 1.3 V VF, 50 ns trr, but 75 °C/W RθJA | Requires larger PCB footprint and additional thermal relief; not SMT-optimized for high-density layouts | Choose only if legacy through-hole compatibility or existing DO-201AD footprint reuse is mandatory |
Compared with VS-3EYH03-M3/45 and MUR330, the HS3F delivers the lowest combined conduction and switching loss in its voltage class due to its 1.0 V VF and 50 ns trr, while maintaining J-STD-020 Level 1 handling and DO-214AB's space efficiency-critical for next-gen power density targets.
Availability
HS3F is available at Aetrix Electronics and suitable for server power supplies, telecom DC-DC converters, and industrial motor drive snubbers requiring stable component supply, consistent parametric performance, and full RoHS/halogen-free compliance.
Supply support for HS3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and communications markets since 1979.
The HS3F belongs to TSC's HS3x family of high-efficiency surface-mount rectifiers, engineered specifically for high-frequency switching power conversion where low VF, fast trr, and robust thermal performance are critical.
FAQ
What is the maximum junction temperature rating for the HS3F?
The HS3F has a maximum junction temperature (TJ) rating of +150 °C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet (Version K2102). This allows reliable operation in high-ambient environments such as enclosed server chassis or sealed industrial enclosures. Derating curves confirm usable current capacity down to 1.5 A at 125 °C ambient, assuming standard DO-214AB mounting on 1-inch² 2-oz copper.
Does the HS3F support lead-free reflow soldering processes?
Yes, the HS3F supports lead-free reflow soldering per J-STD-020 Level 1 requirements. Its matte tin-plated leads are solderable per J-STD-002, and the device is qualified for peak reflow temperatures up to 260 °C. The DO-214AB package uses UL 94V-0 molding compound, ensuring stability during standard Pb-free thermal profiles without delamination or popcorning.
How does the HS3F differ from the HS3G in terms of electrical performance?
The HS3F and HS3G share identical package, thermal specs, and surge rating, but differ in reverse voltage and forward voltage: HS3F is rated for 300 V VRRM and ≤1.0 V VF @ 3 A, while HS3G is rated for 400 V VRRM and ≤1.3 V VF @ 3 A. The HS3F offers lower conduction loss, whereas HS3G provides higher voltage margin-selection depends on system peak reverse stress and efficiency targets.
Is the HS3F suitable for use in automotive applications?
The HS3F is not qualified to AEC-Q101 or automotive-grade reliability standards. While its −55 to +150 °C operating range overlaps with some automotive ambient conditions, Taiwan Semiconductor explicitly states these devices are "not designed for use in medical, life-saving, or life-sustaining applications"-and automotive safety-critical systems fall outside its intended scope. For automotive, consider TSC's AEC-Q101-certified rectifier families instead.
What is the reverse leakage current specification for the HS3F at elevated temperature?
Per the official Taiwan Semiconductor datasheet (K2102), the HS3F exhibits ≤250 µA reverse leakage current (IR) at rated VR = 300 V and junction temperature of 125 °C. At 25 °C, IR is ≤10 µA. This low leakage supports stable hold-up time in offline capacitors and minimizes standby power loss in no-load conditions.
HS3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AB, SMC
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 300 V
- Capacitance @ Vr, F:
- 80pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AB (SMC)
- Operating Temperature - Junction:
- -55°C ~ 150°C
HS3F FAQ
1.How can I place an order for HS3F through Aetrix?
Please submit a Request for Quotation (RFQ) for HS3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HS3F reliable?
The price and inventory of HS3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HS3F is usually 5 days.
3.What payment methods are accepted for HS3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HS3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HS3F?
HS3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HS3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HS3F?
For technical support, including HS3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HS3F requirements.
6.How does Aetrix verify that HS3F is sourced from the original manufacturer or authorized distributors?
All HS3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HS3F meets industry standards.
7.What is the process for return or replacement of HS3F?
All HS3F units undergo pre-shipment inspection (PSI). If there is an issue with HS3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HS3F part is unused and in its original packaging.
Return procedure for HS3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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