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Taiwan Semiconductor Corporation HS3FB

Part No.:
HS3FB
Manufacturer:
Taiwan Semiconductor Corporation
Category:
Single Diodes
Package:
DO-214AA, SMB
Datasheet:
AetrixHS3FB.pdf
Description:
DIODE GEN PURP 300V 3A DO214AA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,960

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Product details

Overview

HS3FB from Taiwan Semiconductor is a 3A, 300V repetitive peak reverse voltage surface-mount silicon rectifier diode in DO-214AA (SMB) package, featuring 1.0V max forward voltage at 3A and 50ns max reverse recovery time, used for high-efficiency AC/DC conversion in compact power adapters.

For engineers reviewing the HS3FB datasheet, HS3FB pinout, HS3FB application, or HS3FB equivalent, key selection criteria include its 300V VRRM, 100A IFSM, 60°C/W RθJA, JESD201 Class 2 whisker resistance, and RoHS/halogen-free compliance for industrial-grade SMPS design.

Technical Context

The HS3FB is a single-die, glass-passivated, fast-recovery rectifier optimized for switching-mode power supplies operating up to 150°C junction temperature. Its 50ns trr and low 1.0V VF at 3A enable reduced conduction and switching losses in high-frequency flyback and forward converters.

Designed with matte tin-plated leads compliant with J-STD-002 and moisture sensitivity level 1 per J-STD-020, the HS3FB supports automated SMT placement and reflow without preconditioning, while its UL 94V-0 molding compound ensures flame-retardant reliability in space-constrained consumer electronics.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM300 V - Maximum non-repetitive reverse blocking voltage; defines usable input voltage range in bridge or single-diode rectification stages
IF3 A - Continuous average forward current; determines thermal derating margin in 75°C ambient adapter designs
VF @ 3A≤1.0 V - Forward voltage drop at rated current; directly impacts conduction loss and thermal rise in high-duty-cycle operation
trr≤50 ns - Reverse recovery time; enables stable operation at >100 kHz switching frequencies with minimal switching noise
RθJA60 °C/W - Junction-to-ambient thermal resistance; sets minimum PCB copper area requirement for 3A continuous load at 70°C ambient
IFSM100 A - Non-repetitive surge current rating; withstands inrush currents during cold-start of 100W-class power supplies
CJ80 pF @ 4V - Junction capacitance; influences EMI generation and snubber sizing in high-dv/dt applications

Pinout & Package

Package: DO-214AA (SMB), surface-mount, cathode-indicated by band, 0.093g weight, UL 94V-0 molded case.

Pin/TerminalCircuit RoleDesign Meaning
AnodeForward current entry pointConnected to AC input or transformer secondary; requires thermal relief pad for soldering and heat dissipation
CathodeForward current exit / reverse voltage blocking terminalConnected to output rail or ground return; polarity band must align with PCB silkscreen for automated optical inspection

Key Features

FeatureDesign Value
Fast recovery (trr ≤ 50 ns)Enables efficient operation in 100–500 kHz SMPS topologies without excessive switching loss or ringing
Glass passivated junctionProvides long-term reliability under humidity and thermal cycling stress, meeting industrial-grade lifetime requirements
Moisture sensitivity level 1Eliminates bake preconditioning before reflow, reducing manufacturing cost and process complexity
RoHS and halogen-freeComplies with IEC 61249-2-21 and EU RoHS Directive, supporting global environmental compliance for export products
Matte tin-plated leadsEnsures consistent solderability per J-STD-002 and prevents intermetallic growth during multiple reflow cycles

Applications

Power AdaptersFlat Panel Monitor Power Supplies

Use Scenario: 36W universal-input AC/DC adapter for USB-C PD chargers with compact 30 × 30 mm PCB layout.

IC Role / Device Role / Timing Role: Output rectifier in synchronous flyback secondary stage, replacing Schottky diodes where higher VRRM and lower leakage are required.

Use Value: 300V VRRM and 1.0V VF balance efficiency and safety margin across 90–264VAC inputs without derating.

Use Scenario: Auxiliary 12V/3A supply in 24-inch LCD monitor with tight thermal envelope and no active cooling.

IC Role / Device Role / Timing Role: Primary-side rectifier in isolated buck-derived auxiliary converter, handling 3A continuous load at 75°C ambient.

Use Value: 60°C/W RθJA and 150°C TJMAX allow full-rated current on 1-oz copper with 250 mm² thermal pad, avoiding heatsink cost.

LED TV Backlight DriversIndustrial AC-DC Modules

Use Scenario: High-voltage boost rectifier in 400V DC bus generation for local LED string drivers in 55-inch smart TVs.

IC Role / Device Role / Timing Role: Fast-recovery rectifier in PFC-less boost stage, operating at 120 kHz with <50 ns trr to minimize dv/dt-induced EMI.

Use Value: 50 ns trr and 80 pF CJ reduce switching node oscillation and simplify EMI filter design versus standard FRDs.

Use Scenario: Input rectifier in DIN-rail mounted 24V/5A industrial power module requiring 10-year field life under 85°C ambient.

IC Role / Device Role / Timing Role: Main AC input bridge leg diode, selected for glass passivation and JESD201 Class 2 whisker resistance.

Use Value: Moisture sensitivity level 1 and JESD201 Class 2 qualification ensure zero field failures from tin whisker growth or humidity-induced corrosion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fast-recovery rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor MUR330Same 3A/300V rating, but 35ns trr and 1.2V VF; TO-220AC package vs SMBRequires through-hole assembly and heatsink; unsuitable for ultra-thin adaptersSelect when lower trr outweighs SMT compatibility and board space constraints
Vishay VS-3EY303A/300V, 60ns trr, 1.15V VF, same DO-214AA package, but not halogen-freeLacks IEC 61249-2-21 compliance; restricted in EU medical/consumer shipmentsSelect only for cost-sensitive non-regulated markets where halogen-free is not mandated

Compared with MUR330 and VS-3EY30, the HS3FB uniquely combines SMB SMT compatibility, 1.0V low VF, halogen-free compliance, and moisture level 1-making it optimal for high-volume, space-constrained, globally shipped power adapters.

Availability

HS3FB is available at Aetrix Electronics and suitable for power adapters, flat panel monitor power supplies, LED TV backlight drivers, and industrial AC-DC modules requiring stable component supply, long-lifecycle support, and full regulatory compliance.

Supply support for HS3FB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power electronics and industrial markets since 1979.

The HS3FB belongs to TSC's HS3x series of high-efficiency fast-recovery rectifiers, designed specifically for compact, high-frequency AC/DC power conversion in consumer and industrial applications where thermal performance, SMT compatibility, and environmental compliance are critical.

FAQ

What is the maximum junction temperature rating for HS3FB?

The HS3FB has a maximum junction temperature (TJMAX) of +150°C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet Version L2102. This allows reliable operation in enclosed power adapters with limited airflow, provided PCB thermal design maintains junction temperature below this limit during continuous 3A load. Derating curves confirm usable current down to 1.5A at 125°C ambient.

Does HS3FB support lead-free reflow soldering?

Yes, HS3FB supports lead-free reflow soldering per J-STD-002. Its matte tin-plated leads are qualified for peak temperatures up to 260°C, and its moisture sensitivity level 1 eliminates bake preconditioning. The DO-214AA (SMB) package is compatible with standard IPC-7095 SMT profiles, and the UL 94V-0 molding compound resists delamination during thermal cycling.

What is the reverse leakage current specification for HS3FB at elevated temperature?

Per the Electrical Specifications table in the Taiwan Semiconductor datasheet, HS3FB exhibits ≤250 μA reverse current (IR) at rated VR and TJ = 100°C. At 25°C, leakage is ≤10 μA. This low leakage preserves efficiency in high-impedance bias networks and reduces standby power loss in energy-efficient adapters complying with DOE Level VI or EU CoC Tier 2 standards.

Is HS3FB pin-compatible with other devices in the HS3x family?

Yes, all HS3x devices-including HS3AB, HS3BB, HS3DB, HS3FB, HS3GB, HS3JB, HS3KB, and HS3MB-share identical DO-214AA (SMB) package dimensions, pinout, and thermal pad layout. Voltage ratings differ only in die construction; mechanical mounting, solder stencil, and PCB footprint are fully interchangeable across the family for BOM flexibility and design reuse.

How does HS3FB's junction capacitance affect EMI performance in high-frequency SMPS?

HS3FB's typical junction capacitance is 80 pF at 4V reverse bias, measured at 1 MHz. This value directly influences high-frequency ringing amplitude and EMI filter attenuation requirements. In 200–500 kHz flyback converters, this CJ contributes to snubber network design and helps suppress dv/dt-induced common-mode noise-especially when paired with its 50 ns trr to minimize abrupt current collapse.

HS3FB Specifications

Product attributes
Attribute value
Manufacturer:
Taiwan Semiconductor Corporation
Series:
-
Package/Case:
DO-214AA, SMB
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Standard
Voltage - DC Reverse (Vr) (Max):
300 V
Current - Average Rectified (Io):
3A
Voltage - Forward (Vf) (Max) @ If:
1 V @ 3 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
50 ns
Current - Reverse Leakage @ Vr:
10 µA @ 300 V
Capacitance @ Vr, F:
80pF @ 4V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DO-214AA (SMB)
Operating Temperature - Junction:
-55°C ~ 150°C

HS3FB FAQ

1.How can I place an order for HS3FB through Aetrix?

Please submit a Request for Quotation (RFQ) for HS3FB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HS3FB reliable?

The price and inventory of HS3FB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HS3FB is usually 5 days.

3.What payment methods are accepted for HS3FB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HS3FB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HS3FB?

HS3FB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HS3FB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HS3FB?

For technical support, including HS3FB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HS3FB requirements.

6.How does Aetrix verify that HS3FB is sourced from the original manufacturer or authorized distributors?

All HS3FB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HS3FB meets industry standards.

7.What is the process for return or replacement of HS3FB?

All HS3FB units undergo pre-shipment inspection (PSI). If there is an issue with HS3FB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HS3FB part is unused and in its original packaging.

Return procedure for HS3FB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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