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Taiwan Semiconductor Corporation HS3F M6G
- Part No.:
- HS3F M6G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AB, SMC
- Datasheet:
-
HS3F M6G.pdf
- Description:
- DIODE GEN PURP 300V 3A DO214AB
- Quantity:
- Payment:
- Shipping:
Inventory:6,523
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Product details
Overview
HS3F M6G from Taiwan Semiconductor is a 3A, 300V high-efficiency surface-mount silicon rectifier diode in DO-214AB (SMC) package, featuring low forward voltage drop (1.0 V at 3 A, 25°C), 150 A peak surge current capability, and 50 ns reverse recovery time - deployed in switching-mode power supplies for telecom infrastructure.
For engineers reviewing the HS3F M6G datasheet, HS3F M6G pinout, HS3F M6G application, or HS3F M6G equivalent, key selection criteria include repetitive peak reverse voltage (300 V), thermal resistance (60 °C/W), junction temperature range (–55 to +150 °C), moisture sensitivity level (J-STD-020 Level 1), and RoHS/halogen-free compliance.
Technical Context
This device is a single-die, glass-passivated, planar-junction silicon rectifier optimized for high-frequency operation. Its 50 ns reverse recovery time and 80 pF junction capacitance at 1 MHz/4 V support efficient freewheeling and snubberless flyback designs in compact DC-DC converters.
The DO-214AB (SMC) package enables automated placement and delivers 60 °C/W junction-to-ambient thermal resistance. Cathode polarity is marked by a visible band, and terminals are matte tin-plated per J-STD-002 solderability standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 300 V - maximum repetitive reverse blocking voltage; defines safe operating limit in bridge or flyback secondary-side rectification |
| IF | 3 A continuous - average forward current rating at TA = 75°C; determines steady-state power dissipation in SMPS output stages |
| VF | 1.0 V @ 3 A, 25°C - low conduction loss improves efficiency in high-duty-cycle applications like server PSUs |
| trr | 50 ns - fast recovery minimizes switching losses and EMI in >100 kHz converters |
| RθJA | 60 °C/W - thermal performance enables PCB-level heatsinking without additional copper or thermal vias in space-constrained modules |
| IR | 10 µA @ 25°C - low leakage preserves hold-up time and reduces standby power in offline adapters |
Pinout & Package
Package: DO-214AB (SMC), surface-mount, single-anode/single-cathode configuration with cathode band marking. Weight: 0.210 g. Moisture sensitivity level: J-STD-020 Level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., transformer secondary center-tap or switch node in synchronous rectification) |
| Cathode | Forward current exit point / reverse-blocking terminal | Marked by band; ties to output rail or filter capacitor positive; must withstand full VRRM during off-state |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Enhances long-term reliability under humidity and thermal cycling; eliminates need for conformal coating in industrial-grade power modules |
| Low profile SMC package | Enables ≤1.7 mm board height in ultra-thin AC-DC adapters and PoE injectors |
| J-STD-020 Level 1 moisture sensitivity | Allows unlimited floor life before reflow; eliminates bake requirement and simplifies SMT line logistics |
| RoHS & halogen-free (IEC 61249-2-21) | Meets EU WEEE/ELV and automotive OEM material declarations; supports green manufacturing audits |
Applications
| Telecom Switch-Mode Power Supplies | Industrial Motor Drive Freewheeling |
|---|---|
Use Scenario: Secondary-side rectification in 48 V input telecom rectifiers delivering 12 V/20 A to base station control cards. IC Role / Device Role / Timing Role: High-efficiency unidirectional current path; replaces Schottky diodes where higher VRRM and lower cost are prioritized over ultra-low VF. Use Value: 300 V VRRM and 50 ns trr enable stable operation under transient surges and high-frequency PWM, reducing output ripple by 12% vs. slower rectifiers. | Use Scenario: Freewheeling path across IGBTs in 3-phase 2 kW servo drive inverters. IC Role / Device Role / Timing Role: Clamp inductive kickback energy during IGBT turn-off; absorbs stored motor winding energy without oscillation. Use Value: 150 A IFSM rating handles 3× rated motor stall currents; 60 °C/W RθJA allows direct mounting on aluminum heatsink without thermal interface pads. |
| Laptop Adapter Output Stage | LED Driver Secondary Rectification |
Use Scenario: Output rectification in 65 W GaN-based USB-C PD adapters operating at 200 kHz. IC Role / Device Role / Timing Role: Fast-recovery diode in quasi-resonant flyback topology; complements primary-side GaN FET for zero-voltage switching. Use Value: 80 pF CJ minimizes capacitive loading on transformer secondary, preserving ZVS margin and improving light-load efficiency by 2.3%. | Use Scenario: Constant-current LED string rectification in outdoor streetlight drivers exposed to –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Isolation barrier rectifier in isolated buck-boost LED driver; blocks reverse leakage during dimming cycles. Use Value: –55°C to +150°C TJ range ensures no derating required across full industrial temperature envelope; 10 µA IR prevents LED flicker at cold start. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-efficiency rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor MUR330 | Same DO-214AB package, 300 V VRRM, but VF = 1.25 V @ 3 A and trr = 60 ns | Slightly higher conduction loss; less suitable for <100 mV output tolerance designs | Prefer HS3F M6G when VF budget is ≤1.05 V or trr < 55 ns is required |
| Vishay VS-3EY30 | DO-214AB, 300 V, VF = 1.05 V @ 3 A, trr = 55 ns, but IR = 50 µA @ 25°C (5× higher) | Higher leakage may impact standby power in Energy Star-compliant adapters | Prefer HS3F M6G for low-standby-power applications where IR ≤ 15 µA is mandatory |
Compared with MUR330 and VS-3EY30, HS3F M6G delivers the lowest VF (1.0 V), fastest trr (50 ns), and tightest IR spec (10 µA), making it optimal for high-efficiency, low-EMI, and low-standby-power switching power supplies where thermal and electrical margins are constrained.
Availability
HS3F M6G is available at Aetrix Electronics and suitable for telecom power supplies, industrial motor drives, laptop adapters, and LED drivers requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for HS3F M6G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs since 1979.
The HS3x series was designed specifically for high-frequency, high-reliability rectification in space-constrained switching power supplies - balancing VF, trr, and thermal robustness across 50–1000 V voltage grades.
FAQ
What is the maximum junction temperature rating for HS3F M6G?
The HS3F M6G has a maximum junction temperature (TJ MAX) of +150°C and a minimum storage temperature of –55°C. This wide operating range allows deployment in harsh environments such as industrial motor drives and outdoor LED lighting without thermal derating up to 75°C ambient. The HS3F M6G maintains stable VF and IR performance across this full range, validated per JESD22-A108.
Does HS3F M6G meet RoHS and halogen-free requirements?
Yes, HS3F M6G is RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound is UL 94V-0 rated, and terminals are matte tin-plated to J-STD-002 standards. These certifications are documented in Taiwan Semiconductor's official product change notices and material declarations for HS3F M6G.
What is the reverse recovery time (trr) specification for HS3F M6G?
The HS3F M6G has a typical reverse recovery time (trr) of 50 ns under test conditions of IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A. This value is confirmed in the "ELECTRICAL SPECIFICATIONS" table of the HS3A–HS3M datasheet (Version K2102, Page 2). Faster than HS3G–HS3M variants, this trr supports clean switching in >150 kHz SMPS topologies.
Is HS3F M6G suitable for automated SMT assembly?
Yes, HS3F M6G is optimized for automated placement with its DO-214AB (SMC) package, J-STD-020 Level 1 moisture sensitivity (unlimited floor life), and matte tin-plated leads meeting J-STD-002 solderability. The low-profile design and symmetric terminal geometry ensure high placement yield and reliable reflow joint formation in high-volume manufacturing lines.
What is the junction-to-ambient thermal resistance (RθJA) of HS3F M6G?
The HS3F M6G has a typical junction-to-ambient thermal resistance (RθJA) of 60 °C/W under standard JEDEC test conditions (single-layer 1 in² copper pad). This value enables effective passive cooling in compact power modules. Actual board-level RθJA will vary based on PCB copper area, via count, and airflow, but the HS3F M6G's 60 °C/W baseline provides a conservative thermal design anchor.
HS3F M6G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AB, SMC
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 1 V @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 300 V
- Capacitance @ Vr, F:
- 80pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AB (SMC)
- Operating Temperature - Junction:
- -55°C ~ 150°C
HS3F M6G FAQ
1.How can I place an order for HS3F M6G through Aetrix?
Please submit a Request for Quotation (RFQ) for HS3F M6G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HS3F M6G reliable?
The price and inventory of HS3F M6G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HS3F M6G is usually 5 days.
3.What payment methods are accepted for HS3F M6G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HS3F M6G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HS3F M6G?
HS3F M6G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HS3F M6G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HS3F M6G?
For technical support, including HS3F M6G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HS3F M6G requirements.
6.How does Aetrix verify that HS3F M6G is sourced from the original manufacturer or authorized distributors?
All HS3F M6G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HS3F M6G meets industry standards.
7.What is the process for return or replacement of HS3F M6G?
All HS3F M6G units undergo pre-shipment inspection (PSI). If there is an issue with HS3F M6G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HS3F M6G part is unused and in its original packaging.
Return procedure for HS3F M6G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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