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Taiwan Semiconductor Corporation HS3F V7G
- Part No.:
- HS3F V7G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AB, SMC
- Datasheet:
-
HS3F V7G.pdf
- Description:
- DIODE GEN PURP 300V 3A DO214AB
- Quantity:
- Payment:
- Shipping:
Inventory:7,956
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Product details
Overview
HS3F V7G from Taiwan Semiconductor is a 3A, 300V high-efficiency surface-mount silicon rectifier diode in DO-214AB (SMC) package, featuring 1.0V max forward voltage at 3A, 150A peak surge current, and 50ns reverse recovery time - deployed in switching-mode power supplies for telecom infrastructure.
For engineers reviewing the HS3F V7G datasheet, HS3F V7G pinout, HS3F V7G application, or HS3F V7G equivalent, key selection criteria include repetitive peak reverse voltage (300V), thermal resistance (60°C/W), junction temperature range (–55°C to +150°C), moisture sensitivity level (J-STD-020 Level 1), and RoHS/halogen-free compliance.
Technical Context
This device is a single-die, glass-passivated, planar-junction silicon rectifier optimized for high-frequency operation. Its low-profile DO-214AB (SMC) package supports automated placement and meets UL 94V-0 flammability requirements with matte tin-plated leads.
The HS3F V7G delivers fast recovery (trr ≤ 50 ns) and low forward voltage drop (VF ≤ 1.0 V @ 3A, 25°C), enabling high efficiency in DC-DC converters and freewheeling paths where switching losses must be minimized at frequencies up to several hundred kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 300 V - Maximum repetitive reverse voltage the diode blocks without breakdown; defines safe operating window in 24–48V input SMPS front-end rectification. |
| IF | 3 A continuous - Rated average forward current under specified thermal conditions; supports compact heatsinking in space-constrained 30–60W adapters. |
| IFSM | 150 A (8.3ms half-sine) - Peak non-repetitive surge capability; withstands inrush currents during cold-start of industrial power modules. |
| VF | ≤1.0 V @ 3A, 25°C - Low conduction loss reduces power dissipation by ~30% vs. standard 1N54xx series, improving thermal margin in sealed enclosures. |
| trr | ≤50 ns - Fast reverse recovery minimizes switching loss and EMI generation in 100–500 kHz flyback and forward converter topologies. |
| RθJA | 60 °C/W - Junction-to-ambient thermal resistance on standard FR-4 PCB with 1-inch² copper pad; enables derating to 2.1A at 70°C ambient without forced air. |
| TJ Range | –55°C to +150°C - Wide operating junction temperature range supports deployment in automotive under-hood auxiliary supplies and outdoor telecom equipment. |
Pinout & Package
Package: DO-214AB (SMC), surface-mount, cathode-indicated by molded band, matte tin-plated leads, JESD201 Class 2 whisker compliant, weight ≈ 0.210 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Lead 1) | Forward current entry point | Connected to lower-potential side (e.g., transformer secondary center-tap or switch node return); requires adequate copper area for thermal relief. |
| Cathode (Lead 2) | Forward current exit / reverse blocking terminal | Connected to output rail or capacitor positive; cathode band orientation must match PCB silkscreen to prevent assembly error. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Enhances long-term reliability and humidity resistance in humid environments (e.g., base station cabinets), eliminating need for conformal coating in IPC Class 2 applications. |
| Low profile SMC package | Height ≤ 2.6 mm enables use in ultra-thin AC-DC adapters and PoE-powered devices where Z-height is constrained by mechanical housing. |
| J-STD-020 Level 1 MSL | Zero bake requirement before reflow; compatible with standard lead-free reflow profiles (peak 260°C), reducing manufacturing cost and process complexity. |
| RoHS & halogen-free | Complies with IEC 61249-2-21 and EU RoHS Directive 2011/65/EU; suitable for export to EU, Japan, and South Korea without substance-of-concern reporting. |
Applications
| Telecom Switching Power Supplies | Industrial Motor Drive Freewheeling |
|---|---|
Use Scenario: Secondary-side rectification in 48V-input isolated DC-DC modules powering line cards in central office switches. IC Role / Device Role / Timing Role: High-frequency power rectifier converting transformer AC output to regulated 3.3V/5V/12V rails. Use Value: 50ns trr and 1.0V VF reduce switching loss and heat rise, enabling >92% efficiency at full load and extending module lifetime in 24/7 operation. | Use Scenario: Freewheeling path across IGBT gate-drive transformer in servo amplifier output stage. IC Role / Device Role / Timing Role: Clamp diode providing low-loss energy recirculation during IGBT turn-off transitions. Use Value: 150A IFSM handles transient energy spikes from inductive kickback; 60°C/W RθJA allows direct mounting on aluminum heatsink without thermal interface material. |
| Server PSU Hold-Up Circuits | Automotive DC-DC Converters |
Use Scenario: Input rectification in 12V–48V intermediate bus converters maintaining hold-up time during AC mains dropout. IC Role / Device Role / Timing Role: Primary rectifier delivering continuous 3A output under transient overload conditions. Use Value: –55°C to +150°C TJ range ensures stable operation during cold-cranking and under-hood thermal cycling; 300V VRRM provides 2× safety margin over 48V nominal bus. | Use Scenario: Output rectification in 12V–24V bidirectional DC-DC converters for 48V mild-hybrid battery management systems. IC Role / Device Role / Timing Role: Unidirectional power flow control element in buck-boost topology with synchronous rectification disabled. Use Value: Halogen-free and RoHS-compliant construction meets automotive ELV directive; DO-214AB footprint aligns with AEC-Q101 stress-test board layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-efficiency rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-3EYH03-M3/54 | Same DO-214AB package, 3A/300V, VF = 1.05V @ 3A, trr = 55ns, RθJA = 65°C/W | Slightly higher VF and trr; lower thermal performance limits continuous current in high-ambient designs. | Preferred where Vishay supply chain alignment or dual-sourcing is required; verify layout thermal relief matches 65°C/W derating curve. |
| ON Semiconductor MUR330 | DO-201AD (Axial), 3A/300V, VF = 1.15V @ 3A, trr = 50ns, RθJA = 75°C/W | Through-hole package incompatible with SMT lines; higher VF increases conduction loss by ~150mW at 3A. | Only suitable for legacy through-hole designs or prototyping; not recommended for new SMT production due to assembly incompatibility and thermal penalty. |
Compared with VS-3EYH03-M3/54 and MUR330, the HS3F V7G offers superior thermal resistance (60°C/W), lower forward voltage (≤1.0V), and native SMT compatibility - making it optimal for high-density, thermally constrained telecom and industrial power modules requiring long-term reliability without rework.
Availability
HS3F V7G is available at Aetrix Electronics and suitable for telecom power supplies, industrial motor drives, server PSUs, and automotive DC-DC converters requiring stable component supply, consistent parametric performance, and full traceability across production batches.
Supply support for HS3F V7G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated Taiwanese semiconductor manufacturer specializing in discrete power devices, including rectifiers, TVS diodes, and MOSFETs, with ISO/TS 16949 and IATF 16949 certification.
The HS3x series was designed specifically for high-frequency, high-reliability rectification in switching-mode power conversion - targeting cost-sensitive yet thermally demanding applications in communications, computing, and industrial automation.
FAQ
What is the maximum junction temperature rating for HS3F V7G?
The HS3F V7G has a maximum junction temperature (TJ MAX) of +150°C, with a minimum operating temperature of –55°C. This wide range supports deployment in harsh environments such as outdoor telecom base stations and under-hood automotive electronics. The device's thermal performance (RθJA = 60°C/W) allows reliable operation at full 3A current up to 70°C ambient when mounted on a standard 1-inch² copper pad.
Does HS3F V7G meet RoHS and halogen-free requirements?
Yes, HS3F V7G is RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound contains no brominated flame retardants or chlorine-based additives, and all plating materials meet EU RoHS Directive 2011/65/EU restrictions. This makes HS3F V7G suitable for export to regulated markets including the EU, Japan, and South Korea without additional substance declarations.
What is the reverse recovery time (trr) specification for HS3F V7G?
The HS3F V7G has a maximum reverse recovery time (trr) of 50 ns, measured at IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A. This fast recovery characteristic minimizes switching loss and EMI in high-frequency converters operating above 100 kHz. The value is confirmed in the official Taiwan Semiconductor K2102 datasheet and applies specifically to the HS3F variant within the HS3x family.
Is HS3F V7G pin-compatible with other devices in the HS3x series?
Yes, all HS3x devices - including HS3A, HS3B, HS3D, HS3F, HS3G, HS3J, HS3K, and HS3M - share identical DO-214AB (SMC) package dimensions, pinout, and thermal pad layout. The only differences are rated VRRM (50V to 1000V) and associated VF/trr values. This allows design reuse across voltage grades without PCB revision.
What packaging format is used for HS3F V7G?
HS3F V7G is supplied in tape-and-reel format with 3,000 units per reel, compatible with standard SMT pick-and-place equipment. The DO-214AB (SMC) package features matte tin-plated leads that comply with J-STD-002 solderability requirements and JESD201 Class 2 whisker testing. Moisture sensitivity level is J-STD-020 Level 1, meaning no dry-pack or baking is required prior to reflow.
HS3F V7G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AB, SMC
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 300 V
- Capacitance @ Vr, F:
- 80pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AB (SMC)
- Operating Temperature - Junction:
- -55°C ~ 150°C
HS3F V7G FAQ
1.How can I place an order for HS3F V7G through Aetrix?
Please submit a Request for Quotation (RFQ) for HS3F V7G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HS3F V7G reliable?
The price and inventory of HS3F V7G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HS3F V7G is usually 5 days.
3.What payment methods are accepted for HS3F V7G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HS3F V7G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HS3F V7G?
HS3F V7G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HS3F V7G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HS3F V7G?
For technical support, including HS3F V7G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HS3F V7G requirements.
6.How does Aetrix verify that HS3F V7G is sourced from the original manufacturer or authorized distributors?
All HS3F V7G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HS3F V7G meets industry standards.
7.What is the process for return or replacement of HS3F V7G?
All HS3F V7G units undergo pre-shipment inspection (PSI). If there is an issue with HS3F V7G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HS3F V7G part is unused and in its original packaging.
Return procedure for HS3F V7G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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