Taiwan Semiconductor Corporation HS3M

Overview

HS3M from Taiwan Semiconductor is a 3A, 1000V high-efficiency surface-mount silicon rectifier diode in DO-214AB (SMC) package, featuring 1.7V max forward voltage at 3A/25°C, 50µA max reverse leakage at 25°C, and 75ns reverse recovery time - deployed in switching-mode power supplies for telecom infrastructure.

For engineers reviewing the HS3M datasheet, HS3M pinout, HS3M application, or HS3M equivalent, key selection criteria include peak repetitive reverse voltage (1000V), surge current rating (150A), thermal resistance (60°C/W), junction temperature range (–55°C to +150°C), and halogen-free RoHS compliance.

Technical Context

This single-die standard recovery rectifier uses glass-passivated junction technology to achieve stable reverse blocking and low conduction loss under high-frequency switching conditions. Its DO-214AB package supports automated placement and meets J-STD-020 moisture sensitivity level 1.

The device operates across –55°C to +150°C junction temperature range with 60°C/W junction-to-ambient thermal resistance. Reverse recovery time is specified at 75ns under IF = 0.5A, IR = 1.0A, Irr = 0.25A test conditions.

Key Specifications

Pinout & Package

Package: DO-214AB (SMC), surface-mount, matte tin-plated leads, polarity indicated by cathode band, weight ≈ 0.210g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage rectifier applications.

Compared with STTH3L06S and MBR3100CT, the HS3M uniquely delivers 1000V blocking capability in a surface-mount SMC package - enabling compact, high-reliability rectification in next-generation 48V–800V telecom and energy systems where voltage margin and automated assembly are critical.

Availability

HS3M is available at Aetrix Electronics and suitable for telecom power supplies, server PSUs, industrial motor drives, and renewable energy DC-DC converters requiring stable component supply and long-lifecycle support.

Supply support for HS3M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and communications markets since 1979.

The HS3M belongs to TSC's HS3x high-voltage rectifier family, engineered specifically for high-efficiency, high-reliability AC/DC and DC/DC conversion in demanding power electronics applications where voltage headroom and thermal robustness are essential.

FAQ

What is the maximum junction temperature rating for HS3M?

The HS3M has a maximum junction temperature (TJ max) of +150°C, verified per absolute maximum ratings table in the official Taiwan Semiconductor datasheet Version K2102. This rating allows reliable operation in thermally constrained environments such as sealed telecom rectifiers or densely packed server PSUs, provided thermal design maintains junction temperature below this limit during worst-case load and ambient conditions. The HS3M's 60°C/W RθJA supports this performance when mounted on appropriate copper area.

Does HS3M support automated pick-and-place assembly?

Yes, the HS3M is explicitly designed for automated placement, as confirmed in its official features list. Its DO-214AB (SMC) package, matte tin-plated leads, and moisture sensitivity level 1 (per J-STD-020) ensure compatibility with standard SMT reflow processes and high-yield robotic assembly. The low-profile construction and defined marking diagram further facilitate optical recognition and precise placement - critical for high-volume manufacturing of HS3M-based power supplies.

What is the reverse recovery time (trr) specification for HS3M?

The HS3M has a reverse recovery time (trr) of 75ns, measured under IF = 0.5A, IR = 1.0A, and Irr = 0.25A conditions at 25°C, as stated in the Electrical Specifications table of the Taiwan Semiconductor HS3A–HS3M datasheet. This value reflects its standard recovery behavior - optimized for efficiency in 100–300kHz switching applications like telecom SMPS, where moderate trr balances conduction loss and switching loss better than ultrafast or Schottky alternatives.

Is HS3M RoHS and halogen-free compliant?

Yes, the HS3M is RoHS compliant and halogen-free per IEC 61249-2-21, as documented in the Features section of the official Taiwan Semiconductor datasheet. The molding compound meets UL 94V-0 flammability rating, and the device carries no restricted substances above threshold limits. This compliance enables use in environmentally regulated industrial, networking, and consumer electronics products targeting EU, China, and other global markets with strict chemical content requirements.

How does the forward voltage (VF) of HS3M compare across temperature?

The HS3M's forward voltage is specified as 1.7V maximum at IF = 3A and TJ = 25°C; it decreases with rising junction temperature due to the negative temperature coefficient of silicon PN junctions. While the datasheet does not provide a VF vs. TJ curve for HS3M specifically, typical behavior shows ~2.0mV/°C reduction - meaning VF may drop to ~1.5V at TJ = 125°C. This characteristic improves conduction efficiency at elevated temperatures but must be considered alongside derating curves for safe IF operation.