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Microchip Technology HV7361GA-G
- Part No.:
- HV7361GA-G
- Manufacturer:
- Microchip Technology
- Category:
- Power Management - Specialized
- Package:
- 22-TFBGA
- Datasheet:
-
HV7361GA-G.pdf
- Description:
- IC ULTRASOUND DRIVER 22CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:110
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Product details
Overview
HV7361GA-G from Microchip Technology is a high-voltage, high-speed ultrasound pulser IC integrating two-channel ±100V three-level transmit drivers with built-in fast return-to-zero (RTZ) damping FETs and an integrated two-terminal low-noise T/R switch. It delivers ±2.5A minimum pulse current per channel at up to 35 MHz, supports 2.5V/3.3V/5V CMOS logic interface, and is designed for medical ultrasound imaging systems requiring precise bipolar pulsing and receiver protection.
For engineers reviewing the HV7361GA-G datasheet, HV7361GA-G pinout, HV7361GA-G application, or HV7361GA-G equivalent, key selection considerations include its integrated T/R switch performance (±130V breakdown, 15Ω on-resistance, <20 ns switching), matched 2 ns delay times, AC-coupled gate drive architecture eliminating floating supplies, and CABGA-22 package compatibility with high-density transducer array layouts.
Technical Context
The HV7361GA-G implements dual independent high-voltage pulser channels, each comprising P-channel and N-channel MOSFETs with integrated RTZ damping control logic. Its AC-coupled gate driver topology eliminates need for floating bias rails while enabling ±100V output swing with minimal PCB layout complexity.
It integrates a dedicated two-terminal T/R switch that routes transducer signals between transmit and receive paths, featuring ±130V breakdown voltage, 15Ω on-resistance, ±60 mA peak switching current, and sub-20 ns turn-on/turn-off times - all specified under 50Ω load and 100 MHz small-signal bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Range | 0 V to ±100 V - enables full-scale bipolar excitation of piezoelectric transducers without external level-shifting circuitry |
| Pulse Current Capability | ±2.5 A minimum per channel - sufficient to drive low-impedance transducer loads in high-resolution medical imaging |
| Operating Frequency | Up to 35 MHz - supports high-frequency ultrasound modes including harmonic imaging and elastography |
| Delay Matching | 2 ns matched delay times (channel-to-channel) - ensures precise timing alignment critical for beamforming accuracy |
| T/R Switch On-Resistance | 15 Ω typical - minimizes signal attenuation and insertion loss between transducer and LNA during receive mode |
| Logic Interface Voltage | 2.5 V / 3.3 V / 5 V CMOS compatible - allows direct interfacing with FPGA or ASIC controller I/O banks without level translation |
| Package Type | 22-ball CABGA (5 mm × 7 mm) - compact footprint optimized for multi-channel probe PCB stacking and thermal management |
Pinout & Package
Package: 22-ball Chip Array Ball Grid Array (CABGA), 5 mm × 7 mm body, 0.5 mm pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Driver ground reference | Common return path for logic, level translator, and gate drive circuits; must connect to low-impedance system ground plane |
| VDD, VH, VSS, VL1–VL3 | Power supply terminals | VDD/VH = +10 V gate drive high-side; VSS/VL1–VL3 = 0 V gate drive low-side; decoupling required between VH and VL3 (0.22 µF) |
| INA, INB, INC, IND | CMOS logic inputs | Control P-FET1/N-FET1 (INA/INB) and P-FET2/N-FET2 (INC/IND); support 2.5–5 V logic levels with ≤1 µA input current |
| PE | Power enable input | Active-high enable (1.7–5.25 V) controlling global device power state; defines safe power-up/down sequencing |
| SP1, DP1, DN1, SN1 SP2, DP2, DN2, SN2 |
High-voltage output terminals | Source/drain connections for dual-channel P/N-FET pairs; SPx/SNx supply ±100 V; DPx/DNx deliver pulsed outputs to transducer |
| XDCR, RX | T/R switch terminals | XDCR = transducer node; RX = receiver LNA input; internal switch connects them only during receive mode (PE active, logic idle) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated T/R switch | Two-terminal architecture with ±130 V breakdown, 15 Ω RSW, and <20 ns switching - eliminates discrete diode/T/R module, reduces BOM count and parasitic capacitance |
| AC-coupled gate drive | Removes need for floating ±100 V bias rails and associated decoupling capacitors - simplifies power supply design and improves layout reliability |
| Matched propagation delay | ±2 ns device-to-device and 2 ns channel-to-channel matching - enables coherent multi-channel beam synthesis without external calibration |
| Low quiescent current | 50 µA VDD current (PE = 0), 1 mA (PE = 1) - extends battery life in portable ultrasound handheld systems |
| Robust thermal design | θJA = 106 °C/W in CABGA-22 package - supports continuous operation at TA = –40°C to +85°C with standard PCB copper pour |
Applications
| Medical Ultrasound Imaging | Piezoelectric Transducer Drivers |
|---|---|
Use Scenario: High-resolution B-mode and Doppler imaging in portable and cart-based diagnostic systems. IC Role / Device Role / Timing Role: Dual-channel three-level pulser generating precisely timed ±100 V, ±2.5 A excitation bursts synchronized to echo acquisition windows. Use Value: Integrated T/R switch protects sensitive LNA inputs from high-voltage transmit pulses while minimizing signal path discontinuity during receive. |
Use Scenario: Driving low-impedance (<50 Ω), high-capacitance (>1 nF) piezoceramic elements in therapeutic ultrasound and focused ultrasound surgery (FUS). IC Role / Device Role / Timing Role: High-current, high-slew-rate pulser delivering controlled bipolar waveforms with sub-10 ns rise/fall times and matched delays. Use Value: AC-coupled architecture eliminates floating supplies, reducing system cost and improving long-term reliability in sealed transducer housings. |
| Ultrasound Industrial NDT | Pulse Waveform Generator |
Use Scenario: Non-destructive testing of composite materials, welds, and castings using phased-array probes. IC Role / Device Role / Timing Role: Multi-channel transmit driver enabling electronic beam steering and focusing via time-delayed pulsing across 16–64 elements. Use Value: 35 MHz operating frequency and 2 ns delay matching support high-frequency inspection (>10 MHz) with sub-millimeter resolution. |
Use Scenario: Programmable arbitrary waveform generation for research-grade acoustic characterization and material property analysis. IC Role / Device Role / Timing Role: Precision high-voltage pulse source with configurable logic-controlled output states (positive, negative, zero) and RTZ damping. Use Value: Built-in damping FETs suppress ringing after pulse termination, ensuring clean waveform edges and accurate time-of-flight measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage ultrasound pulser applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HV7360GA-G | No integrated T/R switch; identical pulser core, pinout, and electrical specs except missing XDCR/RX terminals | Suitable only when external T/R switching (e.g., diode-based or discrete FET) is implemented separately | Select HV7360GA-G if system already includes robust external T/R protection and board space is constrained |
| QSC7361 (Qorvo) | Same 22-pin CABGA footprint and ±100 V/±2.5 A rating but uses different logic mapping and lacks PE enable; higher 3.5 mA IDDQ | Requires redesign of control interface and power sequencing; no integrated T/R switch | Consider QSC7361 only for drop-in replacement where existing firmware supports alternate timing and no T/R integration is needed |
Compared with HV7360GA-G, HV7361GA-G adds essential T/R functionality without increasing board area or power supply complexity; versus QSC7361, it offers superior integration, lower quiescent current, and guaranteed timing matching - making it optimal for new medical and industrial ultrasound designs requiring compact, reliable transmit/receive switching.
Availability
HV7361GA-G is available at Aetrix Electronics and suitable for medical ultrasound imaging systems, industrial NDT equipment, and piezoelectric transducer driver modules requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for HV7361GA-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog, FPGA, and connectivity solutions, with deep expertise in high-reliability mixed-signal ICs for medical, automotive, and industrial markets.
HV7361GA-G belongs to Microchip's high-voltage ultrasound pulser family, engineered specifically for portable and high-channel-count ultrasound systems needing integrated T/R switching, low-power operation, and precision timing control.
FAQ
What is the maximum operating frequency supported by HV7361GA-G?
HV7361GA-G supports operation up to 35 MHz, verified under load conditions of CLOAD = 330 pF and RLOAD = 2.5 kΩ. This frequency capability enables use in high-resolution ultrasound imaging, including harmonic and contrast-enhanced modes, while maintaining <10 ns rise/fall times and tight channel-to-channel delay matching.
Does HV7361GA-G require external floating power supplies for its high-voltage outputs?
No, HV7361GA-G uses an AC-coupled gate driver architecture that eliminates the need for floating ±100 V bias rails. The device operates from single-ended VH (+10 V) and VSS (0 V) supplies, significantly simplifying power design and reducing component count compared to traditional DC-coupled pulsers.
How does the integrated T/R switch in HV7361GA-G protect the receiver front-end?
The HV7361GA-G T/R switch provides ±130 V breakdown voltage and isolates the LNA input (RX) from transducer (XDCR) during transmit, limiting leakage to ±300 µA at ±130 V. With 15 Ω on-resistance and <20 ns switching, it ensures minimal signal loss and fast transition into low-noise receive mode.
What is the recommended power-up sequence for HV7361GA-G?
The recommended power-up sequence for HV7361GA-G is: (1) apply VLL (logic supply), (2) apply VDD, VH, VSS, and VL with logic inputs low, (3) apply ±100 V high-voltage supplies (VPP/VNN), then (4) assert PE high. This sequence minimizes inrush current and ensures proper initialization of internal level translators and gate drivers.
Is HV7361GA-G pin-compatible with HV7360GA-G?
HV7361GA-G is not fully pin-compatible with HV7360GA-G: while both share identical 22-ball CABGA footprint and 19 common signal/power pins, HV7361GA-G replaces two NC pads (G4 and P5) with XDCR and RX terminals for its integrated T/R switch - requiring PCB layout revision for migration.
HV7361GA-G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 22-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Pulse Generator
- Current - Supply:
- 50µA
- Voltage - Supply:
- 4.75V ~ 11V
- Operating Temperature:
- -20°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 22-CABGA (5x7)
HV7361GA-G FAQ
1.How can I place an order for HV7361GA-G through Aetrix?
Please submit a Request for Quotation (RFQ) for HV7361GA-G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HV7361GA-G reliable?
The price and inventory of HV7361GA-G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HV7361GA-G is usually 5 days.
3.What payment methods are accepted for HV7361GA-G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HV7361GA-G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HV7361GA-G?
HV7361GA-G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HV7361GA-G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HV7361GA-G?
For technical support, including HV7361GA-G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HV7361GA-G requirements.
6.How does Aetrix verify that HV7361GA-G is sourced from the original manufacturer or authorized distributors?
All HV7361GA-G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HV7361GA-G meets industry standards.
7.What is the process for return or replacement of HV7361GA-G?
All HV7361GA-G units undergo pre-shipment inspection (PSI). If there is an issue with HV7361GA-G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HV7361GA-G part is unused and in its original packaging.
Return procedure for HV7361GA-G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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