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Infineon Technologies IDD09SG60CXTMA1
- Part No.:
- IDD09SG60CXTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IDD09SG60CXTMA1.pdf
- Description:
- DIODE SIL CARB 600V 9A TO252-3
- Quantity:
- Payment:
- Shipping:
Inventory:5,336
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Product details
Overview
IDD09SG60CXTMA1 from Infineon Technologies is a 3rd-generation thinQ!™ silicon carbide (SiC) Schottky diode rated for 600 V repetitive peak reverse voltage and 9 A continuous forward current at TC < 130 °C, with zero reverse recovery charge and temperature-independent switching behavior-designed for high-efficiency CCM PFC stages in server PSUs and telecom rectifiers.
For engineers reviewing the IDD09SG60CXTMA1 datasheet, IDD09SG60CXTMA1 pinout, IDD09SG60CXTMA1 application, or IDD09SG60CXTMA1 equivalent, key selection criteria include its 15 nC capacitive charge, 1.3 K/W junction-to-case thermal resistance, 2.2 V forward voltage at 9 A/150 °C, 50 V/ns dv/dt ruggedness, and PG-TO252-3 package compatibility with high-power SMD layouts.
Technical Context
This SiC Schottky diode eliminates minority-carrier injection, resulting in no reverse recovery time (trr) and no forward recovery-enabling clean, lossless turn-off in hard-switched topologies. Its capacitive switching behavior is defined by QC = 15 nC and C = 35 pF at VR = 600 V, f = 1 MHz.
Thermal performance is optimized for high ambient operation: RthJC = 1.3 K/W enables 115 W power dissipation at TC = 25 °C, while surge capability reaches 400 A (10 µs) and 49 A (10 ms) under defined test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - supports 400 V DC-link designs with 50% safety margin in industrial PFC and solar inverters |
| IF (cont.) | 9 A @ TC < 130 °C - enables compact heatsinking in space-constrained 1–3 kW AC/DC converters |
| VF | 2.2 V @ 9 A, 150 °C - low conduction loss improves efficiency at full load and elevated temperature |
| QC | 15 nC - defines capacitive turn-off energy; enables predictable snubber design in ZVS/ZCS circuits |
| RthJC | 1.3 K/W - allows direct thermal path to heatsink; supports >100 W/cm² power density in TO252 layout |
| dv/dt | 50 V/ns - withstands fast voltage transients in high-frequency bridge legs without spurious turn-on |
| IF,max | 400 A @ 10 µs - handles short-circuit stress in UPS and motor drive clamp circuits |
Pinout & Package
Package: PG-TO252-3 (DPAK), surface-mount, thermally enhanced with exposed drain pad. Pin 1: n.c., Pin 2: Anode (A), Pin 3: Cathode (C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | No connection | Electrically isolated; must not be soldered or tied to any net to avoid parasitic coupling |
| Pin 2 | Anode | Connects to AC input or switching node side; carries full forward current during conduction |
| Pin 3 | Cathode | Connected to DC bus or output rail; serves as primary thermal interface via exposed copper pad |
Key Features
| Feature | Design Value |
|---|---|
| Zero reverse recovery charge (Qrr = 0) | Eliminates switching losses and EMI from tail current in hard-switched PFC and LLC resonant converters |
| Temperature-stable VF and QC | Forward voltage rise from 25 °C to 150 °C is only +0.4 V, enabling consistent loss budgeting across operating range |
| High dv/dt ruggedness (50 V/ns) | Prevents false triggering in high-side half-bridge configurations with fast gate drivers |
| Low RthJC (1.3 K/W) | Enables direct mounting to copper pour or heatsink without thermal interface material in many mid-power applications |
| JEDEC-qualified reliability | Validated per J-STD-20 and JESD22 for automotive-adjacent industrial use, including reflow and humidity exposure |
Applications
| Server & Telecom PSU | Solar String Inverter |
|---|---|
Use Scenario: Continuous Conduction Mode (CCM) boost PFC stage in 2–3 kW front-end rectifiers. IC Role / Device Role / Timing Role: Unidirectional freewheeling diode in active boost switch leg; conducts during MOSFET off-time. Use Value: Zero Qrr reduces total switching loss by ~35% vs. Si FRD, improving system efficiency from 95.2% to 96.4% at full load. | Use Scenario: DC link clamping and freewheeling in 1000 V-class string inverters with dual MPPT inputs. IC Role / Device Role / Timing Role: High-voltage output rectifier in H-bridge inverter leg; blocks 600 V reverse while conducting 9 A RMS. Use Value: 150 °C max junction rating and stable VF allow derating-free operation in desert-mounted enclosures with ambient up to 70 °C. |
| Industrial UPS | EV Onboard Charger (OBC) |
Use Scenario: Bidirectional IGBT clamp diode in double-conversion UPS inverters handling 480 VAC output. IC Role / Device Role / Timing Role: Snubber-assisted freewheeling path during IGBT turn-off; absorbs inductive energy from transformer leakage. Use Value: 400 A non-repetitive surge rating withstands fault currents during grid-spike events without degradation. | Use Scenario: Secondary-side synchronous rectification in 6.6 kW OBC LLC resonant converter. IC Role / Device Role / Timing Role: High-frequency rectifier replacing Si Schottky; operates at 200–500 kHz with minimal capacitive loss. Use Value: 35 pF capacitance at 600 V enables low displacement current, reducing gate driver loading and EMI filter size. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D09060E (Wolfspeed) | Same 600 V/9 A rating; QC = 14.5 nC; RthJC = 1.4 K/W; TO252-2 package (no Pin 1 n.c.) | Lacks isolated Pin 1; requires PCB layout revision to remove unused pad connection | Preferred where JEDEC MSL1 reflow compliance is secondary to lowest QC and legacy footprint reuse |
| STPSC9H065 (STMicroelectronics) | 650 V rating; VF = 2.3 V @ 9 A/150 °C; QC = 17 nC; RthJC = 1.5 K/W | Higher voltage margin but higher conduction loss and thermal resistance | Selected when 650 V blocking is required for future-proofing 400 V DC-link systems |
Compared with C3D09060E and STPSC9H065, IDD09SG60CXTMA1 offers the lowest thermal resistance (1.3 K/W) and integrated n.c. pin for noise isolation-making it optimal for high-density, thermally constrained PFC modules where layout stability and EMI control are critical.
Availability
IDD09SG60CXTMA1 is available at Aetrix Electronics and suitable for server power supplies, solar string inverters, and industrial UPS systems requiring stable component supply, JEDEC-qualified reliability, and high-temperature SiC performance.
Supply support for IDD09SG60CXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy infrastructure markets.
IDD09SG60CXTMA1 belongs to Infineon's thinQ!™ 3rd-generation SiC Schottky diode product line, engineered specifically for high-frequency, high-efficiency power conversion in CCM PFC, solar inverters, and UPS systems where zero-recovery loss and thermal robustness are mandatory.
FAQ
What is the maximum allowable junction temperature for IDD09SG60CXTMA1?
The absolute maximum junction temperature is 175 °C, validated across all electrical and thermal specifications. Operation up to this limit is supported by the device's temperature-independent switching characteristics and guaranteed RthJC of 1.3 K/W. Derating curves in the datasheet confirm 9 A continuous current remains valid at TC = 130 °C, corresponding to Tj ≈ 175 °C under typical heatsink conditions.
Does IDD09SG60CXTMA1 require a gate resistor or snubber network?
No gate resistor is needed-it is a passive diode with no control terminal. A snubber is optional and typically unnecessary due to zero reverse recovery and low stored charge; however, an RC snubber may still be used to damp ringing from stray inductance in high-di/dt layouts. The 50 V/ns dv/dt rating ensures immunity to false turn-on without external protection.
Can IDD09SG60CXTMA1 replace a silicon fast recovery diode in an existing PFC design?
Yes, with layout verification: the PG-TO252-3 footprint matches standard DPAK pads, but Pin 1 is n.c. and must remain unconnected. Thermal design must account for lower VF (reduced conduction loss) and absence of trr (eliminated switching loss), which typically lowers overall die temperature by 15–25 °C-allowing potential heatsink downsizing or increased power density.
Is IDD09SG60CXTMA1 compliant with RoHS and REACH regulations?
Yes-IDD09SG60CXTMA1 features Pb-free lead plating and is fully RoHS compliant per EU Directive 2011/65/EU. It also meets REACH SVHC requirements with no substances of very high concern above threshold limits. Full compliance documentation, including test reports and declarations of conformity, is available through Infineon's official product portal and Aetrix Electronics' quality archive.
IDD09SG60CXTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™+
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 9A
- Voltage - Forward (Vf) (Max) @ If:
- 2.1 V @ 9 A
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 80 µA @ 600 V
- Capacitance @ Vr, F:
- 280pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3
- Operating Temperature - Junction:
- -55°C ~ 175°C
IDD09SG60CXTMA1 FAQ
1.How can I place an order for IDD09SG60CXTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDD09SG60CXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDD09SG60CXTMA1 reliable?
The price and inventory of IDD09SG60CXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDD09SG60CXTMA1 is usually 5 days.
3.What payment methods are accepted for IDD09SG60CXTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDD09SG60CXTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDD09SG60CXTMA1?
IDD09SG60CXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDD09SG60CXTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDD09SG60CXTMA1?
For technical support, including IDD09SG60CXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDD09SG60CXTMA1 requirements.
6.How does Aetrix verify that IDD09SG60CXTMA1 is sourced from the original manufacturer or authorized distributors?
All IDD09SG60CXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDD09SG60CXTMA1 meets industry standards.
7.What is the process for return or replacement of IDD09SG60CXTMA1?
All IDD09SG60CXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDD09SG60CXTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDD09SG60CXTMA1 part is unused and in its original packaging.
Return procedure for IDD09SG60CXTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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