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Infineon Technologies IDK06G65C5XTMA1
- Part No.:
- IDK06G65C5XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IDK06G65C5XTMA1.pdf
- Description:
- DIODE SIL CARB 650V 6A TO263-2
- Quantity:
- Payment:
- Shipping:
Inventory:8,619
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Product details
Overview
IDK06G65C5XTMA1 from Infineon is a 650 V, 6 A silicon carbide Schottky diode in PG-TO263-2 package, featuring zero reverse recovery charge, 10 nC capacitive charge at 400 V, 2.1 µJ stored energy, and operation up to 175 °C junction temperature. It serves as a high-efficiency freewheeling or output rectifier in high-frequency SMPS and PFC stages.
For engineers reviewing the IDK06G65C5XTMA1 datasheet, IDK06G65C5XTMA1 pinout, IDK06G65C5XTMA1 application, or IDK06G65C5XTMA1 equivalent, key selection criteria include its 650 V VRRM, 1.5–2.2 V forward voltage across -55 °C to 150 °C, 1.5 K/W typical RthJC, surge capability of 54 A (10 ms), and SiC-specific benefits like temperature-independent switching and low EMI.
Technical Context
This 5th-generation thinQ!™ SiC Schottky diode uses Infineon's diffusion-soldered thin-wafer process to achieve lower QC × VF figure of merit versus prior generations. Its unipolar conduction eliminates minority-carrier storage, enabling true zero reverse recovery and stable switching behavior across -55 °C to 175 °C.
The device is optimized for co-packaging with 650 V CoolMOS™ MOSFETs in high-density power converters. Its 100 V/ns dv/dt ruggedness and 14 A²s i²t rating support robust operation under fast transient and surge conditions without snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 650 V - Maximum repetitive reverse blocking voltage; enables use in 400 V AC input PFC and 380 V DC bus systems. |
| IF | 6 A continuous - Rated at TC < 145 °C; supports 100 W–200 W converter output stages with minimal heatsinking. |
| QC | 10 nC at VR = 400 V - Low capacitive charge reduces turn-off losses and EMI in >100 kHz topologies. |
| VF | 1.5–2.2 V - Forward voltage range over full temperature and current range; enables higher efficiency than Si diodes at elevated temperatures. |
| RthJC | 1.5 K/W typ - Enables direct thermal coupling to PCB copper; supports compact thermal design with 6 cm² cooling area. |
| IF,SM | 54 A (10 ms, TC = 25 °C) - High surge rating allows reliable inrush handling in UPS and solar inverter DC-link protection. |
| EC | 2.1 µJ at VR = 400 V - Stored capacitive energy directly impacts turn-off loss and ringing; low value improves hard-switching performance. |
Pinout & Package
PG-TO263-2 (D²PAK) package with isolated tab; cathode-connected tab provides low-inductance, high-current path to PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode | Main current return path; electrically connected to exposed metal tab for thermal and electrical conduction to PCB. |
| Pin 2 | Anode | Forward current entry point; designed for low-inductance layout in high-di/dt applications. |
| Pin 3 | Not applicable | No internal connection; mechanical pad only - not used for electrical function or thermal path. |
Key Features
| Feature | Design Value |
|---|---|
| Zero reverse recovery charge (Qrr = 0) | Eliminates switching losses and associated EMI in hard-switched converters; no need for snubber networks. |
| Temperature-stable VF and switching | Forward voltage drift <±10% from -55 °C to 150 °C; enables predictable loss budgeting across ambient extremes. |
| High dv/dt ruggedness (100 V/ns) | Withstands rapid voltage transients during MOSFET commutation without false triggering or avalanche failure. |
| RoHS-compliant Pb-free plating | Meets global environmental compliance requirements; compatible with standard lead-free reflow profiles (peak ≤ 260 °C). |
| JEDEC-qualified reliability | Validated per J-STD-20 and JESD22 for automotive and industrial applications; includes 10 ms avalanche stress testing. |
Applications
| Server SMPS Rectification | Solar Inverter Boost Stage |
|---|---|
Use Scenario: Output rectification in 1U 1 kW server PSU operating at 200 kHz with 380 V DC bus. IC Role / Device Role / Timing Role: Freewheeling diode in synchronous rectified LLC resonant converter; handles 6 A average forward current with peak 291 A surges. Use Value: Reduces conduction + switching losses by 35% vs. Si FRD; lowers heatsink volume by 40% and eliminates snubber components. | Use Scenario: Boost diode in string-level solar inverter with 1000 V PV input and 600 V DC-link. IC Role / Device Role / Timing Role: Unidirectional energy transfer element in interleaved boost stage; blocks 650 V reverse while conducting 6 A continuous at 65 °C ambient. Use Value: Enables >98.5% peak efficiency at 50 kHz; withstands 100 V/ns voltage transients during MOSFET turn-off without oscillation. |
| PFC Front-End Diode | UPS DC-Link Protection |
Use Scenario: Fast-recovery diode in 3.3 kW active PFC stage with 220 V AC input and 400 V DC output. IC Role / Device Role / Timing Role: Output rectifier in continuous conduction mode (CCM) boost converter; operates at 65 °C case temperature with D = 0.5 duty cycle. Use Value: Delivers 1.8 V VF at 6 A and 150 °C junction, reducing thermal stress on heatsink and improving system MTBF by 2.3×. | Use Scenario: DC-link clamping diode in online double-conversion UPS handling 10 kVA load with battery backup. IC Role / Device Role / Timing Role: Bidirectional surge limiter during grid-to-battery transition; absorbs 54 A/10 ms surge events without degradation. Use Value: Survives >10⁵ surge cycles per JEDEC qualification; eliminates need for parallel Si diodes or external TVS devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D06065A (Wolfspeed) | Same 650 V/6 A rating; 12 nC QC, 1.7–2.3 V VF; TO-220AC package with non-isolated tab. | Higher thermal resistance (RthJC = 2.5 K/W); requires larger heatsink footprint in SMD layouts. | Prefer when through-hole mounting or legacy TO-220 footprint compatibility is required. |
| STPSC6H065 (STMicroelectronics) | 650 V/6 A; 11 nC QC, 1.6–2.1 V VF; same PG-TO263-2 package but with different marking and thermal pad layout. | Lower surge rating (IF,SM = 42 A @ 10 ms); less margin in high-inrush UPS designs. | Prefer when cost sensitivity outweighs surge margin needs and ST ecosystem integration is prioritized. |
Compared with C3D06065A and STPSC6H065, IDK06G65C5XTMA1 offers the lowest QC (10 nC) and best thermal resistance (1.5 K/W typ), making it optimal for space-constrained, high-frequency, high-reliability SMPS and solar inverters where thermal headroom and EMI control are critical.
Availability
IDK06G65C5XTMA1 is available at Aetrix Electronics and suitable for server SMPS rectification, solar inverter boost stages, and PFC front-end diode applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for IDK06G65C5XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with leadership in silicon carbide and gallium nitride technologies since 2001.
IDK06G65C5XTMA1 belongs to Infineon's thinQ!™ Generation 5 SiC Schottky diode product line, engineered specifically to complement 650 V CoolMOS™ MOSFETs in high-efficiency, high-power-density AC-DC and DC-DC converters.
FAQ
Is IDK06G65C5XTMA1 pin-compatible with previous-generation Infineon SiC diodes?
No. IDK06G65C5XTMA1 uses the PG-TO263-2 package with Pin 1 = Cathode and Pin 2 = Anode, but earlier thinQ!™ G3/G4 variants (e.g., IDK06G65C3) share the same pinout. However, G5 introduces thinner wafer and revised metallization - thermal and electrical performance differ, so layout and thermal design must be revalidated.
What is the maximum recommended PCB copper area for thermal management?
Infineon specifies 6 cm² of 70 µm-thick copper on FR4 for optimal thermal performance. With this layout, RthJA drops to 35 K/W, enabling 6 A continuous operation at TC ≤ 145 °C. Smaller copper areas increase thermal resistance proportionally - e.g., minimal footprint yields RthJA ≈ 62 K/W.
Does IDK06G65C5XTMA1 require a gate driver or external bias circuit?
No. As a passive Schottky diode, IDK06G65C5XTMA1 has no gate terminal and requires no drive circuitry. It conducts when anode voltage exceeds cathode voltage by ≥1.5 V and blocks when reverse biased up to 650 V. Its unipolar nature eliminates control complexity inherent in active switches.
Can IDK06G65C5XTMA1 be used in parallel configurations?
Yes, but with strict layout symmetry. Parallel operation requires matched trace lengths, identical thermal vias, and shared copper pour to ensure current sharing within ±10%. Infineon confirms stable parallel behavior due to positive VF temperature coefficient, but derating to 5.4 A per device is advised for 2-unit parallel setups.
IDK06G65C5XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™+
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 650 V
- Current - Average Rectified (Io):
- 6A
- Voltage - Forward (Vf) (Max) @ If:
- 1.8 V @ 6 A
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 1.1 mA @ 650 V
- Capacitance @ Vr, F:
- 190pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-2
- Operating Temperature - Junction:
- -55°C ~ 175°C
IDK06G65C5XTMA1 FAQ
1.How can I place an order for IDK06G65C5XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDK06G65C5XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDK06G65C5XTMA1 reliable?
The price and inventory of IDK06G65C5XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDK06G65C5XTMA1 is usually 5 days.
3.What payment methods are accepted for IDK06G65C5XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDK06G65C5XTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDK06G65C5XTMA1?
IDK06G65C5XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDK06G65C5XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDK06G65C5XTMA1?
For technical support, including IDK06G65C5XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDK06G65C5XTMA1 requirements.
6.How does Aetrix verify that IDK06G65C5XTMA1 is sourced from the original manufacturer or authorized distributors?
All IDK06G65C5XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDK06G65C5XTMA1 meets industry standards.
7.What is the process for return or replacement of IDK06G65C5XTMA1?
All IDK06G65C5XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IDK06G65C5XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDK06G65C5XTMA1 part is unused and in its original packaging.
Return procedure for IDK06G65C5XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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