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Infineon Technologies IDL10G65C5XUMA2
- Part No.:
- IDL10G65C5XUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- 4-PowerTSFN
- Datasheet:
-
IDL10G65C5XUMA2.pdf
- Description:
- DIODE SIL CARB 650V 10A VSON-4
- Quantity:
- Payment:
- Shipping:
Inventory:151
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Product details
Overview
IDL10G65C5XUMA2 from Infineon is a 650 V, 10 A silicon carbide Schottky diode in PG-VSON-4 (ThinPAK 8x8) package, featuring zero reverse recovery, 1.5–1.7 V forward voltage at 10 A/25°C, 15 nC capacitive charge at 400 V, and rated for continuous operation up to 150°C junction temperature - deployed in high-frequency PFC stages of solar inverters and UPS systems.
For engineers reviewing the IDL10G65C5XUMA2 datasheet, IDL10G65C5XUMA2 pinout, IDL10G65C5XUMA2 application, or IDL10G65C5XUMA2 equivalent, this SiC diode delivers verified avalanche ruggedness (10 ms), JEDEC-qualified reliability, thermal resistance RthJC = 0.8–1.1 K/W, and RoHS-compliant Pb-free plating - critical for thermally constrained, high-efficiency power conversion designs.
Technical Context
This 5th-generation thinQ!™ SiC Schottky diode uses Infineon's diffusion-soldered thin-wafer process to achieve lower QC × VF figure-of-merit and improved thermal performance versus prior generations. Its unipolar conduction eliminates minority-carrier storage, enabling true zero-recovery behavior across –55°C to 150°C.
The device is optimized as a complementary high-voltage freewheeling or boost diode for 650 V CoolMOS™-based topologies. It sustains 650 V repetitive peak reverse voltage (VRRM) with <180 µA reverse leakage at 650 V/25°C and withstands 100 V/ns dv/dt without spurious turn-on.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 650 V - supports full 650 V bus designs without derating in PFC or inverter DC-link applications |
| IF (continuous) | 10 A at TC < 125°C - enables compact heatsinking in high-power-density SMPS |
| VF | 1.5–1.7 V @ 10 A, 25°C - reduces conduction loss vs. Si counterparts, improving system efficiency |
| QC | 15 nC @ VR = 400 V - minimizes switching loss during high-frequency hard-switching transitions |
| RthJC | 0.8–1.1 K/W - allows direct thermal coupling to PCB copper, simplifying thermal design |
| IF,SM | 50 A @ tp = 10 ms, TC = 25°C - handles line surges and inrush currents in industrial UPS |
| dv/dt ruggedness | 100 V/ns - ensures robust operation in fast-switching GaN/CoolMOS™ half-bridges |
Pinout & Package
IDL10G65C5XUMA2 is housed in PG-VSON-4 (ThinPAK 8x8) surface-mount package with exposed drain pad for low-inductance, high-current routing and enhanced thermal transfer to PCB copper area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | No connect | Internally unconnected; must remain floating or grounded per layout guidelines |
| Pin 2 | No connect | Internally unconnected; no electrical function or thermal path |
| Pin 3 | Anode | Main current entry point; bonded to die anode metallization |
| Pin 4 | Anode | Parallel anode terminal for reduced bond wire inductance and current sharing |
| Pin 5 | Cathode | Drain-side cathode connection; tied to exposed thermal pad for low RthJC |
Key Features
| Feature | Design Value |
|---|---|
| Zero reverse recovery charge (Qrr = 0) | Eliminates switching losses and EMI spikes associated with Si diode tail current |
| Temperature-independent switching | Enables stable timing and loss behavior across –55°C to 150°C ambient range |
| Avalanche-rated (10 ms test) | Guarantees safe single-pulse energy handling without degradation under overvoltage stress |
| Optimized for high-temp operation | Rated for continuous 150°C junction temperature - supports sealed or convection-limited enclosures |
| RoHS-compliant Pb-free plating | Meets global environmental compliance requirements without sacrificing solder joint reliability |
Applications
| Solar Inverter Boost Stage | Server PSU PFC Module |
|---|---|
Use Scenario: High-efficiency DC-DC boost stage operating at 100 kHz with 1000 V DC-link voltage. IC Role / Device Role / Timing Role: Freewheeling diode in interleaved boost converter, conducting 10 A RMS with minimal voltage overshoot. Use Value: 15 nC QC and 1.7 V VF at 150°C reduce switching + conduction losses by >35% vs. Si FRD. | Use Scenario: Active PFC front-end in 3 kW telecom rectifier with forced-air cooling. IC Role / Device Role / Timing Role: Output rectifier in continuous conduction mode (CCM) boost converter. Use Value: Zero Qrr eliminates snubber requirements and cuts EMI filter size by 40%. |
| Industrial UPS Inverter Bridge | EV Charger Onboard PFC |
Use Scenario: Bidirectional DC-AC inverter stage in 10 kVA uninterruptible power supply. IC Role / Device Role / Timing Role: Anti-parallel diode for 650 V IGBTs, handling regenerative braking current. Use Value: 50 A surge rating and 100 V/ns dv/dt ruggedness prevent false triggering during fast IGBT commutation. | Use Scenario: Single-phase 7.4 kW onboard charger with 96% target efficiency. IC Role / Device Role / Timing Role: High-frequency boost diode synchronized with 650 V CoolMOS™ switches. Use Value: Matching 650 V rating and thermal profile with CoolMOS™ C7 enables unified thermal management and layout optimization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D10065A (Wolfspeed) | Same 650 V/10 A rating; TO-220AC package; higher RthJC (1.5 K/W); VF = 1.8 V @ 10 A/25°C | Requires mechanical mounting and isolated heatsink; less suitable for ultra-thin SMD designs | Choose for legacy through-hole compatibility or when higher surge margin (60 A) is prioritized over board space |
| STPSC10H065D (STMicroelectronics) | 650 V/10 A; D2PAK package; QC = 18 nC; VF = 1.6 V @ 10 A/25°C; RthJC = 1.0 K/W | Larger footprint; slightly higher switching loss but broader distributor availability | Prefer when dual sourcing is required and thermal budget allows 0.2 K/W higher RthJC |
Compared with C3D10065A and STPSC10H065D, IDL10G65C5XUMA2 offers the lowest RthJC (0.8 K/W) and smallest SMD footprint (ThinPAK 8x8), making it optimal for space-constrained, high-power-density PFC modules where thermal coupling to PCB is critical.
Availability
IDL10G65C5XUMA2 is available at Aetrix Electronics and suitable for solar inverter boost stages, server PSU PFC modules, and industrial UPS inverter bridges requiring stable component supply, long-term lifecycle support, and JEDEC-qualified reliability.
Supply support for IDL10G65C5XUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with leadership in silicon carbide and gallium nitride technologies.
IDL10G65C5XUMA2 belongs to Infineon's thinQ!™ 5th-generation SiC Schottky diode product line, engineered specifically to complement 650 V CoolMOS™ power transistors in high-efficiency, high-frequency AC-DC and DC-DC conversion systems.
FAQ
Is IDL10G65C5XUMA2 avalanche-rated?
Yes. The device is tested per JESD22-A101 and J-STD-020 for non-repetitive avalanche energy under 10 ms pulse conditions at rated current and voltage. This qualification ensures reliable operation during transient overvoltage events in PFC and inverter circuits without degradation.
What is the maximum recommended PCB copper area for thermal performance?
The datasheet specifies optimal thermal performance with a 6 cm² copper area on a 40 mm × 40 mm × 1.5 mm FR4 PCB (70 µm copper thickness) connected to the exposed cathode pad. Larger copper areas improve RthJA, but diminishing returns occur beyond 12 cm² due to convection limits in still-air conditions.
Can IDL10G65C5XUMA2 replace standard silicon diodes directly?
No direct drop-in replacement is guaranteed. While pin-compatible in ThinPAK layout, its zero Qrr changes snubber and gate-drive dynamics. Layout must minimize stray inductance, and gate resistors may require adjustment to manage dV/dt-induced oscillations in adjacent switches.
Does the device require special soldering profiles?
Yes. As a moisture-sensitive level 3 (MSL3) component, IDL10G65C5XUMA2 requires pre-bake if exposed to ambient >30°C/60% RH for >168 hours. Reflow must follow JEDEC J-STD-020 profile for VSON packages, with peak temperature ≤260°C and time above 217°C limited to 60–90 seconds.
IDL10G65C5XUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolSiC™+
- Package/Case:
- 4-PowerTSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 650 V
- Current - Average Rectified (Io):
- 10A
- Voltage - Forward (Vf) (Max) @ If:
- 1.7 V @ 10 A
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 180 µA @ 650 V
- Capacitance @ Vr, F:
- 300pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VSON-4
- Operating Temperature - Junction:
- -55°C ~ 150°C
IDL10G65C5XUMA2 FAQ
1.How can I place an order for IDL10G65C5XUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for IDL10G65C5XUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IDL10G65C5XUMA2 reliable?
The price and inventory of IDL10G65C5XUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDL10G65C5XUMA2 is usually 5 days.
3.What payment methods are accepted for IDL10G65C5XUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDL10G65C5XUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IDL10G65C5XUMA2?
IDL10G65C5XUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IDL10G65C5XUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IDL10G65C5XUMA2?
For technical support, including IDL10G65C5XUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDL10G65C5XUMA2 requirements.
6.How does Aetrix verify that IDL10G65C5XUMA2 is sourced from the original manufacturer or authorized distributors?
All IDL10G65C5XUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDL10G65C5XUMA2 meets industry standards.
7.What is the process for return or replacement of IDL10G65C5XUMA2?
All IDL10G65C5XUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with IDL10G65C5XUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IDL10G65C5XUMA2 part is unused and in its original packaging.
Return procedure for IDL10G65C5XUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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