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Infineon Technologies IDL12G65C5XUMA2

Part No.:
IDL12G65C5XUMA2
Manufacturer:
Infineon Technologies
Category:
Single Diodes
Package:
4-PowerTSFN
Datasheet:
AetrixIDL12G65C5XUMA2.pdf
Description:
DIODE SIL CARB 650V 12A VSON-4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,146

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Product details

Overview

IDL12G65C5XUMA2 from Infineon is a 650 V, 12 A silicon carbide Schottky diode in PG-VSON-4 package, featuring zero reverse recovery charge, 1.5–2.1 V forward voltage (12 A, 25–150 °C), 18 nC capacitive charge at 400 V, and 0.7–0.9 K/W junction-to-case thermal resistance-designed for high-frequency PFC stages in solar inverters and UPS systems.

For engineers reviewing the IDL12G65C5XUMA2 datasheet, IDL12G65C5XUMA2 pinout, IDL12G65C5XUMA2 application, or IDL12G65C5XUMA2 equivalent, key selection criteria include its SiC-based zero-recovery behavior, 150 °C max junction temperature, 650 V repetitive peak reverse voltage, and thermal performance validated under 10 ms avalanche stress testing per JESD22.

Technical Context

This 5th-generation thinQ!™ SiC Schottky diode uses Infineon's diffusion-soldered thin-wafer process to achieve lower Qc × Vf figure of merit versus prior generations. Its unipolar conduction eliminates minority-carrier storage, enabling operation up to 150 °C with stable switching characteristics independent of temperature.

The device is optimized as a high-efficiency freewheeling or boost diode in hard-switched topologies. Its 100 V/ns dv/dt ruggedness and 57 A surge current rating (10 ms, 25 °C) support robust operation in high-dV/dt SMPS and PFC circuits without snubbers.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM650 V - supports 400 V DC-link designs with 1.6× safety margin against transient overvoltage
IF (TC < 145°C)12 A - continuous conduction capability at case temperatures up to 145 °C
VF (12 A, 25 °C)1.5–1.7 V - low forward drop reduces conduction loss in high-current PFC boost stages
Qc (VR = 400 V)18 nC - near-zero capacitive charge enables >100 kHz switching without significant turn-off loss
RthJC0.7–0.9 K/W - enables efficient heat transfer to heatsink in compact SMD layouts
IR (650 V, 150 °C)2.4–1350 µA - low leakage preserves efficiency at elevated junction temperatures
dv/dt ruggedness100 V/ns - withstands fast voltage transients in high-speed gate driver environments

Pinout & Package

Package: PG-VSON-4 (ThinPAK 8x8 mm, bottom-side thermal pad, RoHS-compliant lead plating).

Pin/TerminalCircuit RoleDesign Meaning
Pin 1No connectionElectrically isolated terminal; no internal bond wire or die connection
Pin 2No connectionElectrically isolated terminal; no internal bond wire or die connection
Pin 3AnodeMain current entry point; bonded directly to SiC die anode metallization
Pin 4AnodeParallel anode path for reduced current density and improved thermal spreading
Pin 5CathodeMain current exit point; connected to thermal pad and cathode metallization

Key Features

FeatureDesign Value
Zero reverse recovery charge (Qrr = 0)Eliminates switching loss and EMI associated with minority-carrier tail current in Si diodes
Temperature-independent switchingForward voltage and capacitance remain stable across –55 to +150 °C operating range
High surge current capability (57 A, 10 ms)Withstands inrush and overload conditions in UPS and solar inverter DC-link protection
Optimized thermal design (RthJC ≤ 0.9 K/W)Enables higher power density by reducing thermal bottleneck between die and PCB copper area
JEDEC-qualified reliabilityValidated per J-STD-020 and JESD22 for automotive and industrial temperature cycling and humidity exposure

Applications

Solar Inverter Boost StageServer PSU PFC Circuit

Use Scenario: High-efficiency DC–DC boost conversion in string-level solar inverters operating at 100–200 kHz.

IC Role / Device Role / Timing Role: Freewheeling diode in continuous-conduction-mode (CCM) boost converter, handling 12 A RMS current at 150 °C junction temperature.

Use Value: 18 nC Qc and 1.8 V VF at 150 °C reduce total losses by ~35% vs. comparable Si fast recovery diode, lowering heatsink requirements.

Use Scenario: Active PFC front-end in 3 kW server power supplies with 96%+ efficiency targets.

IC Role / Device Role / Timing Role: Boost rectifier diode synchronized with 650 V CoolMOS™ switching, operating at 65–100 kHz.

Use Value: Zero Qrr enables clean zero-voltage switching transitions, reducing EMI filter size and improving conducted emission compliance.

Uninterruptible Power Supply (UPS)Industrial Motor Drive DC Link

Use Scenario: Bidirectional energy flow management in online double-conversion UPS systems with battery backup.

IC Role / Device Role / Timing Role: Output rectifier in high-frequency inverter stage, subjected to 57 A surge during load step events.

Use Value: 100 V/ns dv/dt rating and 16.5 A²s i²t withstand prevent false triggering or failure during grid transients.

Use Scenario: Regenerative braking diode in 400 V DC bus of 15–30 kW variable-frequency drives.

IC Role / Device Role / Timing Role: Reverse-biased clamping diode absorbing inductive kickback during IGBT turn-off.

Use Value: Stable 650 V VRRM and <1 µA IR at 125 °C ensure reliable bus voltage hold-off during extended thermal soak tests.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
C3D10065A (Wolfspeed)650 V / 10 A, TO-220AC package, 1.7 V VF @ 10 A, 22 nC QcHigher Qc increases turn-off loss in >100 kHz designs; through-hole mounting limits board densityPrefer when legacy TO-220 layout reuse or higher surge margin (65 A) is required
STPSC12065DLF (STMicroelectronics)650 V / 12 A, DPAK package, 1.6 V VF @ 12 A, 20 nC Qc, RthJC = 1.2 K/WHigher thermal resistance limits power derating above 100 °C; larger footprint than ThinPAKPrefer when existing DPAK footprint compatibility outweighs thermal performance needs

Compared with C3D10065A and STPSC12065DLF, IDL12G65C5XUMA2 delivers the lowest Qc × Vf product and best thermal resistance in a surface-mount 8×8 mm package-making it optimal for space-constrained, high-frequency, high-temperature PFC and inverter designs.

Availability

IDL12G65C5XUMA2 is available at Aetrix Electronics and suitable for solar inverters, uninterruptible power supplies, and industrial motor drives requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp-up.

Supply support for IDL12G65C5XUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.

IDL12G65C5XUMA2 belongs to Infineon's 5th-generation thinQ!™ SiC Schottky diode family-engineered to complement 650 V CoolMOS™ MOSFETs in high-efficiency, high-power-density AC–DC and DC–DC conversion systems.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The IDL12G65C5XUMA2 is rated for continuous operation up to 150 °C junction temperature, with derating applied beyond 145 °C case temperature per Table 3. Its thermal resistance (RthJC ≤ 0.9 K/W) and stable electrical parameters across temperature enable reliable use in sealed, convection-cooled enclosures.

Does this diode require a gate resistor or snubber circuit?

No. As a unipolar Schottky diode, IDL12G65C5XUMA2 has no gate and exhibits zero reverse recovery charge. Its 100 V/ns dv/dt ruggedness and low stored charge eliminate the need for snubbers in typical 65–100 kHz PFC and inverter applications, simplifying layout and reducing component count.

How does the PG-VSON-4 package improve thermal performance over standard DPAK?

The PG-VSON-4 package features an exposed bottom thermal pad soldered directly to large PCB copper areas, achieving RthJC as low as 0.7 K/W-up to 40% better than standard DPAK (typically ≥1.2 K/W). This allows higher power dissipation within the same board area and improves long-term reliability under thermal cycling.

Is avalanche testing performed on every production unit?

Per the final data sheet Rev. 2.0, all IDL12G65C5XUMA2 devices undergo 10 ms avalanche stress testing at rated VRRM, verifying robustness against inductive switching transients. This test is part of Infineon's qualified production screening-not sample-based-and ensures consistent ruggedness across manufacturing lots.

IDL12G65C5XUMA2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolSiC™+
Package/Case:
4-PowerTSFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max):
650 V
Current - Average Rectified (Io):
12A
Voltage - Forward (Vf) (Max) @ If:
1.7 V @ 12 A
Speed:
No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr):
0 ns
Current - Reverse Leakage @ Vr:
190 µA @ 650 V
Capacitance @ Vr, F:
360pF @ 1V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-VSON-4
Operating Temperature - Junction:
-55°C ~ 150°C

IDL12G65C5XUMA2 FAQ

1.How can I place an order for IDL12G65C5XUMA2 through Aetrix?

Please submit a Request for Quotation (RFQ) for IDL12G65C5XUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IDL12G65C5XUMA2 reliable?

The price and inventory of IDL12G65C5XUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IDL12G65C5XUMA2 is usually 5 days.

3.What payment methods are accepted for IDL12G65C5XUMA2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IDL12G65C5XUMA2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IDL12G65C5XUMA2?

IDL12G65C5XUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IDL12G65C5XUMA2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IDL12G65C5XUMA2?

For technical support, including IDL12G65C5XUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IDL12G65C5XUMA2 requirements.

6.How does Aetrix verify that IDL12G65C5XUMA2 is sourced from the original manufacturer or authorized distributors?

All IDL12G65C5XUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IDL12G65C5XUMA2 meets industry standards.

7.What is the process for return or replacement of IDL12G65C5XUMA2?

All IDL12G65C5XUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with IDL12G65C5XUMA2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IDL12G65C5XUMA2 part is unused and in its original packaging.

Return procedure for IDL12G65C5XUMA2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IDL12G65C5XUMA2 Tags

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