Infineon Technologies IFCM30T65GDXKMA1
- Part No.:
- IFCM30T65GDXKMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Power Driver Modules
- Package:
- 24-PowerDIP Module (1.028", 26.10mm)
- Datasheet:
-
IFCM30T65GDXKMA1.pdf
- Description:
- IPM IGBT 650V 30A 24PWRDIP MOD
- Quantity:
- Payment:

- Shipping:

Inventory:3,478
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Product details
Overview
IFCM30T65GDXKMA1 from Infineon Technologies is a dual-phase interleaved Power Factor Correction (PFC) Intelligent Power Module integrating two 650V/30A TRENCHSTOP™ 5 IGBTs, rapid-switching emitter-controlled diodes, SOI gate drivers, thermistor, and protection circuitry. It delivers 450V DC-link output, supports up to 60 kHz PWM switching, and enables open-emitter current sensing via NA/NB pins for industrial PFC front-ends.
For engineers reviewing the IFCM30T65GDXKMA1 datasheet, IFCM30T65GDXKMA1 pinout, IFCM30T65GDXKMA1 application, or IFCM30T65GDXKMA1 equivalent, key selection criteria include its 650V blocking voltage, 30A rated current per phase, integrated overcurrent shutdown (ITRIP threshold = 0.47 V), thermistor-based temperature monitoring, and dual-channel isolated gate drive with UVLO (10.4 V–12.1 V).
Technical Context
This CIPOS™ module implements a two-phase interleaved PFC topology using discrete TRENCHSTOP™ 5 IGBTs and optimized emitter-controlled diodes, driven by rugged SOI-based gate drivers with Schmitt-trigger inputs compatible with 3.3 V/5 V logic. The architecture integrates fault detection (VFO), current-sense interface (ITRIP), thermal monitoring (NTC), and under-voltage lockout (UVLO) within a single DCB-based package.
Control logic operates from a 13.5–16.5 V VDD supply referenced to VSS, with noise-filtered LIN(A/B) inputs (tFILIN ≥ 1 µs minimum pulse width), and all-power-stage shutdown on fault. The module provides accessible emitter pins (NA/NB) for shunt-based phase current measurement and supports external anti-parallel diode connection at A/B collectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Blocking Voltage | 650 V - Maximum VCES/VRRM; defines safe operation in 400 V AC input PFC stages with surge margin. |
| Rated Current | 30 A - Continuous RMS current per phase at TC = 80 °C; sets thermal design baseline for heatsink sizing. |
| DC-Link Output | 450 V - Max steady-state P–N voltage; aligns with standard 380–400 V AC rectified PFC output targets. |
| Switching Frequency | 60 kHz - Max recommended fPWM; determines core size, filter inductance, and EMI filter requirements. |
| ITRIP Threshold | 0.47 V - Overcurrent comparator reference; used with external shunt to set precise current-limit point. |
| VDD UVLO Range | 10.4 V (fall) / 12.1 V (rise) - Ensures gate drive remains disabled until stable control supply is established. |
| Junction Thermal Resistance | 2.07 K/W (IGBT), 2.69 K/W (diode) - Enables accurate junction temperature estimation from case temperature measurements. |
Pinout & Package
IFCM30T65GDXKMA1 uses a 24-pin dual-in-line molded module with DCB substrate, designed for direct heatsink mounting and high thermal conductivity. Pin-to-heatsink clearance is typ. 1.6 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 8, 9 LIN(A), LIN(B) | Gate driver input | Positive-logic CMOS/TTL-compatible inputs with internal 5 kΩ pull-down and zener clamp; require ≥1 µs pulse width. |
| 11 VDD / 14 VSS | Control supply rails | VDD powers logic and gate drivers; VSS is control ground reference; UVLO active between 10.4–12.1 V. |
| 12 VFO | Fault output | Open-drain active-low signal indicating UV or overcurrent fault; latched until reset via VDD cycle or ITRIP release. |
| 13 ITRIP | Overcurrent sense input | Comparator input referenced to VSS; 0.47 V threshold with 530 ns noise filter; triggers full gate shutdown in ~1 µs. |
| 15 NTC | Thermistor node | Direct access to embedded NTC; requires external +5 V pull-up for MCU ADC interfacing. |
| 17 NB / 19 NA | IGBT emitter outputs | Open-emitter configuration enables low-side shunt current sensing per phase; minimize trace inductance to VSS. |
| 18 B / 20 A | IGBT collector terminals | High-side switching nodes; require external anti-parallel diode connection between collector and emitter. |
| 21 DB / 22 DA | Diode anodes | Connected externally to respective IGBT collectors (A/B); cathodes tied internally to P pin. |
| 23 P | Positive DC-link output | Common cathode node of integrated diodes; rated for ≤450 V DC; connects to bulk capacitor positive terminal. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase interleaved PFC integration | Reduces input current ripple by 50% vs. single-phase, enabling smaller EMI filters and lower conduction losses. |
| TRENCHSTOP™ 5 IGBTs + emitter-controlled diodes | Optimized trade-off between conduction loss (low VCE(sat)) and switching loss (fast turn-off, soft recovery). |
| Rugged SOI gate driver | Immune to dV/dt-induced false triggering; supports high-noise industrial environments without external snubbers. |
| Integrated thermal monitoring | Embedded NTC referenced to VSS allows real-time junction temperature tracking without external sensors. |
| Full-protection shutdown | Simultaneous disable of both IGBT gates on UV, overcurrent, or thermal fault-prevents shoot-through and device destruction. |
Applications
| Industrial Motor Drives | Server & Telecom PSU |
|---|---|
Use Scenario: Three-phase motor drives with active front-end (AFE) PFC stage requiring high efficiency and compact layout. IC Role / Device Role / Timing Role: Dual-phase interleaved PFC power stage delivering regulated 400 V DC bus with <5% THD input current. Use Value: Reduces input filter size by 40% and improves system PF to >0.99 at full load due to interleaving and low-loss silicon. | Use Scenario: High-density 1U server PSUs needing reliable 3.3 kW PFC with minimal footprint and thermal management overhead. IC Role / Device Role / Timing Role: Primary PFC converter operating at 45–60 kHz with digital controller feedback via ITRIP and NTC signals. Use Value: Enables 96.5% peak efficiency and 60 W/in³ power density using integrated thermal and current protection. |
| Renewable Energy Inverters | EV Charging Stations |
Use Scenario: Grid-tied solar inverters with bidirectional PFC capability for reactive power support and harmonic mitigation. IC Role / Device Role / Timing Role: Front-end PFC module handling 230 V AC input with adaptive interleaving to maintain PF >0.95 across 10–100% load. Use Value: Supports IEEE 1547-compliant grid interaction via fast current-loop response (<2 µs fault propagation) and precise ITRIP sensing. | Use Scenario: 7–22 kW AC EV chargers requiring robust PFC with thermal derating and fault logging for UL/cUL compliance. IC Role / Device Role / Timing Role: Interleaved PFC stage with integrated NTC and VFO for real-time thermal profiling and fault event capture. Use Value: Eliminates need for external current sensors and thermal ICs-reducing BOM count by 3 components and improving long-term reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-phase interleaved PFC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FSB50450 | 500 V / 20 A rating; lower voltage headroom; no integrated NTC; separate gate driver required. | Suitable only for 380 V AC input systems with conservative derating; lacks thermal monitoring. | Select when cost sensitivity outweighs thermal safety and 450 V DC-link margin requirements. |
| IRSM836-045 | 450 V / 30 A; integrated bootstrap diodes; no ITRIP input; relies on external current sensing. | Requires external op-amp/comparator for overcurrent protection; limited to fixed-frequency PFC designs. | Prefer for space-constrained designs where bootstrap integration offsets missing protection features. |
Compared with FSB50450 and IRSM836-045, IFCM30T65GDXKMA1 uniquely combines 650 V blocking, integrated NTC, and dedicated ITRIP input-enabling higher-efficiency, safer, and more compact PFC stages without external protection circuitry.
Availability
IFCM30T65GDXKMA1 is available at Aetrix Electronics and suitable for industrial motor drives, server power supplies, renewable energy inverters, and EV charging stations requiring stable component supply and long lifecycle support.
Supply support for IFCM30T65GDXKMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control solutions, with leadership in IGBT, SiC, and intelligent power modules.
The CIPOS™ product line delivers integrated power stages for motor control and PFC applications, combining high-voltage switches, gate drivers, and protection in thermally optimized packages for high-reliability industrial systems.
FAQ
What is the maximum allowable DC-link voltage for continuous operation?
The IFCM30T65GDXKMA1 is rated for continuous DC-link voltage up to 450 V between P and N terminals. Exceeding this value risks insulation breakdown and permanent damage. The surge rating is 500 V for non-repetitive events less than 10 ms, but system design must ensure steady-state operation remains within the 450 V limit per datasheet Section 7.
How does the ITRIP overcurrent protection function in practice?
ITRIP monitors voltage across an external shunt resistor placed in series with the IGBT emitter path. When the sensed voltage exceeds 0.47 V (typ.), the internal comparator triggers a 530 ns noise-filtered shutdown, disabling both gate drivers within ~1 µs. The fault remains latched until VDD is cycled or the ITRIP signal drops below threshold for >100 ns.
Can the NTC pin be used directly with a microcontroller ADC?
Yes-the NTC pin provides direct access to the embedded thermistor referenced to VSS. An external 10 kΩ pull-up resistor to +5 V creates a voltage divider that yields a linearized 0.5–4.5 V output across –40 °C to 125 °C, compatible with standard 12-bit MCU ADCs without signal conditioning.
Is heatsink mounting required, and what is the thermal interface recommendation?
Yes-direct heatsink mounting is mandatory. The module uses a DCB substrate with 1.6 mm pin-to-heatsink clearance. Use thermal interface material (TIM) with ≤0.2 K·in²/W resistance (e.g., 100 µm silicone pad or grease) and apply uniform mounting pressure (20–30 N/cm²) to achieve RthJC = 2.07 K/W (IGBT) as specified.
IFCM30T65GDXKMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CIPOS™
- Package/Case:
- 24-PowerDIP Module (1.028", 26.10mm)
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- IGBT
- Configuration:
- 2 Phase
- Current:
- 30 A
- Voltage:
- 650 V
- Voltage - Isolation:
- 2000Vrms
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
IFCM30T65GDXKMA1 FAQ
1.How can I place an order for IFCM30T65GDXKMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IFCM30T65GDXKMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IFCM30T65GDXKMA1 reliable?
The price and inventory of IFCM30T65GDXKMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IFCM30T65GDXKMA1 is usually 5 days.
3.What payment methods are accepted for IFCM30T65GDXKMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IFCM30T65GDXKMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IFCM30T65GDXKMA1?
IFCM30T65GDXKMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IFCM30T65GDXKMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IFCM30T65GDXKMA1?
For technical support, including IFCM30T65GDXKMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IFCM30T65GDXKMA1 requirements.
6.How does Aetrix verify that IFCM30T65GDXKMA1 is sourced from the original manufacturer or authorized distributors?
All IFCM30T65GDXKMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IFCM30T65GDXKMA1 meets industry standards.
7.What is the process for return or replacement of IFCM30T65GDXKMA1?
All IFCM30T65GDXKMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IFCM30T65GDXKMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IFCM30T65GDXKMA1 part is unused and in its original packaging.
Return procedure for IFCM30T65GDXKMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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