Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Power Driver Modules

Infineon Technologies IFCM30U65GDXKMA1

Name: IFCM30U65GDXKMA1
Brand: Infineon Technologies
SKU: IFCM30U65GDXKMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IFCM30U65GDXKMA1

Manufacturer:: Infineon Technologies

Category:: Power Driver Modules

Package:: 24-PowerDIP Module (1.028", 26.10mm)

Datasheet:: IFCM30U65GDXKMA1.pdf

Description:: IPM IGBT 650V 30A 24PWRDIP MOD

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:265

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IFCM30U65GDXKMA1 from Infineon Technologies is a 3-phase interleaved PFC Intelligent Power Module integrating six TRENCHSTOP™ 5 IGBTs, SOI gate drivers, thermistor, overcurrent and under-voltage protection, and open-emitter configuration for phase current sensing. It operates at 650 V blocking voltage, 30 A RMS per phase, and supports up to 60 kHz PWM switching in high-efficiency AC-DC front-end converters.

For engineers reviewing the IFCM30U65GDXKMA1 datasheet, IFCM30U65GDXKMA1 pinout, IFCM30U65GDXKMA1 application, or IFCM30U65GDXKMA1 equivalent, key selection considerations include its integrated fault signaling (VFO), NTC-based thermal monitoring, ITRIP-triggered triple-phase shutdown, and accessible emitter pins (NX/NY/NZ) for precision current measurement in PFC stages.

Technical Context

The module implements a three-phase interleaved boost PFC topology using six discrete IGBTs with rapid-switching emitter-controlled diodes and rugged SOI gate drivers. Each phase features independent LIN(X/Y/Z) logic-level inputs compatible with 3.3 V/5 V controllers and internal Schmitt-trigger noise filtering (t_FILIN ≥ 1 µs).

Protection architecture includes latch-type overcurrent detection referenced to VSS (V_ITRIP = 0.47 V, t_ITRIPMIN = 530 ns), UVLO with hysteresis (V_DDUV+ = 12.1 V, V_DDUV− = 10.4 V), and simultaneous three-phase shutdown via VFO assertion. Thermal monitoring is enabled through direct NTC access referenced to VSS.

Key Specifications

Parameter	Value and Actual Design Meaning
Blocking Voltage	650 V - Supports DC link voltages up to 450 V with 500 V surge rating for robust PFC operation in universal-input AC-DC systems.
RMS Current Rating	30 A per phase - Enables continuous conduction mode operation in high-power industrial and server PFC stages without external parallel devices.
Switching Frequency	Up to 60 kHz - Allows optimized trade-off between magnetic size, efficiency, and EMI in interleaved multi-phase designs.
Thermal Resistance (R_thJC)	2.07 K/W per IGBT - Ensures efficient heat transfer to heatsink, enabling compact thermal design with junction temperature ≤150 °C at rated load.
Input Logic Compatibility	LSTTL/CMOS - Accepts 3.3 V or 5 V controller outputs directly; internal 5 kΩ pull-down and zener clamp simplify interface design.
Overcurrent Threshold	0.47 V on ITRIP - Provides precise, noise-immune current sensing with 530 ns filter time to avoid false trips during transients.
Fault Response Time	1000 ns propagation delay - Guarantees fast, synchronized shutdown of all three phases upon fault detection to prevent device destruction.

Pinout & Package

IFCM30U65GDXKMA1 uses a dual-in-line molded package with creepage/clearance optimized for 2000 V_RMS isolation and 1.6 mm pin-to-heatsink clearance. The 24-pin layout provides dedicated control, power, and sensing terminals with 6 NC pins and full emitter access.

Pin/Terminal	Circuit Role	Design Meaning
7, 8, 9 (LINX, LINY, LINZ)	IGBT gate driver input	Positive-logic, Schmitt-triggered inputs with internal pull-down and zener protection; enable direct MCU interface without level-shifting.
11 (VDD), 14 (VSS)	Control supply rails	15 V ±1.5 V supply with UVLO hysteresis ensures reliable gate drive only within safe operating range.
12 (VFO)	Fault output	Open-drain active-low signal indicating UV or overcurrent fault; latched until reset via VDD cycle or external recovery.
13 (ITRIP)	Overcurrent sense input	Voltage comparator input referenced to VSS; 0.47 V threshold enables shunt-based current monitoring with built-in noise rejection.
15 (NTC)	Thermistor connection	Direct access to integrated NTC thermistor; requires external 5 V pull-up for analog temperature readback by microcontroller ADC.
17, 19, 21 (NZ, NY, NX)	IGBT emitter outputs	Open-emitter configuration allows low-side current sensing per phase with minimal parasitic inductance when routed close to VSS.
18, 20, 22 (Z, Y, X)	IGBT collector outputs	High-voltage collector terminals for three-phase bridge legs; require external anti-parallel diodes per datasheet requirement.
23 (P)	Positive DC output	Common cathode node for integrated diodes; rated for 450 V DC output, limiting maximum PFC bus voltage in system design.

Key Features

Feature	Design Value
TRENCHSTOP™ 5 IGBTs	Low conduction and switching losses enable >98% PFC efficiency at 3 kW with reduced heatsink requirements.
SOI gate driver technology	Immunity to dV/dt-induced shoot-through and transient noise ensures stable operation in noisy EMI environments.
Open-emitter configuration	Full access to all three IGBT emitters (NX/NY/NZ) enables independent phase current monitoring without current transformers.
Integrated thermistor (NTC)	Monitors module case temperature directly; eliminates need for external thermal sensors and simplifies thermal management firmware.
All-phase shutdown on fault	VFO-triggered simultaneous disable of all six IGBTs prevents partial conduction and catastrophic failure during overcurrent events.

Applications

Industrial Motor Drives

Server & Telecom PSU

Use Scenario: Three-phase 3–5 kW AC-DC front-end in variable-speed drives with active harmonic suppression.

IC Role / Device Role / Timing Role: Interleaved PFC controller and power stage, managing phase-shifted boost conversion to achieve THD <5% and PF >0.99.

Use Value: Integrated protection and emitter sensing reduce BOM count by 12 components versus discrete IGBT+driver solutions while maintaining thermal visibility.

Use Scenario: High-density 1U server power supply requiring 80 PLUS Titanium efficiency and compact form factor.

IC Role / Device Role / Timing Role: Core PFC stage executing 60 kHz interleaved switching across three phases to minimize input ripple and magnetics volume.

Use Value: 2.07 K/W R_thJC and low-loss TRENCHSTOP™ 5 allow full 30 A loading at 85 °C ambient without forced airflow.

Renewable Energy Inverters

EV Charging Stations

Use Scenario: Grid-tied solar string inverters with bidirectional PFC capability for reactive power support.

IC Role / Device Role / Timing Role: Unidirectional PFC stage converting rectified AC to regulated DC bus; supports dynamic voltage adjustment per grid code.

Use Value: NTC and VFO signals feed real-time thermal/fault data to system controller for adaptive derating and predictive maintenance.

Use Scenario: 11–22 kW AC charging modules for EVSE complying with IEC 61851-1 and UL 2231.

IC Role / Device Role / Timing Role: Primary PFC unit delivering stable 400 V DC bus from 3-phase 400 V AC input with overload tolerance up to 80 A peak.

Use Value: 500 V surge rating and 650 V blocking voltage ensure compliance with EN 61000-4-5 Level 4 surge immunity testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase interleaved PFC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
FSB50450	Lower voltage rating (500 V), lower current (20 A), no integrated NTC or VFO; requires external fault logic.	Suitable for 230 V single-phase PFC only; lacks thermal monitoring and coordinated shutdown.	Select when cost sensitivity outweighs thermal visibility and fault coordination needs in sub-2 kW designs.
IFCM20T65GD	Same CIPOS™ platform but 20 A rating, identical pinout and protection features; shares same footprint and control interface.	Targeted at 1.5–2.5 kW PFC stages where thermal margin is less constrained.	Choose for design scalability-same layout and firmware can be reused with derated current and thermal design.

Compared with FSB50450, IFCM30U65GDXKMA1 delivers higher power density, integrated thermal/fault signaling, and 650 V robustness; versus IFCM20T65GD, it extends continuous current capability by 50% while retaining identical control architecture and PCB compatibility.

Availability

IFCM30U65GDXKMA1 is available at Aetrix Electronics and suitable for industrial motor drives, server & telecom PSUs, renewable energy inverters, and EV charging stations requiring stable component supply and long-term production continuity.

Supply support for IFCM30U65GDXKMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.

This part belongs to the CIPOS™ family of Intelligent Power Modules designed specifically for high-efficiency, space-constrained PFC and inverter applications requiring integrated protection, thermal monitoring, and simplified system-level design.

FAQ

What is the recommended minimum pulse width for LIN(X/Y/Z) inputs?

The datasheet specifies a minimum input pulse width of 1 µs for reliable operation of the internal Schmitt-trigger and noise filter circuitry. Pulses shorter than this may be suppressed by the filter timing (t_FILIN), leading to missed switching commands and unstable PFC regulation.

How is thermal monitoring implemented on IFCM30U65GDXKMA1?

Thermal monitoring uses an integrated NTC thermistor connected to Pin 15 (NTC), referenced to VSS. An external 5 V pull-up resistor creates a voltage divider; the resulting analog voltage is read by a microcontroller ADC to derive real-time case temperature, enabling dynamic derating and thermal shutdown.

Can ITRIP be used for both overcurrent and short-circuit protection?

Yes - the ITRIP input detects overcurrent via voltage feedback from a shunt resistor placed between emitter and VSS. With a 0.47 V threshold and 530 ns noise filter, it responds to both sustained overloads and hard short circuits, triggering immediate three-phase shutdown with 1000 ns propagation delay.

What is the purpose of the P pin, and what voltage limits apply?

Pin 23 (P) is the common cathode node for the integrated rapid-switching emitter-controlled diodes. It serves as the positive DC output terminal of the PFC stage, rated for continuous 450 V DC operation and 500 V non-repetitive surge, defining the maximum allowable DC link voltage in system design.

IFCM30U65GDXKMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: CIPOS™

Package/Case:: 24-PowerDIP Module (1.028", 26.10mm)

Packaging:: Tube

Product Status:: Active

Type:: IGBT

Configuration:: 3 Phase

Current:: 30 A

Voltage:: 650 V

Voltage - Isolation:: 2000Vrms

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

IFCM30U65GDXKMA1 FAQ

1.How can I place an order for IFCM30U65GDXKMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IFCM30U65GDXKMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IFCM30U65GDXKMA1 reliable?

The price and inventory of IFCM30U65GDXKMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IFCM30U65GDXKMA1 is usually 5 days.

3.What payment methods are accepted for IFCM30U65GDXKMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IFCM30U65GDXKMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IFCM30U65GDXKMA1?

IFCM30U65GDXKMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IFCM30U65GDXKMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IFCM30U65GDXKMA1?

For technical support, including IFCM30U65GDXKMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IFCM30U65GDXKMA1 requirements.

6.How does Aetrix verify that IFCM30U65GDXKMA1 is sourced from the original manufacturer or authorized distributors?

All IFCM30U65GDXKMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IFCM30U65GDXKMA1 meets industry standards.

7.What is the process for return or replacement of IFCM30U65GDXKMA1?

All IFCM30U65GDXKMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IFCM30U65GDXKMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IFCM30U65GDXKMA1 part is unused and in its original packaging.

Return procedure for IFCM30U65GDXKMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…