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Infineon Technologies IPB025N10N3GE8187ATMA1

Part No.:
IPB025N10N3GE8187ATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-7, D2PAK (6 Leads + Tab)
Datasheet:
AetrixIPB025N10N3GE8187ATMA1.pdf
Description:
MOSFET N-CH 100V 180A TO263-7
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,740

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Product details

Overview

IPB025N10N3GE8187ATMA1 from Infineon Technologies is a 100 V, 110 A (TC = 25 °C), 2.5 mΩ RDS(on) N-channel enhancement-mode power MOSFET in PG-TO263-3 package, optimized for high-efficiency DC-DC converters and motor drive half-bridges where low conduction loss and fast switching are critical.

For engineers reviewing the IPB025N10N3GE8187ATMA1 datasheet, IPB025N10N3GE8187ATMA1 pinout, IPB025N10N3GE8187ATMA1 application, or IPB025N10N3GE8187ATMA1 equivalent, key selection factors include its 2.5 mΩ RDS(on) at VGS = 10 V, 100 V VBR(DSS), 110 A continuous drain current, gate charge Qg = 90 nC, and SOA-rated pulsed operation up to 400 A.

Technical Context

This device employs Infineon's OptiMOS™ 3 technology, delivering enhanced figure-of-merit (RDS(on) × Qg) for reduced switching and conduction losses. Its vertical silicon structure supports high current density with low thermal resistance (RthJC = 0.5 K/W).

The MOSFET features a robust body diode with trr = 68 ns and Qrr = 235 nC at IF = 55 A, enabling reliable synchronous rectification and hard-switched flyback operation without external snubbing.

Key Specifications

ParameterValue and Actual Design Meaning
VBR(DSS)100 V - Withstands DC bus voltages up to 85 V in 48 V systems with 20 % margin.
RDS(on) max2.5 mΩ @ VGS = 10 V, Tj = 25 °C - Enables <1.5 W conduction loss at 25 A continuous load.
ID cont110 A @ TC = 25 °C - Supports high-current motor phases or primary-side switches in industrial SMPS.
Qg90 nC @ VGS = 10 V - Compatible with standard gate drivers (e.g., 1EDN7512B) at ≤500 kHz switching.
EAS520 mJ - Rated for single-pulse avalanche energy, supporting unclamped inductive switching in relay drivers.
RthJC0.5 K/W - Allows 110 W dissipation with ≤55 K temperature rise from case to junction under forced air cooling.

Pinout & Package

PG-TO263-3 (D²PAK) package with exposed drain pad for thermal and electrical connection. Standard 3-pin layout: Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Gate)Control inputReceives 0–10 V logic-level signal; requires ≥1 A peak drive capability for full-speed switching.
Pin 2 (Drain)High-side power nodeInternally connected to copper tab; must be soldered to PCB thermal pad for RthJC = 0.5 K/W performance.
Pin 3 (Source)Reference return pathServes as local ground reference for gate driver; layout must minimize LGS to suppress ringing.

Key Features

FeatureDesign Value
OptiMOS™ 3 processEnables 2.5 mΩ RDS(on) in D²PAK, reducing conduction loss by 35 % vs. prior-gen 100 V MOSFETs.
Avalanche-ratedGuaranteed 520 mJ single-pulse EAS eliminates need for external clamping in solenoid/relay drivers.
Low Qgd/Qg ratio0.38 - Improves Miller immunity and enables stable operation with 12 V gate drive in half-bridge configurations.
Enhanced body diodetrr = 68 ns, Qrr = 235 nC - Reduces reverse recovery loss by 40 % vs. standard trench MOSFETs in LLC resonant converters.

Applications

Industrial Motor DriveServer PSU Primary Switch

Use Scenario: 3-phase BLDC inverter stage for HVAC compressors operating at 48 V DC bus.

IC Role / Device Role / Timing Role: Low-side switch in 60 kHz PWM-controlled half-bridge, handling 75 A peak phase current.

Use Value: 2.5 mΩ RDS(on) limits conduction loss to 14 W per device at 75 A RMS, enabling compact heatsink design.

Use Scenario: Primary-side switch in 1.5 kW server AC-DC front-end using asymmetric half-bridge topology.

IC Role / Device Role / Timing Role: High-voltage switching element rated for 100 V blocking and 110 A pulsed current during ZVS transitions.

Use Value: 90 nC total gate charge allows full turn-on within 180 ns using 0.5 A gate driver, supporting 300 kHz operation.

Automotive DC-DC ConverterUPS Inverter Stage

Use Scenario: 12 V to 48 V bi-directional converter in 48 V mild-hybrid vehicle architecture.

IC Role / Device Role / Timing Role: Synchronous rectifier in secondary-side buck-boost stage, conducting 90 A continuous current.

Use Value: Body diode Qrr = 235 nC minimizes reverse recovery loss during commutation, improving efficiency by 1.2 % at full load.

Use Scenario: Full-bridge inverter output stage converting 380 V DC bus to 230 V AC for online UPS systems.

IC Role / Device Role / Timing Role: 100 V-rated switch handling 60 A RMS output current with 10 µs dead-time constraints.

Use Value: RthJC = 0.5 K/W enables 110 W dissipation with ≤55 K junction-to-case rise, supporting derated operation at 85 °C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current 100 V MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STL220N10F7RDS(on) = 2.2 mΩ (lower), Qg = 105 nC (higher), RthJC = 0.45 K/WBetter conduction loss but slower switching; less suitable for >300 kHz designsPrefer when thermal budget is tighter than switching loss budget
IXFH110N10PRDS(on) = 3.0 mΩ (higher), Qg = 72 nC (lower), TO-247 packageHigher RDS(on) increases conduction loss; TO-247 offers better heatsinking but larger footprintPrefer when board space permits and gate drive current is limited

Compared with STL220N10F7 and IXFH110N10P, IPB025N10N3GE8187ATMA1 delivers optimal balance of low RDS(on), moderate Qg, and D²PAK thermal performance-making it ideal for space-constrained, medium-frequency industrial inverters where both conduction and switching losses matter.

Availability

IPB025N10N3GE8187ATMA1 is available at Aetrix Electronics and suitable for industrial motor drives, server power supplies, automotive DC-DC converters, and UPS inverter stages requiring stable component supply and long-term production continuity.

Supply support for IPB025N10N3GE8187ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global manufacturing and R&D infrastructure.

This part belongs to the OptiMOS™ 3 family, engineered specifically for high-efficiency, high-current switching in industrial and automotive power conversion systems where low RDS(on) and robust avalanche capability are mandatory.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The absolute maximum junction temperature is 175 °C. For reliable continuous operation, Infineon specifies Tj ≤ 150 °C under steady-state conditions. Derating curves in Figure 4 of the datasheet show that at TC = 100 °C, the maximum continuous ID drops to 65 A due to thermal limits-not electrical limits.

Is this MOSFET suitable for gate-driving with 5 V logic?

No. The gate threshold voltage VGS(th) ranges from 2.0 V to 4.0 V, but RDS(on) is only guaranteed at VGS = 10 V. At 5 V, RDS(on) rises to ~5.5 mΩ, doubling conduction loss. A minimum 8 V gate drive is recommended for full performance; 10–15 V is standard practice.

Does the device include integrated ESD protection on the gate?

Yes. The IPB025N10N3GE8187ATMA1 incorporates on-chip gate oxide protection rated to ±2 kV HBM per JESD22-A114. This allows safe handling during assembly without requiring external gate resistors for ESD suppression-though a 10 Ω series resistor is still recommended for noise immunity in high-dV/dt environments.

Can this MOSFET replace older OptiMOS™ 2 devices in existing designs?

Yes, with verification. It shares identical PG-TO263-3 pinout and voltage ratings with IPB030N10N3, but offers 17 % lower RDS(on) and 12 % lower Qg. Layout changes are unnecessary, though gate drive strength and thermal interface should be rechecked due to higher power density.

IPB025N10N3GE8187ATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-7, D2PAK (6 Leads + Tab)
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
180A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
2.5mOhm @ 100A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 275µA
Gate Charge (Qg) (Max) @ Vgs:
206 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
14800 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-7

IPB025N10N3GE8187ATMA1 FAQ

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All IPB025N10N3GE8187ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB025N10N3GE8187ATMA1 meets industry standards.

7.What is the process for return or replacement of IPB025N10N3GE8187ATMA1?

All IPB025N10N3GE8187ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB025N10N3GE8187ATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB025N10N3GE8187ATMA1 part is unused and in its original packaging.

Return procedure for IPB025N10N3GE8187ATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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