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Infineon Technologies IPB03N03LB G

Part No.:
IPB03N03LB G
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB03N03LB G.pdf
Description:
MOSFET N-CH 30V 80A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:787

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Product details

Overview

IPB03N03LB from Infineon Technologies is an N-channel logic-level OptiMOS®2 power MOSFET in PG-TO263-3 (D²PAK) package, rated for 30 V VDS, 2.8 mΩ RDS(on) at VGS = 10 V and ID = 55 A, with 175 °C maximum junction temperature and dv/dt ruggedness up to 6 kV/µs - deployed in high-frequency synchronous buck converters for server VRMs.

For engineers reviewing the IPB03N03LB datasheet, IPB03N03LB pinout, IPB03N03LB application, or IPB03N03LB equivalent, key selection criteria include its low gate charge × RDS(on) figure of merit (FOM), 44–59 nC total gate charge, 1 K/W junction-to-case thermal resistance, and robust 580 mJ single-pulse avalanche energy rating.

Technical Context

This MOSFET employs a trench-based silicon process optimized for high-efficiency, high-switching-frequency DC/DC conversion. Its logic-level gate threshold (1.2–2.0 V typ.) enables direct drive from 3.3 V or 5 V controllers, while the 0.9 Ω gate resistance supports controlled turn-on/turn-off timing without external gate resistors in many designs.

The device integrates a fast, low-loss body diode with 20 nC reverse recovery charge and 0.89–1.2 V forward voltage at 80 A, making it suitable for synchronous rectification where reverse recovery behavior critically impacts efficiency and EMI.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum drain-source blocking voltage; defines use in ≤24 V input systems with margin.
RDS(on) max2.8 mΩ @ VGS = 10 V, ID = 55 A - Enables <1 W conduction loss at 50 A, critical for high-current VRMs.
Qg44–59 nC - Total gate charge determines driver strength requirement and switching loss trade-off.
EAS580 mJ - Single-pulse avalanche energy rating ensures robustness against inductive switching transients.
RthJC1 K/W - Junction-to-case thermal resistance enables high-power operation with minimal heatsink mass.
dv/dt rating6 kV/µs - Confirmed ruggedness against parasitic turn-on in hard-switched topologies.
ID continuous80 A @ TC = 25 °C - Limited by package bondwire; actual current capability depends on PCB thermal design.

Pinout & Package

IPB03N03LB is housed in PG-TO263-3 (D²PAK) package: surface-mount, isolated drain tab, 3-pin configuration with standard footprint per JEDEC TO-263AB. Thermal pad must be soldered to ≥6 cm² copper area on FR4 PCB for rated performance.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminalLow-side reference node; connects to ground plane or low-side switch node; carries full load current.
Pin 2 (Gate)Control inputHigh-impedance MOS gate requiring <60 nC charge; sensitive to ESD and ringing; routed away from noisy traces.
Pin 3 (Drain)Power output / High-side returnExposed metal tab - electrically connected to drain; primary thermal path; must be soldered to PCB copper for thermal management.

Key Features

FeatureDesign Value
Logic-level gate driveThreshold voltage 1.2–2.0 V enables direct interface with 3.3 V microcontrollers or PWM controllers without level-shifting.
Low FOM (Qg × RDS(on))~123–165 nC·mΩ - balances switching loss and conduction loss for optimal efficiency in 300–1000 kHz converters.
175 °C operationRated junction temperature allows sustained operation in thermally constrained server and telecom environments.
dv/dt ruggedness6 kV/µs rating prevents false turn-on during fast voltage transients in half-bridge configurations.
Robust body diode20 nC Qrr and 0.89 V VSD at 80 A reduce reverse recovery losses in synchronous rectification.

Applications

Server Voltage Regulator Modules (VRMs)Telecom DC/DC Converters

Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (0.8–1.2 V) at up to 200 A per rail.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET in interleaved phase-legs, switching at 500–800 kHz.

Use Value: 2.8 mΩ RDS(on) minimizes conduction loss; 44–59 nC Qg enables efficient gate drive with integrated controller drivers.

Use Scenario: 48 V input to 12 V intermediate bus converter in 5G base station power shelves.

IC Role / Device Role / Timing Role: Primary-side high-frequency switching transistor in hard-switched forward or active-clamp forward topology.

Use Value: 6 kV/µs dv/dt rating ensures immunity to voltage spikes during transformer reset; 580 mJ EAS withstands leakage inductance energy.

Industrial Motor Drive InvertersAutomotive DC/DC Converters

Use Scenario: 24 V battery-fed H-bridge for BLDC motor control in factory automation actuators.

IC Role / Device Role / Timing Role: Low-side switch in half-bridge leg, operating with 10–20 kHz PWM and regenerative braking.

Use Value: 175 °C Tj,max supports operation in sealed enclosures; 78 A IS body diode current handles motor back-EMF during freewheeling.

Use Scenario: 12 V to 5 V/3.3 V point-of-load converter in ADAS camera modules or infotainment head units.

IC Role / Device Role / Timing Role: Synchronous rectifier in compact 2 MHz buck regulator with strict EMI limits.

Use Value: Low Crss (256–384 pF) reduces Miller-induced shoot-through risk; 1 K/W RthJC enables thermal reliability on small PCB areas.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRL3803PbFRDS(on) = 3.0 mΩ @ 10 V; Qg = 52 nC; TO-220 package; no dv/dt rating specified.Lacks documented dv/dt ruggedness and 175 °C rating; higher RDS(on) increases conduction loss at high current.Acceptable for lower-frequency, non-ruggedized designs where thermal margin exists.
STL220N3LLH6RDS(on) = 2.4 mΩ @ 10 V; Qg = 64 nC; PowerFLAT 5x6 package; 175 °C rated; no published EAS.Lower RDS(on) improves conduction loss but higher Qg increases switching loss; smaller package demands tighter layout control.Better for space-constrained designs needing lowest RDS(on), but requires careful gate drive and thermal design.

Compared with IRL3803PbF and STL220N3LLH6, IPB03N03LB uniquely combines verified 6 kV/µs dv/dt ruggedness, 580 mJ EAS, and 1 K/W RthJC in a proven D²PAK package - making it preferred for high-reliability, high-frequency server and telecom power stages where transient robustness and thermal predictability are critical.

Availability

IPB03N03LB is available at Aetrix Electronics and suitable for server VRMs, telecom DC/DC converters, and industrial motor drives requiring stable component supply across long production lifecycles.

Supply support for IPB03N03LB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

IPB03N03LB belongs to the OptiMOS®2 family - engineered specifically for high-efficiency, high-frequency DC/DC conversion in computing and communications infrastructure.

FAQ

Is IPB03N03LB suitable for synchronous rectification in a 2 MHz buck converter?

Yes - its 2.8 mΩ RDS(on), low Crss (256–384 pF), and 44–59 nC Qg enable efficient operation at 2 MHz. The body diode's 20 nC Qrr and 0.89 V VSD minimize reverse recovery loss, provided gate drive timing avoids shoot-through. Layout must minimize loop inductance.

What is the maximum continuous drain current at 100 °C case temperature?

The datasheet specifies ID = 80 A at both TC = 25 °C and TC = 100 °C - this reflects bondwire current limit, not thermal limit. Actual usable current at TC = 100 °C depends on PCB thermal design; with 6 cm² copper, derating begins above ~50 A due to junction temperature rise.

Does IPB03N03LB require a gate resistor for safe operation?

A gate resistor is recommended to dampen ringing and control dI/dt, especially in high-di/dt applications. While the intrinsic RG is 0.9 Ω, typical designs use 2.2–10 Ω in series with the driver to balance switching speed, EMI, and shoot-through risk - particularly in half-bridge configurations.

Can IPB03N03LB replace IPB02N03LB in an existing design?

Yes - both share identical PG-TO263-3 package, pinout, and 30 V rating. IPB03N03LB has slightly higher RDS(on) (2.8 mΩ vs. 2.3 mΩ for IPB02N03LB) but improved dv/dt rating (6 kV/µs vs. unspecified) and same 175 °C rating. Verify thermal margin if operating near conduction loss limits.

IPB03N03LB G Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
80A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
2.8mOhm @ 55A, 10V
Vgs(th) (Max) @ Id:
2V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
59 nC @ 5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
7624 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
150W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3

IPB03N03LB G FAQ

1.How can I place an order for IPB03N03LB G through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB03N03LB G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB03N03LB G reliable?

The price and inventory of IPB03N03LB G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB03N03LB G is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB03N03LB G transactions.

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IPB03N03LB G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB03N03LB G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB03N03LB G?

For technical support, including IPB03N03LB G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB03N03LB G requirements.

6.How does Aetrix verify that IPB03N03LB G is sourced from the original manufacturer or authorized distributors?

All IPB03N03LB G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB03N03LB G meets industry standards.

7.What is the process for return or replacement of IPB03N03LB G?

All IPB03N03LB G units undergo pre-shipment inspection (PSI). If there is an issue with IPB03N03LB G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB03N03LB G part is unused and in its original packaging.

Return procedure for IPB03N03LB G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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