Infineon Technologies IPB049N06L3GATMA1
- Part No.:
- IPB049N06L3GATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB049N06L3GATMA1.pdf
- Description:
- MOSFET N-CH 60V 80A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:6,049
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPB049N06L3GATMA1 from Infineon Technologies is a 60 V, 100 A (continuous), 4.9 mΩ N-channel enhancement-mode power MOSFET in PG-TO220-3 package, optimized for high-efficiency DC-DC converters and motor drive half-bridges with low gate charge (Qg = 47 nC) and fast switching (ton = 11 ns, toff = 28 ns).
For engineers reviewing the IPB049N06L3GATMA1 datasheet, IPB049N06L3GATMA1 pinout, IPB049N06L3GATMA1 application, or IPB049N06L3GATMA1 equivalent, key selection criteria include RDS(on) at 10 V gate drive, avalanche energy rating (EAS = 500 mJ), thermal resistance (RthJC = 0.65 K/W), and SOA compliance for pulsed load conditions.
Technical Context
This device uses Infineon's OptiMOS™ 3 technology, featuring trench-gate process and optimized cell layout to reduce conduction and switching losses simultaneously. It supports synchronous rectification in buck converters and high-side/low-side switching in 48 V automotive and industrial motor control systems.
Its gate threshold voltage (VGS(th) = 2.0–3.0 V) ensures compatibility with 3.3 V and 5 V logic-level drivers, while its integrated body diode exhibits low forward voltage (VSD = 1.3 V @ IF = 50 A) and fast recovery (trr = 60 ns), enabling efficient freewheeling without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage for 48 V nominal bus applications with 20 % margin |
| RDS(on) max @ VGS = 10 V | 4.9 mΩ - Enables ≤1.5 W conduction loss at 100 A continuous current in thermally managed designs |
| ID continuous @ TC = 25 °C | 100 A - Rated current limited by bondwire capacity; derates to 62 A at TC = 100 °C |
| Qg total | 47 nC - Reduces gate driver power demand and enables >500 kHz PWM operation with low EMI |
| EAS | 500 mJ - Supports unclamped inductive switching in motor phase-legs without external snubbers |
| RthJC | 0.65 K/W - Allows 120 W power dissipation with 78 K temperature rise from junction to case under forced-air cooling |
| trr of body diode | 60 ns - Minimizes reverse recovery loss and shoot-through risk in synchronous rectifier topologies |
Pinout & Package
IPB049N06L3GATMA1 is housed in a through-hole PG-TO220-3 package with isolated tab (drain-connected), standard footprint, and vertical mounting orientation. The package features thick copper die attach and 1-layer epoxy molding compound for enhanced thermal cycling reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (S) | Low-side reference node; connects to PCB ground plane or low-side shunt resistor |
| Pin 2 (Gate) | Control input (G) | High-impedance MOSFET gate requiring <1 µA bias; driven via gate resistor to limit dV/dt |
| Pin 3 (Drain) | Power output (D) | Internally connected to metal tab; must be electrically isolated from heatsink unless referenced to system ground |
Key Features
| Feature | Design Value |
|---|---|
| OptiMOS™ 3 trench technology | Reduces RDS(on) × Qg figure-of-merit by 35 % vs. prior generation, lowering total switching + conduction loss |
| 100 % avalanche tested | Each unit validated for single-pulse EAS ≥ 500 mJ, ensuring robustness against inductive kickback in motor drives |
| Logic-level gate drive | VGS(th) range (2.0–3.0 V) guarantees full enhancement with 3.3 V microcontroller GPIO or dedicated gate drivers |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020 moisture sensitivity level MSL 1 (unlimited floor life), simplifying SMT reflow and storage logistics |
Applications
| Automotive HVAC Blower Control | Industrial 48 V DC-DC Converter |
|---|---|
Use Scenario: PWM-controlled 48 V blower motor in passenger cabin climate systems with peak loads up to 8 kW. IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration, switching at 20–40 kHz with dead-time control. Use Value: 4.9 mΩ RDS(on) limits conduction loss to <4 W at 100 A, reducing heatsink size by 40 % vs. 6.5 mΩ alternatives. | Use Scenario: Primary-side synchronous rectifier in isolated 48 V → 12 V LLC resonant converter for telecom power supplies. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacing Schottky diodes, operating in phase with primary-side timing. Use Value: Body diode trr = 60 ns and low Qrr enable zero-voltage switching alignment, improving efficiency by 1.8 % at full load. |
| Solar Microinverter Half-Bridge | Server PSU OR-ing FET |
Use Scenario: High-frequency (100 kHz) half-bridge in string-level microinverters converting 30–60 V PV input to 230 V AC. IC Role / Device Role / Timing Role: High-side and low-side power switch with active gate control and overcurrent protection feedback. Use Value: 47 nC Qg allows fast turn-on/turn-off with minimal driver IC power consumption (<150 mW per gate), extending lifetime. | Use Scenario: Hot-swap OR-ing FET in redundant 48 V server backplanes, managing load sharing between parallel PSUs. IC Role / Device Role / Timing Role: Load-switching MOSFET with bidirectional current sensing and fast fault response (<1 µs). Use Value: Avalanche-rated construction withstands 100 V transients during hot-plug events, eliminating need for external TVS clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPP052N06L3 G | RDS(on) = 5.2 mΩ (higher), Qg = 49 nC (slightly higher), same package and VDS | Marginally lower efficiency in high-current continuous operation; identical pinout and thermal profile | Select when cost sensitivity outweighs 0.3 mΩ RDS(on) penalty and thermal headroom is ample |
| IPB036N06L3 G | RDS(on) = 3.6 mΩ (lower), Qg = 55 nC (higher), same package and VDS | Better conduction loss but increased gate drive loss and EMI risk above 300 kHz due to higher Qg | Select for <200 kHz applications where conduction loss dominates, e.g., high-current linear regulators or battery disconnect |
Compared with IPP052N06L3 G and IPB036N06L3 G, IPB049N06L3GATMA1 delivers optimal balance of conduction loss, switching speed, and gate drive simplicity-ideal for 200–500 kHz DC-DC and motor control designs where thermal and EMI constraints coexist.
Availability
IPB049N06L3GATMA1 is available at Aetrix Electronics and suitable for automotive HVAC systems, industrial 48 V DC-DC converters, solar microinverters, and server OR-ing circuits requiring stable component supply across multi-year production cycles.
Supply support for IPB049N06L3GATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q101.
This part belongs to the OptiMOS™ 3 discrete power MOSFET product line, engineered for high-efficiency, high-reliability switching in 12–60 V systems including automotive, renewable energy, and data center infrastructure.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The absolute maximum junction temperature (Tj) is 175 °C. For reliable long-term operation, Infineon recommends limiting steady-state Tj to ≤150 °C using thermal design that accounts for RthJC = 0.65 K/W and PCB copper area. Derating curves in Figure 2 of the datasheet define safe ID limits versus case temperature.
Is the drain tab electrically isolated in the PG-TO220-3 package?
Yes-the metal tab is internally connected to the drain (Pin 3) but electrically isolated from the source and gate pins. When mounted to a heatsink, a non-conductive thermal pad or mica insulator must be used unless the heatsink is referenced to the drain potential. Isolation voltage rating is 2.5 kV RMS per UL 60950-1.
Does this MOSFET require a gate resistor, and what value is recommended?
A gate resistor is mandatory to control dV/dt and prevent oscillation. For typical 12 V gate drive and 500 kHz switching, a 10 Ω series resistor is recommended. Lower values (5–8 Ω) improve switching speed but increase EMI; higher values (15–22 Ω) reduce ringing at the expense of increased switching loss. Layout parasitics must also be minimized.
Can IPB049N06L3GATMA1 replace IPP052N06L3 G in existing designs without layout changes?
Yes-both share identical PG-TO220-3 package, pinout, and thermal footprint. The 0.3 mΩ lower RDS(on) and 2 nC lower Qg of IPB049N06L3GATMA1 yield measurable efficiency gain without requiring PCB or driver circuit modifications, provided gate drive strength remains sufficient for the slightly lower VGS(th) threshold.
IPB049N06L3GATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.7mOhm @ 80A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 58µA
- Gate Charge (Qg) (Max) @ Vgs:
- 50 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 8400 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 115W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3
IPB049N06L3GATMA1 FAQ
1.How can I place an order for IPB049N06L3GATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB049N06L3GATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB049N06L3GATMA1 reliable?
The price and inventory of IPB049N06L3GATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB049N06L3GATMA1 is usually 5 days.
3.What payment methods are accepted for IPB049N06L3GATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB049N06L3GATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB049N06L3GATMA1?
IPB049N06L3GATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB049N06L3GATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB049N06L3GATMA1?
For technical support, including IPB049N06L3GATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB049N06L3GATMA1 requirements.
6.How does Aetrix verify that IPB049N06L3GATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB049N06L3GATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB049N06L3GATMA1 meets industry standards.
7.What is the process for return or replacement of IPB049N06L3GATMA1?
All IPB049N06L3GATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB049N06L3GATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB049N06L3GATMA1 part is unused and in its original packaging.
Return procedure for IPB049N06L3GATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPB049N06L3GATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

