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Infineon Technologies IPB055N03LGATMA1

Part No.:
IPB055N03LGATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB055N03LGATMA1.pdf
Description:
MOSFET N-CH 30V 50A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,606

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Product details

Overview

IPB055N03LGATMA1 from Infineon Technologies is an N-channel logic-level power MOSFET in PG-TO263-3 package, rated for 30 V VDS, 5.5 mΩ RDS(on) at VGS = 10 V, and 50 A continuous drain current at TC = 100 °C. It features avalanche rating, low gate charge (Qg = 31 nC), and optimized FOM for high-efficiency DC/DC converters and SMPS.

For engineers reviewing the IPB055N03LGATMA1 datasheet, IPB055N03LGATMA1 pinout, IPB055N03LGATMA1 application, or IPB055N03LGATMA1 equivalent, key selection criteria include RDS(on) vs. gate drive voltage, single-pulse avalanche energy (EAS = 60 mJ), thermal resistance (RthJC = 2.2 K/W), and synchronous FET gate charge (Qg(sync) = 13 nC).

Technical Context

This MOSFET employs Infineon's OptiMOS™3 silicon technology, delivering enhanced conduction and switching performance via reduced RDS(on) × Qg figure-of-merit. Its logic-level gate threshold (VGS(th) = 1–2.2 V) enables direct drive from 3.3 V or 5 V controllers without level-shifting.

Designed for hard-switched topologies, it supports fast dv/dt immunity (6 kV/µs) and exhibits robust reverse diode recovery (Qrr = 20 nC, IF = 30 A). Thermal design is enabled by low junction-to-case resistance and validated operation up to Tj = 175 °C.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum blocking voltage for 24 V input rail applications with margin
RDS(on) max5.5 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 50 A in high-current POL stages
ID cont.50 A @ TC = 100 °C - Sustains full load in compact heatsinked SMPS designs
Qg31 nC @ VDD = 15 V, ID = 30 A - Determines gate driver power and switching loss in 300–1000 kHz converters
EAS60 mJ - Supports reliable operation under inductive turn-off stress without external snubbing
RthJC2.2 K/W - Enables precise junction temperature estimation using case temperature measurement
Qg(sync)13 nC @ VGS = 0–4.5 V - Optimized for low-voltage gate drive in synchronous buck high-side or low-side roles

Pinout & Package

IPB055N03LGATMA1 uses the PG-TO263-3 (D²PAK) surface-mount package with isolated drain tab, optimized for PCB thermal dissipation. The device has three terminals: Drain (Tab), Source (Pin 1), and Gate (Pin 2).

Pin/TerminalCircuit RoleDesign Meaning
Drain (Tab)Main current path output / heat sink interfaceExposed copper pad electrically connected to drain; requires soldered thermal pad for RthJA ≤ 40 K/W
Source (Pin 1)Reference node for gate drive and current sensingLow-inductance connection point for gate driver return and shunt resistor placement
Gate (Pin 2)Control terminal for channel modulationHigh-impedance input requiring <20 V absolute max; sensitive to ESD and ringing

Key Features

FeatureDesign Value
Logic-level gate driveOperates fully enhanced at VGS ≥ 4.5 V - compatible with standard microcontroller GPIO and PWM IC outputs
Avalanche-ratedRated for repetitive single-pulse avalanche (IAS = 50 A, EAS = 60 mJ) - eliminates need for external clamping in flyback or LLC resonant circuits
Low Qg × RDS(on) FOM31 nC × 5.5 mΩ = 170.5 - benchmark efficiency metric for high-frequency synchronous rectification
Halogen-free & RoHSComplies with IEC61249-2-21 and EU RoHS Directive 2011/65/EU - suitable for consumer and industrial end-equipment

Applications

Server VRMIndustrial DC/DC Converter

Use Scenario: Point-of-load regulation for CPU/GPU core voltage in 1U rack servers.

IC Role / Device Role / Timing Role: Low-side synchronous FET in multiphase buck converter operating at 500–800 kHz.

Use Value: 5.5 mΩ RDS(on) and 13 nC Qg(sync) minimize conduction + switching losses, enabling >95% efficiency at 40 A per phase.

Use Scenario: Isolated 24 V to 5 V/12 V DC/DC supply in programmable logic controllers.

IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward or half-bridge topology.

Use Value: 60 mJ EAS and 6 kV/µs dv/dt immunity ensure robustness against transformer leakage spikes and layout parasitics.

Automotive Body Control ModuleTelecom Power Supply

Use Scenario: Load switching and motor drive in 12 V automotive body electronics.

IC Role / Device Role / Timing Role: High-current load switch with integrated reverse polarity protection.

Use Value: Logic-level VGS(th) (1–2.2 V) allows direct drive from 3.3 V CAN/LIN transceivers; avalanche rating handles inductive kickback from solenoids.

Use Scenario: Primary-side switch in 48 V telecom rectifier modules with forced-air cooling.

IC Role / Device Role / Timing Role: Main switching element in phase-shifted full-bridge topology.

Use Value: RthJC = 2.2 K/W and 50 A rating support high-power density (≥500 W/in³) with minimal heatsink volume.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRL3803PBFRDS(on) = 6.0 mΩ @ 10 V; Qg = 42 nC; TO-220 packageHigher conduction loss and larger package footprint; no avalanche ratingAcceptable where thermal budget permits higher RDS(on) and board space allows through-hole mounting
STL220N3LLH6RDS(on) = 5.2 mΩ @ 10 V; Qg = 35 nC; PowerFLAT 8x8 packageLower RDS(on) but no isolated drain tab; limited avalanche capability (EAS not specified)Better for ultra-low-loss SMT-only designs where avalanche stress is mitigated externally

Compared with IRL3803PBF and STL220N3LLH6, IPB055N03LGATMA1 uniquely combines 5.5 mΩ RDS(on), 60 mJ avalanche energy, and D²PAK thermal performance-making it optimal for thermally constrained, high-reliability DC/DC and motor control applications requiring both efficiency and ruggedness.

Availability

IPB055N03LGATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC/DC converters, and automotive body control modules requiring stable component supply across multi-year production cycles.

Supply support for IPB055N03LGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q101.

This device belongs to the OptiMOS™3 power transistor product line, engineered specifically for high-frequency, high-efficiency switching in server, telecom, and industrial power supplies where low RDS(on) and fast switching are critical.

FAQ

What is the maximum gate-source voltage rating for IPB055N03LGATMA1?

The absolute maximum VGS is ±20 V. Operation beyond this risks permanent gate oxide damage. For reliable logic-level drive, VGS should be maintained between 4.5 V (full enhancement) and 10 V (optimal RDS(on)), with transient overshoot suppressed using gate resistors and TVS clamping.

Is IPB055N03LGATMA1 suitable for synchronous rectification in a 48 V input buck converter?

Yes - its 4.5 V logic-level threshold, 13 nC Qg(sync), and 5.5 mΩ RDS(on) make it well-suited as a low-side synchronous FET in 48 V input buck converters up to 300 kHz. Thermal validation must confirm Tj remains ≤175 °C under worst-case load and ambient conditions.

Does IPB055N03LGATMA1 have a built-in body diode, and what are its key parameters?

Yes - it integrates a fast-recovery epitaxial body diode rated for 50 A continuous forward current (IS) and 350 A pulsed current (IS,pulse). Key specs include VSD = 0.88–1.1 V at 30 A/25 °C and Qrr = 20 nC, enabling use in freewheeling and synchronous rectification without external diodes.

How does the PG-TO263-3 package of IPB055N03LGATMA1 compare thermally to TO-220?

The PG-TO263-3 (D²PAK) offers superior PCB-based thermal dissipation: RthJA = 40 K/W with 6 cm² copper area versus ~62 K/W for TO-220 on same PCB. Its exposed drain tab enables direct thermal coupling to internal ground planes, reducing junction temperature rise by up to 15 °C at 50 A compared to TO-220 in identical layouts.

IPB055N03LGATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
50A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
5.5mOhm @ 30A, 10V
Vgs(th) (Max) @ Id:
2.2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
31 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3200 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
68W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3

IPB055N03LGATMA1 FAQ

1.How can I place an order for IPB055N03LGATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB055N03LGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB055N03LGATMA1 reliable?

The price and inventory of IPB055N03LGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB055N03LGATMA1 is usually 5 days.

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IPB055N03LGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB055N03LGATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB055N03LGATMA1?

For technical support, including IPB055N03LGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB055N03LGATMA1 requirements.

6.How does Aetrix verify that IPB055N03LGATMA1 is sourced from the original manufacturer or authorized distributors?

All IPB055N03LGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB055N03LGATMA1 meets industry standards.

7.What is the process for return or replacement of IPB055N03LGATMA1?

All IPB055N03LGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB055N03LGATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB055N03LGATMA1 part is unused and in its original packaging.

Return procedure for IPB055N03LGATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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