Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IPB06N03LB

Part No.:
IPB06N03LB
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB06N03LB.pdf
Description:
MOSFET N-CH 30V 50A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,115

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IPB06N03LB from Infineon Technologies is an N-channel logic-level OptiMOS®2 power MOSFET in PG-TO263-3 (D²PAK) package, rated for 30 V VDS, 6.3 mΩ RDS(on) at 10 VGS, 50 A continuous drain current, and 175 °C junction operation-optimized for high-frequency DC/DC converters in server VRMs and POL modules.

For engineers reviewing the IPB06N03LB datasheet, IPB06N03LB pinout, IPB06N03LB application, or IPB06N03LB equivalent, key selection criteria include its low gate charge × RDS(on) figure-of-merit (FOM), dv/dt ruggedness (6 kV/µs), 1.8 K/W RthJC, and integrated body diode with Qrr ≤ 10 nC for synchronous rectification.

Technical Context

This device employs a trench-gate silicon process optimized for low conduction and switching losses in hard-switched topologies. Its logic-level gate threshold (1.2–2.0 V) enables direct drive from 3.3 V or 5 V controllers, while the 16–22 nC total gate charge supports efficient operation at >500 kHz switching frequencies.

The MOSFET features fully rated avalanche capability (EAS = 164 mJ), robust dv/dt immunity up to 6 kV/µs, and thermal design support via low junction-to-case resistance (1.8 K/W) on standard FR4 PCBs with 6 cm² copper area-enabling compact thermal management in space-constrained power stages.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Supports 12 V and 24 V input bus architectures with margin for transients.
RDS(on) max6.3 mΩ @ VGS = 10 V - Enables <1.6 W conduction loss at 50 A, critical for high-current POL stages.
Qg total16–22 nC - Low gate drive energy reduces controller loading and improves efficiency above 300 kHz.
EAS164 mJ - Withstands single-pulse inductive energy without failure in non-clamped flyback or buck-boost.
RthJC1.8 K/W - Allows 83 W power dissipation at TC = 25 °C; enables precise thermal modeling using case temperature sensing.
dv/dt rating6 kV/µs - Immune to parasitic turn-on in fast-switching half-bridge configurations with high dV/dt nodes.
Qrr≤10 nC - Minimizes reverse recovery loss and EMI in synchronous rectifier applications.

Pinout & Package

IPB06N03LB uses the PG-TO263-3 (D²PAK) surface-mount package with exposed drain pad for thermal and electrical performance. The package has three terminals: Drain (tab and pins 2+3), Source (pin 1), and Gate (pin 4).

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminalLow-inductance connection point for source return path; tied to PCB ground plane for noise control.
Pins 2 & 3 (Drain)Drain terminalElectrically and thermally connected to large copper area; primary heat extraction path to PCB.
Pin 4 (Gate)Control inputHigh-impedance MOS gate requiring <22 nC drive; sensitive to layout-induced ringing due to low VGS(th).

Key Features

FeatureDesign Value
Logic-level gate driveOperates fully enhanced at VGS ≥ 4.5 V-compatible with 3.3 V microcontrollers and PWM ICs without level-shifting.
Low FOM (Qg × RDS(on))~139 nC·mΩ - Balances switching and conduction loss for optimal efficiency in 300–1000 kHz DC/DC designs.
175 °C maximum junction temperatureEnables operation in thermally constrained environments (e.g., sealed telecom modules) without derating at full current.
RoHS-compliant Pb-free platingMeets JEDEC J-STD-20 reflow profiles and industrial environmental compliance requirements.
Integrated body diode with low QrrQrr ≤ 10 nC at 400 A/µs di/dt - Reduces shoot-through risk and EMI in synchronous buck topologies.

Applications

Server Point-of-Load RegulatorsIndustrial Motor Drive Half-Bridges

Use Scenario: High-current, high-density 12 V → 1.2 V conversion for CPU/GPU VRMs in rack-mounted servers.

IC Role / Device Role: Synchronous high-side switch in multiphase buck converter with 500–800 kHz switching frequency.

Use Value: 6.3 mΩ RDS(on) and 22 nC Qg minimize combined conduction and switching loss, enabling >92% efficiency at 50 A output.

Use Scenario: Half-bridge leg in 24 V BLDC motor drives for factory automation actuators.

IC Role / Device Role: Low-side switching element handling 50 A continuous current with fast commutation.

Use Value: 6 kV/µs dv/dt rating prevents false turn-on during high-slew-rate phase transitions, improving system reliability.

Telecom DC/DC ConvertersAutomotive ADAS Power Supplies

Use Scenario: Isolated 48 V → 12 V intermediate bus converter in 5G base station power systems.

IC Role / Device Role: Primary-side synchronous rectifier in active-clamp forward topology.

Use Value: 164 mJ EAS withstands transformer leakage energy spikes during clamp reset, eliminating need for snubbers.

Use Scenario: 12 V → 3.3 V/5 V power supply for radar sensor ECUs operating under under-hood thermal stress.

IC Role / Device Role: Secondary-side synchronous FET in buck regulator with extended temperature range requirement.

Use Value: 175 °C Tj,max and stable RDS(on) up to 150 °C ensure uninterrupted operation at ambient >105 °C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STL110N3LLH6RDS(on) = 5.5 mΩ @ 10 VGS; Qg = 27 nC; TO-263 packageHigher gate charge increases driver loss at >500 kHz; better conduction loss at lower frequenciesPrefer when optimizing for <300 kHz operation and minimal RDS(on) dominates efficiency budget
IRL3803PBFRDS(on) = 8.0 mΩ @ 10 VGS; Qg = 19 nC; TO-220 packageLarger RthJA (40 K/W vs. 40 K/W on same PCB) limits power density; through-hole mountingChoose only when through-hole assembly is required and thermal margin allows higher RDS(on)

Compared with STL110N3LLH6 and IRL3803PBF, IPB06N03LB delivers superior high-frequency efficiency due to its lower Qg × RDS(on) FOM and tighter thermal resistance-making it optimal for compact, high-switching-frequency POL and telecom converters where board space and thermal headroom are constrained.

Availability

IPB06N03LB is available at Aetrix Electronics and suitable for server point-of-load regulators, industrial motor drive half-bridges, and telecom DC/DC converters requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for IPB06N03LB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with leadership in silicon and wide-bandgap technologies.

The OptiMOS®2 product line targets high-efficiency, high-frequency power conversion-designed specifically for server VRMs, telecom power supplies, and motor control applications demanding low RDS(on), fast switching, and ruggedness.

FAQ

What is the maximum continuous drain current for IPB06N03LB at 100 °C case temperature?

The maximum continuous drain current is 50 A at TC = 100 °C, limited by bondwire capacity-not thermal constraints-as confirmed in the datasheet's "Maximum ratings" table. At this condition, junction temperature remains within 175 °C limit when RthJC = 1.8 K/W is maintained.

Does IPB06N03LB support gate drive from a 3.3 V microcontroller without level shifting?

Yes. With a gate threshold voltage of 1.2–2.0 V and full enhancement at VGS ≥ 4.5 V, IPB06N03LB achieves RDS(on) ≤ 9.3 mΩ at 30 A with 4.5 V drive-enabling direct interface to 3.3 V logic outputs when paired with appropriate gate resistor and layout to suppress ringing.

How does the body diode performance compare to discrete Schottky alternatives in synchronous rectification?

The integrated body diode has VSD = 0.92–1.2 V at 50 A and Qrr ≤ 10 nC, offering lower reverse recovery loss than standard silicon diodes but higher forward drop than 0.5 V Schottkys. It eliminates external component count and layout complexity, making it optimal where moderate VF is acceptable for cost and size savings.

Is IPB06N03LB suitable for avalanche-prone circuits like non-clamped inductive switching?

Yes. It is fully specified for single-pulse avalanche with EAS = 164 mJ at ID = 50 A and RGS = 25 Ω. This rating validates safe operation in flyback, boost, and LLC resonant converters where inductive energy must be absorbed internally without external clamping.

IPB06N03LB Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
50A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
6.3mOhm @ 50A, 10V
Vgs(th) (Max) @ Id:
2V @ 40µA
Gate Charge (Qg) (Max) @ Vgs:
22 nC @ 5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2782 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
83W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3

IPB06N03LB FAQ

1.How can I place an order for IPB06N03LB through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB06N03LB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB06N03LB reliable?

The price and inventory of IPB06N03LB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB06N03LB is usually 5 days.

3.What payment methods are accepted for IPB06N03LB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB06N03LB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPB06N03LB?

IPB06N03LB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB06N03LB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB06N03LB?

For technical support, including IPB06N03LB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB06N03LB requirements.

6.How does Aetrix verify that IPB06N03LB is sourced from the original manufacturer or authorized distributors?

All IPB06N03LB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB06N03LB meets industry standards.

7.What is the process for return or replacement of IPB06N03LB?

All IPB06N03LB units undergo pre-shipment inspection (PSI). If there is an issue with IPB06N03LB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB06N03LB part is unused and in its original packaging.

Return procedure for IPB06N03LB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IPB06N03LB Tags

  • IPB06N03LB
  • IPB06N03LB PDF
  • IPB06N03LB Datasheet
  • IPB06N03LB Specifications
  • IPB06N03LB Images
  • Infineon Technologies
  • Infineon Technologies IPB06N03LB
  • Buy IPB06N03LB
  • IPB06N03LB Price
  • IPB06N03LB Distributor
  • IPB06N03LB Supplier
  • IPB06N03LB Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER