Infineon Technologies IPB06N03LB G
- Part No.:
- IPB06N03LB G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB06N03LB G.pdf
- Description:
- MOSFET N-CH 30V 50A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:9,700
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Product details
Overview
IPB06N03LB from Infineon Technologies is a 30 V, 50 A N-channel logic-level OptiMOS®2 power MOSFET in PG-TO263-3 (D²PAK) package, featuring 6.3 mΩ max RDS(on) at VGS = 10 V, 1.8 K/W thermal resistance (junction-to-case), and 175 °C maximum operating temperature. It is engineered for high-frequency DC/DC converters where low conduction loss, fast switching, and robust dv/dt immunity are critical.
For engineers reviewing the IPB06N03LB datasheet, IPB06N03LB pinout, IPB06N03LB application, or IPB06N03LB equivalent, key selection criteria include its gate charge × RDS(on) figure-of-merit (FOM), 6 kV/µs dv/dt rating, 164 mJ single-pulse avalanche energy, and compatibility with 4.5 V logic-level drive in synchronous rectification and POL converter topologies.
Technical Context
This device employs a trench-based silicon process optimized for low RDS(on) and minimized gate charge. Its 22 nC total gate charge (Qg) and 6.4 nC gate-to-drain charge (Qgd) support efficient hard-switching up to several hundred kHz. The integrated body diode exhibits 10 nC reverse recovery charge (Qrr) and 0.92–1.2 V forward voltage at 50 A, enabling use in synchronous FET roles without external Schottky replacement.
The MOSFET is fully rated for 175 °C junction operation and qualified per JEDEC standards for industrial and automotive power supply applications. Its 1.8 K/W RthJC enables high-power density mounting on 40 mm × 40 mm FR4 PCBs with 6 cm² copper area, delivering 83 W power dissipation at TC = 25 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage for 12 V and 24 V input DC/DC stages |
| RDS(on), max | 6.3 mΩ @ VGS = 10 V - Enables ≤158 mW conduction loss at 50 A continuous current |
| ID, cont | 50 A @ TC = 25 °C - Sustained output current capability with standard heatsinking |
| Qg | 16–22 nC - Determines gate driver power requirement and switching speed in hard-switched converters |
| EAS | 164 mJ - Withstands single-pulse inductive energy during overcurrent or short-circuit events |
| dv/dt rating | 6 kV/µs - Resists false turn-on in high-di/dt synchronous buck or half-bridge configurations |
| Tj,max | 175 °C - Supports operation in sealed enclosures or high-ambient industrial environments |
Pinout & Package
IPB06N03LB uses the PG-TO263-3 (D²PAK) surface-mount package with exposed drain pad for thermal and electrical connection. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control terminal | Receives logic-level (≥4.5 V) drive signal; 1.2 Ω gate resistance limits ringing |
| Pin 2 (Drain) | High-side power node | Exposed copper tab - must be soldered to large PCB copper area for thermal and current path |
| Pin 3 (Source) | Reference node / return path | Connects to power ground or low-side switch source; defines gate drive reference |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V - compatible with 3.3 V and 5 V microcontrollers without level-shifting |
| Low Qg × RDS(on) FOM | ~139 mΩ·nC - balances switching loss and conduction loss for optimal efficiency in 300–1000 kHz converters |
| Robust avalanche capability | 164 mJ single-pulse EAS - eliminates need for external snubbers in non-isolated topologies |
| Enhanced dv/dt immunity | 6 kV/µs rating - prevents spurious turn-on during fast voltage transients across drain-source |
| Thermal performance | 1.8 K/W RthJC - enables >70 W sustained power handling with minimal heatsink footprint |
Applications
| Server VRM | Industrial DC/DC Converter |
|---|---|
Use Scenario: Point-of-load (POL) regulation for CPU/GPU core voltage in 1U rack servers. IC Role / Device Role / Timing Role: High-side synchronous rectifier in multiphase buck converter with 500 kHz–1 MHz switching frequency. Use Value: 6.3 mΩ RDS(on) and 22 nC Qg reduce both conduction and switching losses, improving full-load efficiency by ≥1.2% vs. legacy MOSFETs. | Use Scenario: Isolated 24 V to 5 V/12 V DC/DC module for PLC I/O power rails. IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward or asymmetrical half-bridge topology. Use Value: 175 °C Tj,max and 164 mJ EAS ensure reliable operation under overload and ambient temperatures up to 85 °C. |
| Automotive Body Control Module | Telecom Rectifier |
Use Scenario: Load switching and reverse polarity protection in 12 V battery-fed BCM sub-systems. IC Role / Device Role / Timing Role: Low-side high-current switch controlling solenoids, relays, and LED arrays. Use Value: Logic-level gate threshold (1.2–2.0 V) ensures clean turn-on with automotive MCU GPIOs; 50 A ID supports peak inrush currents. | Use Scenario: Secondary-side synchronous rectifier in 48 V telecom rectifier modules. IC Role / Device Role / Timing Role: Synchronous FET replacing Schottky diodes in LLC resonant converter output stage. Use Value: 10 nC Qrr and 0.92 V VSD minimize reverse recovery loss and forward conduction loss, raising efficiency above 96% at 20 A load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N3LLH6 | 30 V, 220 A, 2.2 mΩ RDS(on), DFN8 5×6 mm package, higher current but larger footprint | Targeted at higher-current POLs requiring >100 A per phase; not drop-in due to different package and pinout | Select when board space allows larger package and system requires <2 mΩ conduction loss at 100 A |
| IRL3803PBF | 30 V, 68 A, 8.0 mΩ RDS(on), TO-220AB package, higher RDS(on) and thermal resistance (RthJC = 2.5 K/W) | Suitable for lower-frequency (<200 kHz), lower-density designs where through-hole mounting is preferred | Select only if thermal budget permits higher junction rise or TO-220 mechanical integration is mandatory |
Compared with STL220N3LLH6 and IRL3803PBF, IPB06N03LB delivers optimal balance of low RDS(on), compact D²PAK footprint, and proven 175 °C reliability-making it preferred for space-constrained, high-frequency industrial and telecom DC/DC converters where thermal management and gate drive simplicity are critical.
Availability
IPB06N03LB is available at Aetrix Electronics and suitable for server VRMs, industrial DC/DC converters, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for IPB06N03LB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
The OptiMOS®2 product line was developed specifically for high-efficiency, high-frequency power conversion in server, telecom, and industrial SMPS applications-emphasizing low FOM, robustness, and logic-level drivability.
FAQ
What is the maximum recommended gate drive voltage for IPB06N03LB?
The absolute maximum gate-source voltage is ±20 V, but the device is fully enhanced at VGS ≥ 4.5 V. For reliable long-term operation, Infineon recommends limiting VGS to 10–15 V in hard-switched applications to avoid overstressing the gate oxide while maintaining low RDS(on). Driving above 15 V yields diminishing RDS(on) improvement and increases risk of gate leakage acceleration.
Can IPB06N03LB be used as a synchronous rectifier in a 48 V to 12 V LLC converter?
Yes. With its 0.92–1.2 V body diode forward voltage at 50 A and only 10 nC Qrr, IPB06N03LB reduces reverse recovery loss significantly versus Schottky diodes. Its 6.3 mΩ RDS(on) ensures low conduction loss at typical LLC secondary-side currents, and its 6 kV/µs dv/dt rating prevents false turn-on during rapid VDS transitions in resonant topologies.
How does the thermal resistance of IPB06N03LB compare between junction-to-case and junction-to-ambient?
RthJC is specified at 1.8 K/W (measured directly from die to case), while RthJA depends on PCB layout: 62 K/W for minimal footprint and 40 K/W with 6 cm² copper area. Unlike RthJA, RthJC is process-controlled and repeatable-making it the reliable basis for thermal design. Actual junction temperature must be calculated using RthJC + PCB interface resistance + heatsink RthCA.
Is IPB06N03LB suitable for automotive AEC-Q101 qualification?
No. While IPB06N03LB is JEDEC-qualified for industrial target applications and rated for 175 °C operation, it is not AEC-Q101 certified. Infineon offers the AUIRF3803S and AUIRL3803S as automotive-qualified equivalents with identical voltage/current ratings but additional stress testing and traceability requirements for automotive use.
IPB06N03LB G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6.3mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 40µA
- Gate Charge (Qg) (Max) @ Vgs:
- 22 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2782 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 83W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3
IPB06N03LB G FAQ
1.How can I place an order for IPB06N03LB G through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB06N03LB G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB06N03LB G reliable?
The price and inventory of IPB06N03LB G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB06N03LB G is usually 5 days.
3.What payment methods are accepted for IPB06N03LB G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB06N03LB G transactions.
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4.How is shipping managed for IPB06N03LB G?
IPB06N03LB G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB06N03LB G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB06N03LB G?
For technical support, including IPB06N03LB G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB06N03LB G requirements.
6.How does Aetrix verify that IPB06N03LB G is sourced from the original manufacturer or authorized distributors?
All IPB06N03LB G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB06N03LB G meets industry standards.
7.What is the process for return or replacement of IPB06N03LB G?
All IPB06N03LB G units undergo pre-shipment inspection (PSI). If there is an issue with IPB06N03LB G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB06N03LB G part is unused and in its original packaging.
Return procedure for IPB06N03LB G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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