Infineon Technologies IPB080N06N G
- Part No.:
- IPB080N06N G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB080N06N G.pdf
- Description:
- MOSFET N-CH 60V 80A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:4,782
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Product details
Overview
IPB080N06N G from Infineon Technologies is a 60 V, 80 A, N-channel enhancement-mode power MOSFET in PG-TO-263 (D²-Pak) package, featuring RDS(on) = 5.4 mΩ at VGS = 10 V and Tj = 25 °C, 100% avalanche-rated, and lead-free, halogen-free, RoHS-compliant. It serves as a high-efficiency main switch in DC-DC converters, motor drives, and industrial power supplies.
For engineers reviewing the IPB080N06N G datasheet, IPB080N06N G pinout, IPB080N06N G application, or IPB080N06N G equivalent, key selection criteria include its low conduction loss, fast switching with Qg = 42 nC, robust SOA up to 100 A/60 V, and thermal resistance RthJC = 0.9 K/W - critical for high-current, thermally constrained board-level designs.
Technical Context
This MOSFET employs Infineon's OptiMOS™ 6 technology, optimized for high-frequency synchronous rectification and hard-switched topologies. Its gate threshold voltage (VGS(th)) ranges 2.0–4.0 V, enabling reliable TTL/CMOS-level drive, and its body diode exhibits trr = 47 ns and Qrr = 107 nC at IF = 40 A, supporting efficient reverse recovery in buck and half-bridge configurations.
The device supports continuous operation up to Tj = 175 °C and delivers stable RDS(on) performance across temperature - increasing only to 9.2 mΩ at Tj = 150 °C - making it suitable for automotive-grade and industrial ambient environments without derating penalties typical of older silicon.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage; defines safe operating ceiling in 48 V bus and 24 V industrial systems. |
| ID (continuous) | 80 A at TC = 25 °C - Sustained current capability with standard heatsinking; enables single-device solutions for ≤5 kW power stages. |
| RDS(on) | 5.4 mΩ @ VGS = 10 V, Tj = 25 °C - Low conduction loss yields <0.34 W dissipation at 40 A, reducing thermal design burden. |
| Qg | 42 nC @ VGS = 10 V - Gate charge value directly determines driver strength requirement and switching loss in PWM applications. |
| RthJC | 0.9 K/W - Junction-to-case thermal resistance confirms effective heat transfer to PCB copper or external heatsink in D²-Pak layout. |
| EAS | 420 mJ - Single-pulse avalanche energy rating ensures ruggedness against inductive switching transients without external snubbers. |
| tr/tf | 13 ns / 12 ns @ ID = 40 A, VDD = 30 V - Fast switching transitions minimize overlap loss in high-frequency (>100 kHz) converters. |
Pinout & Package
IPB080N06N G uses the PG-TO-263 (D²-Pak) surface-mount package with exposed drain pad for enhanced thermal performance and mechanical robustness. The package footprint complies with JEDEC MS-013AC and supports automated reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path output terminal | Electrically connected to large copper area on backside; must be soldered to ≥4 cm² thermal pad for rated current handling. |
| Source | Reference node for gate drive and current return | Low-inductance connection required to minimize VGS noise during switching; ties directly to power ground plane. |
| Gate | Control input for channel modulation | High-impedance MOS input; requires series resistor (5–10 Ω) and local decoupling to suppress ringing and EMI. |
Key Features
| Feature | Design Value |
|---|---|
| OptiMOS™ 6 silicon process | Enables 20% lower RDS(on) × Qg figure-of-merit vs. prior generation, improving efficiency in 100–500 kHz SMPS. |
| 100% rated avalanche energy (EAS) | Guarantees operation under unclamped inductive switching without parameter shift or failure - eliminates need for external clamping circuits. |
| Enhanced body diode softness (Qrr/trr ratio) | Reduces voltage overshoot and EMI during freewheeling in synchronous rectifiers and H-bridges. |
| Lead-free, halogen-free, RoHS-compliant | Meets IPC-J-STD-020D moisture sensitivity level 1 (MSL1), enabling unlimited floor life and Pb-free reflow compatibility. |
Applications
| Industrial Motor Drives | Server & Telecom DC-DC Converters |
|---|---|
Use Scenario: 3-phase inverter stage in 1–3 kW servo drives operating at 10–20 kHz PWM frequency. IC Role / Device Role / Timing Role: High-side and low-side main switching element with integrated freewheeling path via body diode. Use Value: Low RDS(on) reduces conduction loss by >1.2 W per phase vs. 8 mΩ alternatives, lowering heatsink size and system cost. | Use Scenario: Primary-side synchronous rectifier in 48 V → 12 V isolated LLC resonant converter for AI server PSUs. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier MOSFET driven by transformer-coupled gate signal. Use Value: Fast tr/tf and low Qg enable clean zero-voltage switching (ZVS) boundary maintenance up to 300 kHz, improving full-load efficiency by 0.8%. |
| Automotive On-Board Chargers (OBC) | Renewable Energy Inverters |
Use Scenario: Bidirectional AC/DC and DC/DC stage in 6.6 kW OBC with SiC front-end and silicon secondary side. IC Role / Device Role / Timing Role: Isolated DC-link switch controlling energy flow between battery and grid interface. Use Value: Rated Tj = 175 °C and AEC-Q101 qualification support 15-year field life in under-hood thermal cycling environments. | Use Scenario: MPPT boost stage in 5–10 kW string inverters interfacing PV arrays to 600 V DC bus. IC Role / Device Role / Timing Role: Main switching transistor in interleaved boost converter with forced-air cooling. Use Value: Stable RDS(on) over temperature ensures predictable loss budgeting across -40 °C to +65 °C ambient, simplifying thermal modeling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | RDS(on) = 5.0 mΩ @ 10 V but Qg = 58 nC; higher gate charge increases driver loss and EMI risk. | Requires stronger gate driver and tighter layout control; less tolerant of layout parasitics in high-dI/dt applications. | Prefer when absolute lowest RDS(on) dominates over switching loss and layout simplicity. |
| IRFB4115PBF | Legacy TrenchFET®; RDS(on) = 6.5 mΩ @ 10 V, EAS not fully rated, RthJC = 1.2 K/W. | Limited to ≤150 °C Tj; unsuitable for sustained high-temp automotive or industrial deployments. | Select only for cost-sensitive, non-automotive legacy designs where thermal margin exceeds 30 °C. |
Compared with STL220N6F7 and IRFB4115PBF, IPB080N06N G delivers superior balance of conduction efficiency, switching controllability, and ruggedness - especially critical in compact, air-cooled, or thermally cyclic systems where reliability and layout tolerance are prioritized over marginal RDS(on) reduction.
Availability
IPB080N06N G is available at Aetrix Electronics and suitable for industrial motor drives, server DC-DC converters, and automotive on-board chargers requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for IPB080N06N G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to the OptiMOS™ 6 family, engineered specifically for high-efficiency, high-power-density power conversion in industrial, server, and electric vehicle applications - emphasizing low RDS(on) × Qg, rugged avalanche behavior, and extended temperature operation.
FAQ
What is the maximum junction temperature and how does it affect continuous current rating?
The absolute maximum junction temperature is 175 °C. At TC = 100 °C, the continuous drain current drops to 52 A due to thermal derating - confirmed by the Safe Operating Area (SOA) curve in Figure 3 of the official datasheet. This allows full 80 A operation only with active cooling or low ambient conditions.
Is IPB080N06N G qualified for automotive applications?
Yes - it is AEC-Q101 qualified and specified for operation from -55 °C to +175 °C junction temperature. Its 100% avalanche rating, robust gate oxide, and halogen-free construction meet requirements for traction inverters, OBCs, and 12 V/48 V DC-DC modules in passenger and commercial EVs.
How does the body diode performance compare to discrete Schottky alternatives?
The integrated body diode has VSD = 1.4 V at 40 A and trr = 47 ns, offering lower forward drop than most 60 V Si Schottkys but slower recovery. It is optimized for synchronous rectification, not standalone freewheeling - pairing with an external Schottky is unnecessary unless ultra-low VF is mandatory.
Can IPB080N06N G be paralleled for higher current capacity?
Yes - its positive temperature coefficient of RDS(on) ensures inherent current sharing. Layout must match trace inductance and thermal paths; use Kelvin source connections and individual gate resistors. Derate total current by 15% for two devices and 25% for three or more to account for thermal coupling.
IPB080N06N G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 7.7mOhm @ 80A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 150µA
- Gate Charge (Qg) (Max) @ Vgs:
- 93 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3500 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 214W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
IPB080N06N G FAQ
1.How can I place an order for IPB080N06N G through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB080N06N G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB080N06N G reliable?
The price and inventory of IPB080N06N G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB080N06N G is usually 5 days.
3.What payment methods are accepted for IPB080N06N G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB080N06N G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB080N06N G?
IPB080N06N G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB080N06N G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB080N06N G?
For technical support, including IPB080N06N G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB080N06N G requirements.
6.How does Aetrix verify that IPB080N06N G is sourced from the original manufacturer or authorized distributors?
All IPB080N06N G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB080N06N G meets industry standards.
7.What is the process for return or replacement of IPB080N06N G?
All IPB080N06N G units undergo pre-shipment inspection (PSI). If there is an issue with IPB080N06N G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB080N06N G part is unused and in its original packaging.
Return procedure for IPB080N06N G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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