Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IPB09N03LA

Part No.:
IPB09N03LA
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB09N03LA.pdf
Description:
MOSFET N-CH 25V 50A TO263-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,367

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IPB09N03LA G from Infineon Technologies is an N-channel logic-level Power MOSFET in PG-TO263-3-2 package, rated for 25 V VDS, 50 A continuous drain current at TC = 25 °C, and 8.9 mΩ max RDS(on) at VGS = 10 V. It features dv/dt ruggedness (6 kV/µs), 175 °C maximum junction temperature, and is optimized for high-frequency DC/DC converters in server VRMs and POL modules.

For engineers reviewing the IPB09N03LA datasheet, IPB09N03LA pinout, IPB09N03LA application, or IPB09N03LA equivalent, key selection criteria include its low gate charge × RDS(on) figure of merit (FOM), JEDEC-qualified reliability for industrial power stages, and thermal resistance (RthJC = 2.4 K/W) enabling high-current operation on standard FR4 PCBs.

Technical Context

This OptiMOS®2 device uses trench-gate silicon technology to achieve low RDS(on) and fast switching with controlled Qgd (2.8–4.3 nC) and Qgs (4.3–5.7 nC). Its gate threshold voltage (1.2–2.0 V typ.) ensures robust logic-level drive compatibility with 3.3 V and 5 V controllers.

The integrated body diode exhibits low forward voltage (0.99–1.2 V at IF = 50 A, Tj = 25 °C) and low reverse recovery charge (Qrr ≤ 10 nC), supporting synchronous rectification in buck converters without external Schottky replacement.

Key Specifications

ParameterValue and Actual Design Meaning
VDS25 V - Maximum blocking voltage compatible with 12 V input bus systems and 5 V logic control
RDS(on) max8.9 mΩ at VGS = 10 V - Enables <1 W conduction loss at 30 A, critical for high-efficiency POL designs
ID cont.50 A at TC = 25 °C - Supports high-current output stages without forced air cooling
Qg total10–13 nC - Low gate drive energy reduces controller loading and enables >1 MHz switching
RthJC2.4 K/W - Allows direct thermal coupling to heatsink or copper pour, simplifying thermal design
dv/dt rating6 kV/µs - Ensures immunity to parasitic turn-on in hard-switched topologies
Tj max175 °C - Permits operation in high-ambient environments such as telecom rectifiers and motor drives

Pinout & Package

PG-TO263-3-2 (D²PAK) package with exposed drain pad for thermal and electrical connection. Standard 3-terminal configuration: Gate (G), Drain (D), Source (S).

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (G)Gate terminalLogic-level input requiring ≤2.0 V threshold; low Ciss (1235–1642 pF) minimizes driver stress
Pin 2 (D)Drain terminal / exposed padMain power path and primary thermal interface; connected directly to PCB copper for heat dissipation
Pin 3 (S)Source terminalReference node for gate drive and current sensing; low-inductance layout essential for EMI control

Key Features

FeatureDesign Value
Logic-level gate driveOperates fully enhanced at VGS ≥ 4.5 V - eliminates need for gate boosters in 3.3 V microcontroller-based designs
Low FOM (Qg × RDS(on))~90–115 nC·mΩ - balances switching loss and conduction loss for optimal efficiency at 300–1000 kHz
JEDEC-qualified reliabilityQualified per J-STD-20/JESD22 - validated for reflow, humidity, and temperature cycling in industrial production
Enhanced dv/dt immunity6 kV/µs rated - prevents false triggering during fast voltage transients in half-bridge configurations
Integrated robust body diodeQrr ≤ 10 nC, VSD ≤ 1.2 V - enables synchronous rectification without external diode in buck converters

Applications

Server Point-of-Load (POL) ConverterIndustrial DC/DC Module

Use Scenario: High-current, high-efficiency 12 V-to-1 V conversion for CPU/GPU core supplies in rack-mounted servers.

IC Role / Device Role / Timing Role: Synchronous high-side switch in multiphase buck converter, operating at 500–800 kHz with precise gate timing.

Use Value: 8.9 mΩ RDS(on) and 13 nC Qg enable >94% efficiency at 40 A load while maintaining thermal margin on 4-layer PCB.

Use Scenario: Compact 24 V-to-5 V isolated or non-isolated DC/DC module for PLC I/O power rails.

IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward or secondary-side synchronous rectifier in LLC resonant topology.

Use Value: 175 °C Tj rating and 2.4 K/W RthJC ensure stable operation under 70 °C ambient without derating in sealed enclosures.

Telecom Rectifier UnitMotor Drive Half-Bridge

Use Scenario: Secondary-side synchronous rectification in 48 V telecom rectifier with 12 V output.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier paired with SiC diode or GaN HEMT in center-tapped or full-wave configuration.

Use Value: Low VSD (0.99 V) and fast tf (3.2–4.8 ns) reduce conduction loss and minimize reverse recovery losses vs. discrete Schottky.

Use Scenario: Low-voltage (<30 V) BLDC motor gate driver stage in fan/pump control modules.

IC Role / Device Role / Timing Role: Low-side switch in half-bridge driving 12–24 V brushed or brushless motors at PWM frequencies up to 20 kHz.

Use Value: 50 A ID rating and 6 kV/µs dv/dt immunity prevent shoot-through and gate oscillation during rapid commutation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRL3803PbFRDS(on) = 12 mΩ @ VGS = 5 V; higher Qg (24 nC); TO-220 packageLarger footprint and higher thermal resistance (RthJC = 3.0 K/W); less suitable for high-density POL layoutsPrefer IPB09N03LA for space-constrained, high-frequency designs; choose IRL3803PbF only if TO-220 mechanical fit is mandatory
STL220N3LLH6RDS(on) = 1.8 mΩ @ VGS = 10 V; 30 V rating; PowerFLAT 5x6 packageLower RDS(on) but reduced voltage margin; smaller thermal pad area limits power handling above 30 ASelect STL220N3LLH6 for ultra-low-loss <30 A applications with strict height constraints; retain IPB09N03LA for 50 A duty and 25 V system margin

Compared with IRL3803PbF and STL220N3LLH6, IPB09N03LA uniquely balances 50 A current capability, 2.4 K/W thermal resistance, and 8.9 mΩ RDS(on) in a D²PAK package-making it optimal for thermally demanding, medium-voltage POL and industrial DC/DC where both current headroom and layout density matter.

Availability

IPB09N03LA G is available at Aetrix Electronics and suitable for server point-of-load converters, industrial DC/DC modules, and telecom rectifier units requiring stable component supply and long-term manufacturability.

Supply support for IPB09N03LA G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

The OptiMOS®2 product line delivers high-performance, logic-level N-channel MOSFETs optimized for high-frequency switching in power conversion systems where efficiency, thermal performance, and reliability are critical.

FAQ

Is IPB09N03LA G suitable for synchronous rectification?

Yes. Its low reverse recovery charge (Qrr ≤ 10 nC), low forward voltage (VSD ≤ 1.2 V at 50 A), and fast fall time (tf = 3.2–4.8 ns) make it well-suited as a synchronous rectifier in buck and forward converters. The body diode's soft recovery behavior reduces EMI compared to standard Schottky diodes.

What is the maximum safe operating frequency for IPB09N03LA G?

Based on its gate charge (Qg = 10–13 nC) and switching times (tr = 73–109 ns, tf = 3.2–4.8 ns), IPB09N03LA G supports reliable operation up to 1 MHz in hard-switched topologies when driven with ≤2.7 Ω gate resistance and adequate PCB layout. Efficiency peaks between 300–800 kHz for typical POL applications.

Does IPB09N03LA G require a gate resistor for stability?

Yes. A series gate resistor (typically 1–5 Ω) is recommended to dampen ringing caused by gate-drain capacitance (Crss = 61–92 pF) and PCB inductance. Without it, overshoot and oscillation may occur during fast switching, especially in half-bridge configurations with high dv/dt edges.

Can IPB09N03LA G be used in parallel configurations?

Yes, but with careful attention to layout symmetry and gate drive matching. Its positive temperature coefficient for RDS(on) (increases with Tj) provides inherent current sharing. Use identical gate resistors, Kelvin source connections, and matched trace lengths to avoid imbalance-verified in multi-phase VRM reference designs from Infineon.

IPB09N03LA Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
25 V
Current - Continuous Drain (Id) @ 25°C:
50A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
8.9mOhm @ 30A, 10V
Vgs(th) (Max) @ Id:
2V @ 20µA
Gate Charge (Qg) (Max) @ Vgs:
13 nC @ 5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1642 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
63W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-2

IPB09N03LA FAQ

1.How can I place an order for IPB09N03LA through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB09N03LA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB09N03LA reliable?

The price and inventory of IPB09N03LA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB09N03LA is usually 5 days.

3.What payment methods are accepted for IPB09N03LA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB09N03LA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPB09N03LA?

IPB09N03LA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB09N03LA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB09N03LA?

For technical support, including IPB09N03LA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB09N03LA requirements.

6.How does Aetrix verify that IPB09N03LA is sourced from the original manufacturer or authorized distributors?

All IPB09N03LA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB09N03LA meets industry standards.

7.What is the process for return or replacement of IPB09N03LA?

All IPB09N03LA units undergo pre-shipment inspection (PSI). If there is an issue with IPB09N03LA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB09N03LA part is unused and in its original packaging.

Return procedure for IPB09N03LA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IPB09N03LA Tags

  • IPB09N03LA
  • IPB09N03LA PDF
  • IPB09N03LA Datasheet
  • IPB09N03LA Specifications
  • IPB09N03LA Images
  • Infineon Technologies
  • Infineon Technologies IPB09N03LA
  • Buy IPB09N03LA
  • IPB09N03LA Price
  • IPB09N03LA Distributor
  • IPB09N03LA Supplier
  • IPB09N03LA Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER