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Infineon Technologies IPB35N10S3L26ATMA1

Part No.:
IPB35N10S3L26ATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB35N10S3L26ATMA1.pdf
Description:
MOSFET N-CH 100V 35A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,411

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Product details

Overview

IPB35N10S3L26ATMA1 from Infineon Technologies is an AEC-Q101 qualified N-channel enhancement-mode power MOSFET in PG-TO263-3-2 package, rated for 100 V VDS, 35 A continuous drain current at TC = 25 °C, and 26.3 mΩ RDS(on) at VGS = 10 V - used in automotive DC-DC converters, motor control inverters, and high-reliability industrial SMPS.

For engineers reviewing the IPB35N10S3L26ATMA1 datasheet, IPB35N10S3L26ATMA1 pinout, IPB35N10S3L26ATMA1 application, or IPB35N10S3L26ATMA1 equivalent, key selection criteria include avalanche ruggedness (175 mJ single-pulse), 175 °C max junction temperature, gate plateau voltage (3.7 V), and thermal resistance RthJC = 2.1 K/W for thermal design validation.

Technical Context

This OptiMOS™-T device employs trench-gate superjunction technology optimized for low conduction and switching losses in hard-switched automotive power stages. Its 4.5 V gate drive capability enables compatibility with 5 V logic controllers, while the integrated body diode supports synchronous rectification and freewheeling in half-bridge topologies.

The MOSFET features fully characterized dynamic parameters including Ciss = 2700 pF (max), Qg = 39 nC (max), and tr/tf ≤ 4 ns/3 ns - enabling high-frequency operation up to 500 kHz in compact power supplies without excessive gate drive loss.

Key Specifications

ParameterValue and Actual Design Meaning
VDS100 V - supports 48 V and 60 V nominal bus systems with 20 % overvoltage margin
RDS(on) max26.3 mΩ at VGS = 10 V - limits conduction loss to ≤ 32 W at 35 A continuous
ID cont35 A at TC = 25 °C - requires ≥6 cm² copper area on FR4 PCB for thermal compliance
EAS175 mJ (ID = 17 A) - enables robust unclamped inductive switching in motor drives
RthJC2.1 K/W - allows direct heatsink mounting with minimal thermal interface resistance
Qg39 nC max - determines gate driver peak current requirement (~12 A for 3.5 Ω RG)
VGS(th)1.2–2.4 V - ensures reliable turn-on with standard 3.3 V or 5 V microcontroller GPIO

Pinout & Package

Package: PG-TO263-3-2 (D²PAK), surface-mount, isolated drain tab, 3-pin configuration with exposed drain pad for thermal and electrical connection.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminalLow-side reference node; connects to ground or current-sense shunt
Pin 2 (Gate)Control inputHigh-impedance MOS gate requiring <100 nA leakage; sensitive to ESD
Pin 3 (Drain)Power output / high-side switch nodeExposed metal tab - electrically and thermally connected to drain; must be insulated from heatsink unless referenced to same potential

Key Features

FeatureDesign Value
AEC-Q101 qualificationValidated for automotive under-hood applications including engine control and ADAS power stages
100 % avalanche testedGuarantees single-pulse ruggedness up to 175 mJ without parameter shift or failure
MSL1 reflow ratingWithstands lead-free reflow up to 260 °C peak - compatible with standard SMT assembly lines
Integrated body diodeVSD = 1.2 V max at 35 A - enables bidirectional current handling in H-bridge freewheel paths
175 °C operating temperatureSupports extended thermal derating in sealed enclosures or high-ambient environments

Applications

Automotive DC-DC ConvertersIndustrial Motor Drives

Use Scenario: 12 V to 48 V bidirectional buck-boost converter in 48 V mild hybrid vehicles.

IC Role / Device Role / Timing Role: High-side synchronous rectifier MOSFET in interleaved phase-leg configuration.

Use Value: Low RDS(on) and fast switching reduce conduction and transition losses by >18 % vs. legacy TrenchMOS devices.

Use Scenario: 3-phase inverter stage for 0.75 kW BLDC motor in HVAC compressors.

IC Role / Device Role / Timing Role: Low-side switching element with integrated freewheeling diode.

Use Value: 79 ns trr and 150 nC Qrr minimize diode reverse recovery loss and EMI generation.

Server PSU Primary SwitchEV Onboard Charger (OBC) PFC Stage

Use Scenario: Primary-side switch in 800 W resonant LLC converter for AI server racks.

IC Role / Device Role / Timing Role: Hard-switched MOSFET operating at 250–350 kHz with zero-voltage switching assist.

Use Value: Coss = 600 pF max ensures predictable dead-time behavior and ZVS boundary stability.

Use Scenario: Boost switch in 6.6 kW two-stage OBC AC/DC front-end.

IC Role / Device Role / Timing Role: High-current, high-reliability switch subjected to repetitive surge and line transients.

Use Value: 140 A pulsed drain rating and 100 % avalanche test ensure field durability across 15-year vehicle lifecycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 100 V power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STL34N10LH6AGRDS(on) = 28 mΩ (typ), Qg = 34 nC, no AEC-Q101 certificationTargeted at industrial consumer-grade SMPS, not automotive qualifiedSelect only if AEC-Q101 is not required and thermal margin permits higher RDS(on)
IXTP35N10PTO-220 package, RDS(on) = 30 mΩ, RthJC = 2.5 K/W, non-automotiveThrough-hole mounting; lower power density and higher thermal resistancePrefer for prototyping or low-volume industrial designs where SMT assembly is unavailable

Compared with STL34N10LH6AG and IXTP35N10P, IPB35N10S3L26ATMA1 delivers superior automotive reliability, lower thermal resistance, and tighter RDS(on) tolerance - critical for volume production in safety-critical 48 V systems.

Availability

IPB35N10S3L26ATMA1 is available at Aetrix Electronics and suitable for automotive DC-DC converters, industrial motor drives, and EV onboard chargers requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for IPB35N10S3L26ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with global manufacturing and R&D infrastructure.

This device belongs to the OptiMOS™-T product line - engineered specifically for high-efficiency, high-reliability automotive power conversion where thermal robustness, avalanche immunity, and AEC-Q101 compliance are mandatory.

FAQ

What is the maximum allowable gate-source voltage for IPB35N10S3L26ATMA1?

The absolute maximum VGS is ±20 V. Operation beyond this range risks irreversible gate oxide damage. For reliable long-term use, gate drive should be clamped to +12 V to +15 V during switching and held at 0 V when off - especially under high dv/dt conditions where Miller-induced turn-on may occur.

Does IPB35N10S3L26ATMA1 require a gate resistor, and what value is recommended?

Yes - a gate resistor is required to control dV/dt and suppress oscillation. With typical Qg = 34.5 nC and target tr ≈ 5 ns, a 3.5 Ω resistor is recommended per Infineon's evaluation board design. Lower values increase EMI risk; higher values raise switching losses and thermal stress on the driver.

Can IPB35N10S3L26ATMA1 be used in parallel configurations?

Yes, but only with matched devices and symmetrical PCB layout. Its positive RDS(on) temperature coefficient (α = 0.56) enables inherent current sharing above 100 °C. However, gate drive skew and parasitic inductance must be minimized - differential gate resistors and Kelvin source connections are strongly advised.

Is the drain tab electrically isolated in the PG-TO263-3-2 package?

No - the exposed drain tab is directly connected to the drain terminal (Pin 3). It must be electrically insulated from the heatsink using a thermally conductive but electrically isolating pad (e.g., ceramic or silicone-based insulator) unless the heatsink is referenced to the drain potential in the circuit.

IPB35N10S3L26ATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
35A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
26.3mOhm @ 35A, 10V
Vgs(th) (Max) @ Id:
2.4V @ 39µA
Gate Charge (Qg) (Max) @ Vgs:
39 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2700 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
71W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3

IPB35N10S3L26ATMA1 FAQ

1.How can I place an order for IPB35N10S3L26ATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB35N10S3L26ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB35N10S3L26ATMA1 reliable?

The price and inventory of IPB35N10S3L26ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB35N10S3L26ATMA1 is usually 5 days.

3.What payment methods are accepted for IPB35N10S3L26ATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB35N10S3L26ATMA1 transactions.

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4.How is shipping managed for IPB35N10S3L26ATMA1?

IPB35N10S3L26ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB35N10S3L26ATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB35N10S3L26ATMA1?

For technical support, including IPB35N10S3L26ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB35N10S3L26ATMA1 requirements.

6.How does Aetrix verify that IPB35N10S3L26ATMA1 is sourced from the original manufacturer or authorized distributors?

All IPB35N10S3L26ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB35N10S3L26ATMA1 meets industry standards.

7.What is the process for return or replacement of IPB35N10S3L26ATMA1?

All IPB35N10S3L26ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB35N10S3L26ATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB35N10S3L26ATMA1 part is unused and in its original packaging.

Return procedure for IPB35N10S3L26ATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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