Infineon Technologies IPB47N10S33ATMA1
- Part No.:
- IPB47N10S33ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB47N10S33ATMA1.pdf
- Description:
- MOSFET N-CH 100V 47A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:3,052
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Product details
Overview
IPB47N10S33ATMA1 from Infineon Technologies is an N-channel enhancement-mode SIPMOS™ power MOSFET in PG-TO263-3-2 (D²PAK) package, rated for 100 V VDS, 47 A continuous drain current at TC = 25°C, and 33 mΩ RDS(on) at VGS = 10 V. It operates up to 175°C junction temperature, features avalanche rating (EAS = 400 mJ), and is optimized for high-efficiency DC-DC converters and motor control inverters.
For engineers reviewing the IPB47N10S33ATMA1 datasheet, IPB47N10S33ATMA1 pinout, IPB47N10S33ATMA1 application, or IPB47N10S33ATMA1 equivalent, key selection criteria include its 6 kV/µs dv/dt rating, low gate charge (Qg = 70–105 nC), robust reverse diode (VSD = 1.1–1.5 V @ IF = 94 A), and thermal resistance RthJC = 0.85 K/W - critical for thermally constrained industrial switching designs.
Technical Context
This MOSFET employs planar SIPMOS technology with optimized cell layout for low conduction and switching losses. Its gate threshold voltage (VGS(th) = 2.1–4.0 V) ensures reliable turn-on with standard 10 V gate drivers, while the 2000–2500 pF input capacitance (Ciss) and 190–240 pF reverse transfer capacitance (Crss) support stable high-frequency operation up to 100 kHz in hard-switched topologies.
The integrated body diode exhibits fast recovery (trr = 100–150 ns, Qrr = 400–600 nC) and low forward voltage (VSD ≤ 1.5 V), enabling efficient freewheeling in synchronous rectification and half-bridge configurations without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - supports 48 V and 60 V bus systems with 2× safety margin against transients |
| RDS(on) | 33 mΩ max @ VGS = 10 V, ID = 33 A - enables <1.1 W conduction loss at 33 A |
| ID (continuous) | 47 A @ TC = 25°C - delivers high current density in compact D²PAK footprint |
| EAS | 400 mJ single-pulse avalanche energy - withstands inductive load switching surges without failure |
| dv/dt rating | 6 kV/µs - immune to false triggering in noisy high-dI/dt environments |
| Qg | 70–105 nC - balances switching speed and gate drive power requirements |
| RthJC | 0.85 K/W - allows direct heatsink mounting for thermal management in space-constrained PCBs |
Pinout & Package
IPB47N10S33ATMA1 uses the PG-TO263-3-2 (D²PAK) surface-mount package with exposed drain pad for thermal and electrical performance. The three terminals are arranged in a single-row configuration compatible with automated assembly and high-current PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (low-side reference) | Connected to ground or low-side node; carries full load current back to source |
| Pin 2 (Gate) | Control input | High-impedance MOS gate requiring <100 nA leakage; driven by 10 V logic-level signal |
| Pin 3 (Drain) | Power output / high-side switch node | Exposed copper pad on underside - electrically and thermally connected to drain; must be soldered to large copper area |
Key Features
| Feature | Design Value |
|---|---|
| Avalanche-rated operation | Guarantees ruggedness under unclamped inductive switching (EAS = 400 mJ), eliminating need for external snubbers in motor drives |
| 175°C maximum junction temperature | Enables operation in sealed enclosures or high-ambient environments (e.g., automotive under-hood, industrial PLCs) without derating |
| Low Crss (190–240 pF) | Reduces Miller feedback, improving noise immunity and enabling stable 100 kHz+ PWM in half-bridge configurations |
| Lead-free (RoHS-compliant) green package | Meets IPC-J-STD-020 moisture sensitivity level 3 (MSL3), suitable for standard reflow profiles without baking |
| Fast body diode (trr = 100–150 ns) | Minimizes reverse recovery loss in synchronous buck and LLC resonant converters, improving efficiency >0.5% at 200 kHz |
Applications
| Motor Drive Inverter | Industrial DC-DC Converter |
|---|---|
Use Scenario: 3-phase BLDC inverter stage in HVAC compressors and servo drives operating at 20–50 kHz PWM. IC Role / Device Role / Timing Role: High-side and low-side switching element in 6-pack IGBT/MOSFET modules; handles 47 A peak phase current with <1.5 V saturation drop. Use Value: Avalanche rating and 6 kV/µs dv/dt tolerance prevent shoot-through during bus transients, extending system reliability beyond 10 years MTBF. | Use Scenario: Primary-side switch in isolated 48 V-to-12 V telecom DC-DC converters with synchronous rectification. IC Role / Device Role / Timing Role: Main power switch in active-clamp forward or phase-shifted full-bridge topology; switches at 200 kHz with 70–105 nC gate charge. Use Value: Low RDS(on) (33 mΩ) and fast body diode reduce conduction + recovery losses, achieving >95% peak efficiency at 3 kW output. |
| Solar Microinverter | EV Onboard Charger (OBC) |
Use Scenario: DC link switching stage in single-phase transformerless microinverters interfacing PV panels to grid. IC Role / Device Role / Timing Role: Bidirectional switch in H-bridge AC output stage; conducts 47 A RMS with 175°C thermal headroom for outdoor ambient extremes. Use Value: Robust 100 V VDS rating accommodates 600 V DC link with margin, while low Ciss (2000–2500 pF) ensures clean zero-voltage switching transitions. | Use Scenario: Secondary-side synchronous rectifier in 6.6 kW bidirectional OBCs converting AC grid to 400 V battery pack. IC Role / Device Role / Timing Role: Low-side rectifying MOSFET in center-tapped LLC resonant converter; leverages integrated body diode for soft commutation. Use Value: VSD ≤ 1.5 V and Qrr ≤ 600 nC cut reverse recovery loss by 40% vs. discrete Schottky, reducing secondary-side thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP48N10F7 | RDS(on) = 22 mΩ (lower), but VDS = 100 V same; Qg = 85 nC; TO-220FP package | Higher conduction efficiency but larger thermal resistance (RthJC = 1.2 K/W); unsuitable for SMT-only lines | Select when board space permits through-hole mounting and lower RDS(on) outweighs thermal penalty |
| IRF540NPBF | RDS(on) = 44 mΩ (higher); VDS = 100 V; Qg = 71 nC; TO-220 package; no avalanche rating | Lacks EAS spec and dv/dt rating - requires external clamping in inductive loads | Acceptable only in low-risk, non-automotive consumer applications with minimal inductive content |
Compared with STP48N10F7 and IRF540NPBF, IPB47N10S33ATMA1 uniquely combines D²PAK SMT compatibility, guaranteed avalanche ruggedness, and industry-leading 0.85 K/W thermal resistance - making it optimal for high-reliability, space-constrained industrial and renewable energy systems where thermal and surge resilience are non-negotiable.
Availability
IPB47N10S33ATMA1 is available at Aetrix Electronics and suitable for motor drive inverters, industrial DC-DC converters, and solar microinverters requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant manufacturing.
Supply support for IPB47N10S33ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor leader specializing in power, sensor, and automotive ICs, with global manufacturing and R&D infrastructure supporting industrial and automotive-grade reliability standards.
This device belongs to Infineon's SIPMOS™ power transistor product line, engineered specifically for high-current, high-temperature switching applications in industrial automation, renewable energy, and e-mobility systems where ruggedness and thermal performance are critical.
FAQ
What is the maximum allowable gate-source voltage for IPB47N10S33ATMA1?
The absolute maximum VGS is ±20 V per datasheet specifications. Operation above +20 V risks irreversible gate oxide damage, while negative voltage beyond –20 V may cause parasitic turn-on. Recommended drive is 10 V for full enhancement with margin; gate resistors should limit dV/dt to avoid oscillation during switching transitions.
Does IPB47N10S33ATMA1 require a gate driver IC, or can it be driven directly from a microcontroller?
A dedicated gate driver IC is required. With Qg up to 105 nC and typical gate resistance of ~1.5 Ω, driving directly from a 3.3 V or 5 V MCU GPIO would result in excessively slow switching (>1 µs rise/fall), causing high dynamic losses and thermal runaway. A 10 V capable driver with ≥2 A peak sink/source capability is mandatory for reliable 100 kHz+ operation.
How does the body diode performance compare to discrete Schottky diodes in high-frequency rectification?
The integrated body diode has VSD = 1.1–1.5 V and trr = 100–150 ns, outperforming standard silicon diodes but not matching ultra-low-VF Schottkys (<0.5 V). However, its monolithic integration eliminates bond-wire inductance and thermal mismatch, enabling more predictable recovery behavior in synchronous rectifiers - especially valuable in LLC and phase-shifted topologies where timing precision matters.
Is IPB47N10S33ATMA1 suitable for use in automotive applications?
While qualified to AEC-Q101 stress test conditions in some variants, the IPB47N10S33ATMA1 part number itself is not AEC-Q101 certified per Infineon's official documentation. It is approved for industrial and renewable energy use. For automotive applications (e.g., ADAS power supplies or OBCs), designers must select the automotive-grade variant (e.g., IPB47N10S3-12ATMA1) with full PPAP documentation and extended temperature validation.
IPB47N10S33ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 47A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 33mOhm @ 33A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 2mA
- Gate Charge (Qg) (Max) @ Vgs:
- 105 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2500 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 175W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
IPB47N10S33ATMA1 FAQ
1.How can I place an order for IPB47N10S33ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB47N10S33ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB47N10S33ATMA1 reliable?
The price and inventory of IPB47N10S33ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB47N10S33ATMA1 is usually 5 days.
3.What payment methods are accepted for IPB47N10S33ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB47N10S33ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB47N10S33ATMA1?
IPB47N10S33ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB47N10S33ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB47N10S33ATMA1?
For technical support, including IPB47N10S33ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB47N10S33ATMA1 requirements.
6.How does Aetrix verify that IPB47N10S33ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB47N10S33ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB47N10S33ATMA1 meets industry standards.
7.What is the process for return or replacement of IPB47N10S33ATMA1?
All IPB47N10S33ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB47N10S33ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB47N10S33ATMA1 part is unused and in its original packaging.
Return procedure for IPB47N10S33ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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