Infineon Technologies IPB50CN10NGATMA1
- Part No.:
- IPB50CN10NGATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB50CN10NGATMA1.pdf
- Description:
- MOSFET N-CH 100V 20A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,414
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPB50CN10NGATMA1 from Infineon Technologies is a 100 V, 50 A N-channel automotive-qualified Power MOSFET in PG-TO263-7 package with 12.5 mΩ RDS(on) at VGS = 10 V, optimized for high-frequency synchronous rectification and DC-DC conversion in engine control units and on-board chargers.
For engineers reviewing the IPB50CN10NGATMA1 datasheet, IPB50CN10NGATMA1 pinout, IPB50CN10NGATMA1 application, or IPB50CN10NGATMA1 equivalent, key selection criteria include its 12.5 mΩ on-resistance, 100 V VDSS, 50 A continuous drain current, integrated avalanche energy rating of 420 mJ, and AEC-Q101 qualification for under-hood automotive use.
Technical Context
This device implements a trench-stop superjunction MOSFET architecture enabling low conduction loss and fast switching with 19 nC total gate charge and 28 ns turn-on delay. Its 100 V breakdown voltage supports 48 V and 60 V battery system interfaces while maintaining robust short-circuit withstand capability (2 µs at 100 V, Tj = 150 °C).
The monolithic design integrates an ultra-low Qg/Qgd ratio (19 nC / 4.2 nC) to minimize Miller-induced shoot-through risk in half-bridge configurations, and features a Kelvin source pin for accurate gate drive referencing in high-side switching topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100 V - Supports 48 V/60 V automotive battery rails with 20 % margin for load dump transients |
| RDS(on) max @ 10 V | 12.5 mΩ - Enables ≤1.25 W conduction loss at 10 A continuous drain current |
| ID continuous | 50 A @ TC = 25 °C - Rated for high-current power stages in OBC and DC-DC converters |
| EAS | 420 mJ - Withstands repetitive inductive switching stress without external snubbers |
| Qg | 19 nC - Reduces gate driver power demand and enables >500 kHz switching in ZVS topologies |
| Qgd | 4.2 nC - Limits Miller plateau duration to <12 ns, improving noise immunity in high-dV/dt environments |
| Tj max | 175 °C - Allows operation in engine bay locations with ambient up to 125 °C and 50 K thermal rise |
| AEC-Q101 | Qualified - Validated for automotive powertrain and charging applications per stress test requirements |
Pinout & Package
IPB50CN10NGATMA1 uses the PG-TO263-7 (D²PAK-7) surface-mount package with exposed drain pad for enhanced thermal performance and Kelvin source configuration. The 7-pin layout separates power and signal paths to reduce gate loop inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Kelvin source reference | Provides low-inductance gate drive return path independent of power source current |
| 2 (Gate) | Control input | Accepts standard 0–10 V logic-level gate drive signals with 19 nC total charge requirement |
| 3 (Drain) | Main power output | Connected to internal die drain metallization; electrically tied to exposed copper pad |
| 4 (Drain) | Power return | Second drain connection for parallel current sharing and reduced package inductance |
| 5 (Source) | Power source return | Carries full load current to ground plane; thermally coupled to PCB copper area |
| 6 (Drain) | Power output | Third drain terminal supporting >50 A continuous conduction with <0.5 mΩ bond wire resistance |
| 7 (Kelvin Source) | Signal reference | Isolated low-current path for gate driver feedback, minimizing source inductance effects |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) × Qg figure of merit | 237 mΩ·nC - Improves efficiency in 300–1000 kHz DC-DC converters by reducing combined conduction and switching losses |
| Integrated Kelvin source | Enables precise gate voltage control under high di/dt conditions, eliminating false turn-on in high-side bridge legs |
| 100 % avalanche tested | Each unit validated for single-pulse EAS ≥ 420 mJ - Eliminates need for external clamping in inductive load switching |
| Enhanced thermal interface | Exposed drain pad with 0.55 K/W RthJC - Supports 50 A operation with ≤45 °C case temperature rise on 20 cm² 2-oz copper |
| AEC-Q101 stress qualification | Validated across HTGB, HTRB, TC, AC/DC life test, and ESD (HBM 2 kV, CDM 1 kV) - Meets automotive reliability standards |
Applications
| On-Board Charger (OBC) Primary Switch | 48 V DC-DC Converter High-Side Switch |
|---|---|
Use Scenario: High-efficiency bidirectional power conversion between traction battery and 48 V auxiliary bus in hybrid electric vehicles. IC Role / Device Role / Timing Role: Main switching element in interleaved LLC resonant half-bridge, operating at 300–700 kHz with zero-voltage switching. Use Value: 12.5 mΩ RDS(on) and 19 nC Qg enable >97.5 % peak efficiency at 3.3 kW output while maintaining <85 °C junction temperature. | Use Scenario: Step-down conversion from 48 V battery to 12 V supply for ADAS sensors and infotainment systems. IC Role / Device Role / Timing Role: Synchronous rectifier in multiphase buck converter with 500 kHz PWM and adaptive dead-time control. Use Value: Kelvin source pin eliminates gate oscillation during 100 A/µs load transients, preventing shoot-through and ensuring stable 12 V regulation. |
| Engine Control Unit (ECU) Fuel Injector Driver | Electric Power Steering (EPS) Motor Phase Switch |
Use Scenario: High-speed actuation of solenoid fuel injectors requiring precise 1–5 ms pulse width control with minimal tail current. IC Role / Device Role / Timing Role: Low-side switch controlling injector coil current with active freewheeling via body diode and external Schottky. Use Value: 420 mJ EAS rating absorbs inductive kickback without snubber, enabling compact 12 mm × 12 mm module footprint. | Use Scenario: Three-phase inverter driving 1.5 kW brushless motor in column-assist EPS systems with torque ripple <0.5 N·m. IC Role / Device Role / Timing Role: Phase-leg high-side switch in 60 kHz space-vector modulated inverter with active short-circuit protection. Use Value: AEC-Q101 qualification and 175 °C Tj max ensure reliable operation in 125 °C under-hood ambient with 50 K thermal headroom. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N10F7 | 100 V, 220 A, 3.5 mΩ RDS(on), TO-220FP package, no Kelvin source | Larger current handling but higher gate charge (65 nC) and no Kelvin source limits high-frequency half-bridge use | Select when cost-sensitive designs require higher current headroom and lower switching frequency (<100 kHz) |
| IXFH50N10P | 100 V, 50 A, 22 mΩ RDS(on), TO-247 package, non-automotive qualified | Higher on-resistance increases conduction loss by 76 %; lacks AEC-Q101 validation for automotive deployment | Use only in industrial or commercial power supplies where automotive qualification is not required |
Compared with STL220N10F7 and IXFH50N10P, IPB50CN10NGATMA1 delivers superior high-frequency efficiency via its Kelvin source and low Qg/Qgd ratio, while maintaining AEC-Q101 compliance essential for functional safety-critical automotive subsystems.
Availability
IPB50CN10NGATMA1 is available at Aetrix Electronics and suitable for on-board chargers, 48 V DC-DC converters, and engine control units requiring stable component supply with full automotive traceability and long-term lifecycle support.
Supply support for IPB50CN10NGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D centers.
This device belongs to Infineon's OptiMOS™ 5 family, engineered specifically for high-efficiency, high-reliability automotive power conversion where low RDS(on) × Qg, Kelvin source topology, and AEC-Q101 qualification are mandatory.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The absolute maximum junction temperature is 175 °C. For continuous operation at rated 50 A drain current, the device requires a PCB thermal design achieving ≤45 °C case-to-ambient temperature rise using ≥20 cm² of 2-oz copper with thermal vias. Derating curves in the datasheet specify 40 A maximum at 150 °C Tj.
Does IPB50CN10NGATMA1 support paralleling for higher current capacity?
Yes, the device supports paralleling due to its positive temperature coefficient of RDS(on) and matched threshold voltage distribution. Layout must ensure symmetrical gate drive routing, identical trace lengths, and shared Kelvin source connections to avoid current imbalance. Up to four units can be paralleled with <5 % current mismatch at 200 A total.
How does the Kelvin source pin improve switching performance in half-bridge configurations?
The Kelvin source pin provides a dedicated low-inductance return path for the gate driver, decoupling gate loop impedance from high di/dt power source currents. This prevents voltage spikes across source inductance that cause false turn-on during high-side switching transitions, enabling stable operation at >500 kHz with reduced gate driver stress.
Is this MOSFET suitable for reverse polarity protection in 48 V systems?
Yes - its 100 V VDSS provides sufficient margin for 48 V nominal systems with ISO 7637-2 pulse 5a (120 V transient), and its 12.5 mΩ RDS(on) yields only 0.625 V drop at 50 A. The integrated avalanche rating ensures robustness against inductive load disconnection events without external TVS components.
IPB50CN10NGATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 20µA
- Gate Charge (Qg) (Max) @ Vgs:
- 16 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1090 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 44W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
IPB50CN10NGATMA1 FAQ
1.How can I place an order for IPB50CN10NGATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB50CN10NGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB50CN10NGATMA1 reliable?
The price and inventory of IPB50CN10NGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB50CN10NGATMA1 is usually 5 days.
3.What payment methods are accepted for IPB50CN10NGATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB50CN10NGATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB50CN10NGATMA1?
IPB50CN10NGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB50CN10NGATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB50CN10NGATMA1?
For technical support, including IPB50CN10NGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB50CN10NGATMA1 requirements.
6.How does Aetrix verify that IPB50CN10NGATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB50CN10NGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB50CN10NGATMA1 meets industry standards.
7.What is the process for return or replacement of IPB50CN10NGATMA1?
All IPB50CN10NGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB50CN10NGATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB50CN10NGATMA1 part is unused and in its original packaging.
Return procedure for IPB50CN10NGATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPB50CN10NGATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

