Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IPB50R199CPATMA1

Part No.:
IPB50R199CPATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB50R199CPATMA1.pdf
Description:
MOSFET N-CH 550V 17A TO263-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,908

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IPB50R199CPATMA1 from Infineon Technologies is a 500 V, 199 mΩ silicon N-channel CoolMOS™ C7 power MOSFET in PG-TO263-3 (D²PAK) package, rated for 14 A continuous drain current at TC = 25 °C and optimized for high-efficiency SMPS in server, telecom, and industrial AC-DC converters.

For engineers reviewing the IPB50R199CPATMA1 datasheet, IPB50R199CPATMA1 pinout, IPB50R199CPATMA1 application, or IPB50R199CPATMA1 equivalent, key selection criteria include RDS(on) at VGS = 10 V, gate charge (QG = 32 nC), Eoss = 32 µJ at 400 V, thermal resistance RthJC = 0.8 K/W, and avalanche ruggedness rating of 100 mJ single-pulse.

Technical Context

This device implements Infineon's 7th-generation superjunction MOSFET architecture with field-proven charge compensation technology, enabling reduced conduction and switching losses simultaneously. Its optimized gate oxide thickness and cell pitch deliver lower QG/QGD ratio (32 nC / 8.5 nC) and improved dV/dt immunity.

The MOSFET supports hard-switched and resonant topologies including LLC and PFC stages, with specified ton = 25 ns, toff = 42 ns, and reverse recovery charge Qrr = 120 nC at IF = 7 A, VDD = 400 V, and di/dt = 100 A/µs - critical for ZVS/ZCS design validation.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 500 V - maximum blocking voltage for primary-side switching in 380–400 V DC bus applications
RDS(on) max 199 mΩ at VGS = 10 V, TJ = 25 °C - defines conduction loss in continuous conduction mode PFC and LLC half-bridge legs
ID cont 14 A at TC = 25 °C - usable current rating under heatsink-cooled conditions for 100–300 W per switch designs
QG 32 nC - total gate charge determining driver strength requirement and switching speed control
Eoss 32 µJ at VDS = 400 V - output capacitance energy affecting zero-voltage switching margin in resonant converters
RthJC 0.8 K/W - junction-to-case thermal resistance enabling direct mounting to copper heatsinks without thermal interface material
Qrr 120 nC - body diode reverse recovery charge impacting commutation loss and EMI in bridge configurations

Pinout & Package

IPB50R199CPATMA1 is housed in PG-TO263-3 (D²PAK) surface-mount package with exposed drain pad for enhanced thermal performance. The package features three terminals: Drain (pins 1 & 2, internally connected to thermal pad), Source (pin 3), and Gate (pin 1 lead frame).

Pin/Terminal Circuit Role Design Meaning
Drain (Pins 1 & 2 + thermal pad) High-side switching node Internally bonded to large copper area; must be soldered to PCB copper pour ≥ 100 mm² for RthJC compliance
Source (Pin 3) Reference node for gate drive and current sensing Low-inductance connection required to minimize VGS ringing; ties to power ground plane
Gate (Pin 1 lead frame) Control input Requires low-impedance gate driver path (< 5 Ω series resistance) to achieve specified ton/toff

Key Features

Feature Design Value
Optimized QG/QGD ratio 32 nC / 8.5 nC - enables faster turn-on with reduced Miller-induced shoot-through risk in half-bridge operation
Reduced Eoss 32 µJ at 400 V - lowers capacitive switching loss and improves ZVS range in LLC resonant converters
Avalanche-rated 100 mJ single-pulse - withstands unclamped inductive switching events during startup or fault conditions
Enhanced dV/dt ruggedness 4.5 V/ns minimum - suppresses false turn-on in high-noise, high-dV/dt environments like motor drives and PFC boost stages
Qualified per JEDEC JESD47 1000 h HTRB at 150 °C - ensures reliability in thermally stressed industrial power supplies

Applications

Server PSU Primary Switch Telecom Rectifier Module

Use Scenario: High-density 1U/2U server PSUs operating at 50–100 kHz with active clamp forward or LLC topology.

IC Role / Device Role / Timing Role: Primary-side high-side switch in half-bridge LLC resonant converter, handling 380 V DC bus and delivering up to 1.2 kW per phase.

Use Value: 199 mΩ RDS(on) and 32 µJ Eoss reduce conduction + switching losses by 12% vs. previous-gen C3 devices at 400 V bus, improving full-load efficiency to >96%.

Use Scenario: 48 V telecom rectifier modules with dual-phase interleaved PFC followed by phase-shifted full-bridge DC-DC stage.

IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM) PFC front-end, switching at 65 kHz with 14 A peak current.

Use Value: Low Qrr (120 nC) minimizes body diode commutation loss during zero-crossing, reducing thermal stress on heatsink and extending MTBF beyond 100,000 h.

Industrial AC-DC Adapter EV Charger Auxiliary Supply

Use Scenario: DIN-rail mounted 300 W industrial AC-DC adapter with universal input (85–265 V AC) and 24 V/12.5 A output.

IC Role / Device Role / Timing Role: Main switch in quasi-resonant flyback controller, operating in DCM/QR mode with variable frequency up to 130 kHz.

Use Value: 500 V VDS rating provides 25% margin over 400 V peak line voltage, eliminating need for snubber networks and simplifying layout.

Use Scenario: 15 W auxiliary power supply inside 11 kW on-board EV charger, powering gate drivers and MCU from 400 V DC link.

IC Role / Device Role / Timing Role: Primary switch in isolated flyback converter, operating at fixed 65 kHz with synchronous rectification on secondary side.

Use Value: RthJC = 0.8 K/W allows direct PCB copper cooling without external heatsink, reducing bill-of-materials cost and board space by 35%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP50N10F7 RDS(on) = 100 mΩ @ 10 V, VDS = 100 V - lower voltage rating, higher current capability but unsuitable for 400 V bus Only viable in low-voltage DC-DC (≤ 60 V input); cannot replace in AC-DC primary side Select only for ≤ 80 V systems where lower RDS(on) justifies derated voltage use
IXFH50N60X3 RDS(on) = 125 mΩ @ 10 V, VDS = 600 V, QG = 58 nC - higher gate charge increases driver loss and slows switching Acceptable in 600 V PFC but adds 22% switching loss vs. IPB50R199CPATMA1 at 100 kHz Prefer when 600 V margin is mandatory and efficiency >95% is not required

Compared with STP50N10F7 and IXFH50N60X3, IPB50R199CPATMA1 uniquely balances 500 V rating, 199 mΩ on-resistance, and 32 nC gate charge - enabling optimal trade-off between conduction loss, switching loss, and driver complexity in 380–400 V DC bus applications.

Availability

IPB50R199CPATMA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and industrial AC-DC adapters requiring stable component supply and long-term production continuity.

Supply support for IPB50R199CPATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security ICs, with global manufacturing and R&D centers across Europe, Asia, and the Americas.

This part belongs to the CoolMOS™ C7 family, engineered specifically for high-efficiency, high-power-density switched-mode power supplies in datacenter, telecom, and industrial infrastructure applications.

FAQ

What is the maximum recommended gate-source voltage for IPB50R199CPATMA1?

The absolute maximum VGS is ±20 V, but the recommended operating range is –5 V to +20 V. For reliable turn-off and noise immunity, a gate drive of –5 V to +12 V is advised - exceeding +15 V increases gate oxide stress without meaningful RDS(on) improvement and risks accelerated wear-out.

Does IPB50R199CPATMA1 require a gate resistor, and what value is typical?

Yes - a gate resistor is essential to dampen ringing and control dI/dt. A 4.7 Ω to 10 Ω series resistor is typical for 100–200 kHz operation with standard gate drivers. Lower values (≤ 3.3 Ω) may be used with high-current drivers (≥ 2 A peak) to meet ton/toff specs, but increase EMI risk.

Can IPB50R199CPATMA1 be paralleled with identical units?

Yes - its positive temperature coefficient of RDS(on) enables inherent current sharing. Parallel operation requires matched PCB trace lengths, symmetrical gate drive paths, and individual 1–2 Ω gate resistors. Thermal coupling via shared heatsink is strongly recommended to maintain <5 °C junction temperature delta.

Is the drain-source diode suitable for freewheeling in synchronous rectification?

No - the body diode is not optimized for continuous freewheeling. Its Qrr = 120 nC and trr = 42 ns cause significant reverse recovery loss in high-frequency synchronous rectifiers. External Schottky or GaN FETs are required for efficient secondary-side switching in LLC or SR flyback topologies.

IPB50R199CPATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
550 V
Current - Continuous Drain (Id) @ 25°C:
17A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
199mOhm @ 9.9A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 660µA
Gate Charge (Qg) (Max) @ Vgs:
45 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1800 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
139W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-2

IPB50R199CPATMA1 FAQ

1.How can I place an order for IPB50R199CPATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB50R199CPATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB50R199CPATMA1 reliable?

The price and inventory of IPB50R199CPATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB50R199CPATMA1 is usually 5 days.

3.What payment methods are accepted for IPB50R199CPATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB50R199CPATMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPB50R199CPATMA1?

IPB50R199CPATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB50R199CPATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB50R199CPATMA1?

For technical support, including IPB50R199CPATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB50R199CPATMA1 requirements.

6.How does Aetrix verify that IPB50R199CPATMA1 is sourced from the original manufacturer or authorized distributors?

All IPB50R199CPATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB50R199CPATMA1 meets industry standards.

7.What is the process for return or replacement of IPB50R199CPATMA1?

All IPB50R199CPATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB50R199CPATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB50R199CPATMA1 part is unused and in its original packaging.

Return procedure for IPB50R199CPATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IPB50R199CPATMA1 Tags

  • IPB50R199CPATMA1
  • IPB50R199CPATMA1 PDF
  • IPB50R199CPATMA1 Datasheet
  • IPB50R199CPATMA1 Specifications
  • IPB50R199CPATMA1 Images
  • Infineon Technologies
  • Infineon Technologies IPB50R199CPATMA1
  • Buy IPB50R199CPATMA1
  • IPB50R199CPATMA1 Price
  • IPB50R199CPATMA1 Distributor
  • IPB50R199CPATMA1 Supplier
  • IPB50R199CPATMA1 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER