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Infineon Technologies IPB60R230P6ATMA1

Part No.:
IPB60R230P6ATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Datasheet:
AetrixIPB60R230P6ATMA1.pdf
Description:
MOSFET N-CH 600V 16.8A TO263-3
Quantity:
Payment:
Payment
Shipping:
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Inventory:9,015

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Product details

Overview

IPB60R230P6 from Infineon Technologies is a 600 V, 230 mΩ superjunction N-channel MOSFET in D²PAK (TO-263) package, optimized for high-efficiency PFC and hard-switching PWM stages. It delivers 16.8 A continuous drain current at TC = 25°C, 31 nC total gate charge, and 4.2 µJ output energy loss at 400 V - enabling compact, cooler-running server power supplies and industrial adapters.

For engineers reviewing the IPB60R230P6 datasheet, IPB60R230P6 pinout, IPB60R230P6 application, or IPB60R230P6 equivalent, key selection criteria include RDS(on) vs. temperature stability, Eoss-driven ZVS capability, dv/dt ruggedness up to 100 V/ns, and body diode commutation robustness at 500 A/µs.

Technical Context

This CoolMOS™ P6 device implements a charge-compensated superjunction structure with optimized cell pitch and epitaxial doping profile to simultaneously reduce conduction loss (RDS(on)) and switching loss (Eoss, Qg). Its gate plateau voltage of 6.1 V ensures stable turn-on under wide VGS drive conditions.

The MOSFET supports high-speed hard switching at 400 V bus voltage with 12 ns turn-on delay and 6 ns fall time (RG = 3.4 Ω), while maintaining 100 V/ns dv/dt ruggedness and 500 A/µs body diode di/dt rating - critical for reliable operation in discontinuous conduction mode (DCM) PFC.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - rated blocking voltage for 400 V DC-link applications with 25% margin against transients
RDS(on),max 230 mΩ @ Tj = 150°C - enables low conduction loss in thermally constrained TO-263 footprint
Qg,typ 31 nC - reduces gate driver power requirement and improves switching efficiency in 65–100 kHz PFC
Eoss@400V 4.2 µJ - lowers turn-off loss and supports soft-switching in resonant topologies
ID,pulse 48 A - supports peak current handling during startup and overload in SMPS primary switches
dv/dt ruggedness 100 V/ns - prevents spurious turn-on in high-noise bridge-leg configurations without snubbers
Body diode di/dt 500 A/µs - sustains fast reverse recovery in boost PFC without oscillation or failure

Pinout & Package

IPB60R230P6 uses the PG-TO263-3-1 (D²PAK) surface-mount package with isolated tab. The drain connects to the large copper pad (tab), enabling direct thermal coupling to PCB copper pour. Standard lead-free plating and halogen-free mold compound meet industrial-grade JEDEC qualification.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Gate) Control input Low-impedance gate terminal requiring <3.4 Ω series resistance to limit ringing; referenced to source
Pin 2 (Drain) + Tab High-voltage power node Electrically and thermally connected to internal die drain; must be routed over minimum 100 mm² copper area
Pin 3 (Source) Reference return path Common reference for gate drive and current sensing; low-inductance layout essential for dv/dt immunity

Key Features

Feature Design Value
Superjunction architecture Enables 230 mΩ RDS(on) at 600 V while maintaining <100 V/ns dv/dt immunity
Low Eoss (4.2 µJ @ 400 V) Reduces turn-off loss by >35% vs. prior CoolMOS™ P5 generation in 65 kHz hard-switched PFC
High commutation ruggedness Withstands 500 A/µs body diode reverse recovery without latch-up or secondary breakdown
Industrial-grade qualification Qualified per JESD22-A108 (temperature cycling), J-STD-020 (MSL1 reflow), and JESD22-A110 (HTOL)

Applications

Server Power Supply PFC Stage Industrial AC-DC Adapter

Use Scenario: Active PFC front-end in 1 kW telecom rectifier operating at 65 kHz with DCM boost topology.

IC Role / Device Role / Timing Role: Primary switch controlling boost inductor current; duty cycle modulated by UC3854 controller.

Use Value: 230 mΩ RDS(on) and 4.2 µJ Eoss enable >96% PFC efficiency at full load while maintaining <85°C case temperature on 4-layer PCB.

Use Scenario: Primary-side switch in 300 W industrial adapter with universal AC input (85–265 VAC) and LLC resonance.

IC Role / Device Role / Timing Role: High-side switch in half-bridge LLC primary; gated at 250–500 kHz with zero-voltage switching.

Use Value: 100 V/ns dv/dt ruggedness prevents false triggering during high-frequency resonant transitions; 31 nC Qg minimizes gate driver losses.

LCD TV Backlight Inverter UPS DC-AC Inverter Stage

Use Scenario: Half-bridge primary switch in resonant CCFL inverter driving 2×32-inch LCD panels.

IC Role / Device Role / Timing Role: Fast-switching power transistor operating at 50–70 kHz with variable frequency control.

Use Value: Low Coss (64 pF) and Co(er) = 52 pF ensure predictable ZVS timing across line/load variations, reducing EMI filter size.

Use Scenario: H-bridge leg switch in 2 kVA online UPS inverter stage delivering pure sine wave output.

IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 16 kHz SPWM inverter leg; driven by IR2110 gate driver.

Use Value: 48 A pulsed current rating and 352 mJ single-pulse avalanche energy support short-circuit withstand during grid fault events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPP60R230P6 Same silicon die, TO-220 package with insulated tab; RthJC = 0.99 °C/W vs. 0.99 °C/W for IPB60R230P6 Preferred for through-hole prototyping or lower-volume industrial controls where manual assembly is used Select when mechanical mounting flexibility and legacy board compatibility outweigh SMT density benefits
IPW60R230P6 Same die, TO-247 package; higher thermal mass but identical RDS(on), Qg, and Eoss Suitable for high-power (>500 W) open-frame PSUs requiring maximum heatsink contact area and creepage Choose when junction-to-case thermal resistance must be minimized under forced-air cooling with large heatsinks

Compared with IPP60R230P6 and IPW60R230P6, IPB60R230P6 offers identical electrical performance in a space-optimized D²PAK package - delivering best-in-class power density for automated SMT production while maintaining full thermal and ruggedness equivalence.

Availability

IPB60R230P6 is available at Aetrix Electronics and suitable for server power supplies, industrial AC-DC adapters, and UPS inverters requiring stable component supply, long-term lifecycle support, and JEDEC-qualified industrial reliability.

Supply support for IPB60R230P6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and R&D centers.

The CoolMOS™ P6 product line was engineered to deliver lowest RDS(on) × Qg figure-of-merit for 600 V superjunction MOSFETs - targeting high-efficiency, high-power-density AC-DC conversion in datacenter, telecom, and industrial power systems.

FAQ

What is the maximum continuous drain current for IPB60R230P6 at 100°C case temperature?

The maximum continuous drain current is 10.7 A at TC = 100°C, as specified in Table 2 of the Rev. 2.2 datasheet. This rating accounts for thermal derating due to junction-to-case thermal resistance (0.99 °C/W) and maximum junction temperature (150°C), ensuring safe operation without exceeding thermal limits in real-world heatsink conditions.

Does IPB60R230P6 require a gate resistor for stable operation?

Yes - a 3.4 Ω gate resistor is used in the datasheet's dynamic test conditions (Table 7) to suppress ringing and control dV/dt during switching. For practical designs, gate resistance must be selected based on layout parasitics and driver capability; typical values range from 2.2 Ω to 10 Ω to balance switching speed, EMI, and gate driver stress.

Can IPB60R230P6 replace older CoolMOS™ P5 devices in existing designs?

Yes - IPB60R230P6 is a direct drop-in replacement for IPB60R230P5 in most cases, offering identical pinout, package, and voltage rating, plus improved Eoss (−22%) and Qg (−11%). Layout changes are not required, though gate drive strength may be reduced due to lower Qg, improving system efficiency without hardware modification.

Is the drain tab of IPB60R230P6 electrically isolated?

No - the drain tab in the D²PAK (PG-TO263) package is electrically connected to Pin 2 (Drain) and forms the primary high-voltage power node. It must be routed over isolated copper areas or use insulating thermal interface materials when mounted to grounded heatsinks to prevent short circuits.

IPB60R230P6ATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™ P6
Package/Case:
TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
16.8A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
230mOhm @ 6.4A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 530µA
Gate Charge (Qg) (Max) @ Vgs:
31 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1450 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
126W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3-1

IPB60R230P6ATMA1 FAQ

1.How can I place an order for IPB60R230P6ATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB60R230P6ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB60R230P6ATMA1 reliable?

The price and inventory of IPB60R230P6ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB60R230P6ATMA1 is usually 5 days.

3.What payment methods are accepted for IPB60R230P6ATMA1?

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IPB60R230P6ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPB60R230P6ATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPB60R230P6ATMA1?

For technical support, including IPB60R230P6ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB60R230P6ATMA1 requirements.

6.How does Aetrix verify that IPB60R230P6ATMA1 is sourced from the original manufacturer or authorized distributors?

All IPB60R230P6ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB60R230P6ATMA1 meets industry standards.

7.What is the process for return or replacement of IPB60R230P6ATMA1?

All IPB60R230P6ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB60R230P6ATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB60R230P6ATMA1 part is unused and in its original packaging.

Return procedure for IPB60R230P6ATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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