Infineon Technologies IPD05N03LB G
- Part No.:
- IPD05N03LB G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPD05N03LB G.pdf
- Description:
- MOSFET N-CH 30V 90A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:4,336
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Product details
Overview
IPD05N03LB G from Infineon Technologies is an N-channel logic-level power MOSFET in PG-TO252-3-11 package, rated for 30 V VDS, 4.8 mΩ RDS(on) (max at VGS=10 V, ID=60 A), and 90 A continuous drain current at TC=25 °C. It features 175 °C maximum junction temperature, low gate charge (Qg = 19–25 nC), and optimized figure-of-merit (Qg × RDS(on)) for high-efficiency DC-DC converters and motor control stages.
For engineers reviewing the IPD05N03LB G datasheet, IPD05N03LB G pinout, IPD05N03LB G application, or IPD05N03LB G equivalent, key selection criteria include its logic-level gate drive compatibility (VGS(th) = 1.2–2.0 V), robust avalanche energy rating (EAS = 120 mJ), thermal resistance (RthJC = 1.6 K/W), and integrated body diode with Qrr = 15 nC for synchronous rectification.
Technical Context
This OptiMOS®2 device uses trench-gate superjunction technology to achieve low conduction loss while maintaining fast switching dynamics. Its gate threshold voltage (1.2–2.0 V) enables direct interfacing with 3.3 V and 5 V microcontrollers without level-shifting circuitry.
The MOSFET supports high-current pulsed operation (ID,pulse = 420 A) and exhibits stable RDS(on) over temperature (3.9–4.8 mΩ at 100 °C), making it suitable for thermally constrained PCB layouts with minimal copper area (6 cm²).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 24 V automotive and industrial bus applications |
| RDS(on) max | 4.8 mΩ at VGS=10 V, ID=60 A - Enables <1.5 W conduction loss at 70 A continuous load |
| ID cont | 90 A at TC=25 °C - Supports high-current half-bridge legs in motor drivers |
| Qg | 19–25 nC - Reduces gate driver power demand and switching losses in 100–500 kHz SMPS |
| EAS | 120 mJ - Withstands single-pulse inductive energy without failure in relay/snubberless designs |
| RthJC | 1.6 K/W - Allows efficient heat transfer to heatsink or copper pour, critical for compact SMD layouts |
| Tj,max | 175 °C - Enables operation in under-hood automotive environments and sealed industrial enclosures |
Pinout & Package
IPD05N03LB G is housed in a surface-mount PG-TO252-3-11 (D-Pak) package with exposed drain pad for thermal and electrical performance. The three terminals are arranged in standard TO252 configuration: Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control electrode | Logic-level compatible input requiring ≤2.0 V threshold; low Ciss (2400–3200 pF) minimizes driver loading |
| Pin 2 (Drain) | Main current path output | Exposed metal tab - must be soldered to large copper area for thermal management and low-inductance return path |
| Pin 3 (Source) | Reference node for gate drive | Common source connection for low-side switching; ties gate driver ground and power ground with minimal loop inductance |
Key Features
| Feature | Design Value |
|---|---|
| Optimized FOM (Qg × RDS(on)) | ~115 mΩ·nC - Balances switching and conduction loss for 95%+ efficiency in 12–24 V buck converters |
| Low RthJC | 1.6 K/W - Enables >70 W power dissipation with 45 °C temperature rise above case |
| Robust body diode | Qrr = 15 nC, VSD = 0.93–1.2 V - Reduces reverse recovery loss and EMI in synchronous rectifiers |
| High-temperature operation | Rated to 175 °C junction - Eliminates derating in sealed fanless systems and automotive under-dash modules |
Applications
| Motor Control | DC-DC Conversion |
|---|---|
Use Scenario: Half-bridge driver for 24 V BLDC fans in HVAC and industrial automation. IC Role / Device Role / Timing Role: Low-side switch with fast turn-off (tf = 4.6–7 ns) and low RDS(on) to minimize I²R heating during PWM commutation. Use Value: Enables 97% peak efficiency at 50 A load and reduces thermal footprint by 30% vs. legacy D2PAK alternatives. | Use Scenario: Primary-side synchronous rectifier in isolated 24 V → 5 V/12 V flyback converters. IC Role / Device Role / Timing Role: High-current, low-VGS(th) MOSFET replacing Schottky diodes to reduce forward drop and improve light-load regulation. Use Value: Cuts conduction loss by 65% and eliminates reverse recovery spikes, easing EMI filter design. |
| Automotive Body Electronics | Industrial Power Distribution |
Use Scenario: Load switch for LED headlamp modules and seat control actuators in 12 V/24 V vehicle architectures. IC Role / Device Role / Timing Role: Logic-level controlled high-side or low-side switch with integrated avalanche ruggedness for inductive load suppression. Use Value: Survives load dump transients up to 40 V and meets ISO 7637-2 Pulse 5a without external TVS. | Use Scenario: Solid-state relay replacement in programmable logic controller (PLC) output modules. IC Role / Device Role / Timing Role: High-current, low-RDS(on) power switch driving solenoids, valves, and contactors with fast response (<10 µs turn-on). Use Value: Delivers 78 A continuous current with <0.5 V saturation, reducing system power loss and enabling compact module packaging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PbF | RDS(on) = 6.0 mΩ (max), Qg = 34 nC, RthJC = 2.0 K/W | Higher conduction loss and slower switching; less suitable for >200 kHz operation | Prefer where cost sensitivity outweighs efficiency and thermal constraints |
| STL110N3LLH6 | RDS(on) = 3.3 mΩ (typ), Qg = 32 nC, PG-TO252 package, 175 °C rated | Lower RDS(on) but higher Qg; requires stronger gate driver for same switching speed | Choose when ultra-low on-resistance is prioritized and board space allows larger driver IC |
Compared with IRL3803PbF and STL110N3LLH6, IPD05N03LB G delivers superior Qg × RDS(on) balance and lower thermal resistance-making it optimal for space-constrained, high-efficiency 24 V systems where gate drive voltage is limited to 5 V or less.
Availability
IPD05N03LB G is available at Aetrix Electronics and suitable for motor control, DC-DC conversion, and automotive body electronics requiring stable component supply across production lifecycles.
Supply support for IPD05N03LB G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
This device belongs to the OptiMOS®2 family-designed specifically for high-current, low-voltage logic-level switching in automotive and industrial power stages where thermal density and gate drive simplicity are critical.
FAQ
Is IPD05N03LB G suitable for high-frequency switching above 300 kHz?
Yes. With tr = 7–10 ns, tf = 4.6–7 ns, and Qg = 19–25 nC, it supports efficient operation up to 500 kHz in hard-switched topologies. Layout must minimize gate loop inductance and use low-ESR gate resistors (e.g., 2.7 Ω) to avoid ringing.
What is the recommended PCB layout for thermal performance?
Mount the exposed drain pad directly to ≥6 cm² of 70 µm thick copper on FR4 (single layer), oriented vertically in still air. Use ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch) connecting the pad to inner or backside ground planes to achieve RthJA ≈ 50 K/W.
Does IPD05N03LB G have avalanche capability, and how is it rated?
Yes. It is fully rated for repetitive and single-pulse avalanche with EAS = 120 mJ (ID = 90 A, RGS = 25 Ω). This enables reliable operation in inductive switching without external snubbers in applications like solenoid drivers and relay replacements.
Can IPD05N03LB G be used in high-side configurations with bootstrap gate drive?
Yes. Its VGS rating of ±20 V and VBR(DSS) = 30 V support bootstrap-based high-side operation in half-bridges. Ensure gate voltage remains within 0–15 V relative to source, and select bootstrap capacitor and diode to sustain VGS > 4.5 V during full-duty-cycle conditions.
IPD05N03LB G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 90A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.8mOhm @ 60A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 40µA
- Gate Charge (Qg) (Max) @ Vgs:
- 25 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3200 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 94W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-11
IPD05N03LB G FAQ
1.How can I place an order for IPD05N03LB G through Aetrix?
Please submit a Request for Quotation (RFQ) for IPD05N03LB G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPD05N03LB G reliable?
The price and inventory of IPD05N03LB G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD05N03LB G is usually 5 days.
3.What payment methods are accepted for IPD05N03LB G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPD05N03LB G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPD05N03LB G?
IPD05N03LB G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPD05N03LB G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPD05N03LB G?
For technical support, including IPD05N03LB G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD05N03LB G requirements.
6.How does Aetrix verify that IPD05N03LB G is sourced from the original manufacturer or authorized distributors?
All IPD05N03LB G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD05N03LB G meets industry standards.
7.What is the process for return or replacement of IPD05N03LB G?
All IPD05N03LB G units undergo pre-shipment inspection (PSI). If there is an issue with IPD05N03LB G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPD05N03LB G part is unused and in its original packaging.
Return procedure for IPD05N03LB G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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