Infineon Technologies IPD12CNE8N G
- Part No.:
- IPD12CNE8N G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPD12CNE8N G.pdf
- Description:
- MOSFET N-CH 85V 67A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:4,576
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPD12CNE8N G from Infineon Technologies is an N-channel enhancement-mode MOSFET in PG-TO252-3 (DPAK) package, rated for 85 V VDS, 67 A continuous drain current at TC = 25 °C, and 12.4 mΩ max RDS(on) at VGS = 10 V. It features 175 °C maximum junction temperature, optimized gate charge × RDS(on) figure-of-merit (FOM), and is qualified per JEDEC standards for industrial power conversion.
For engineers reviewing the IPD12CNE8N G datasheet, IPD12CNE8N G pinout, IPD12CNE8N G application, or IPD12CNE8N G equivalent, this device is selected for high-frequency synchronous rectification, DC-DC converters, and motor control stages where low conduction loss, fast switching, and thermal robustness are critical.
Technical Context
This MOSFET employs a trench-based OptiMOS®2 process enabling low RDS(on) with controlled gate charge (Qg = 48–64 nC) and fast dynamic performance (tr = 21–31 ns, tf = 8–12 ns). Its reverse diode supports 67 A continuous forward current with VSD = 1.0–1.2 V at 67 A and Tj = 25 °C.
The device operates up to 175 °C junction temperature and exhibits stable threshold voltage (VGS(th) = 2–4 V) across temperature. Thermal resistance RthJC is 1.2 K/W, and RthJA is 40 K/W on 6 cm² copper area - confirming suitability for compact, thermally constrained PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | 85 V - supports 48 V and 60 V bus systems with margin against transients |
| RDS(on) max | 12.4 mΩ @ VGS = 10 V, ID = 67 A - enables <1 W conduction loss at 40 A |
| ID cont. (TC = 25 °C) | 67 A - delivers high current density in TO252 footprint without derating |
| Qg total | 48–64 nC - balances switching speed and gate drive power in 100–500 kHz designs |
| EAS | 154 mJ @ ID = 67 A - withstands single-pulse avalanche stress in hard-switched topologies |
| Tj max | 175 °C - allows operation in sealed enclosures or high ambient environments |
| Ciss | 3260–4340 pF - defines input capacitance affecting gate driver sizing and turn-on delay |
Pinout & Package
IPD12CNE8N G uses the PG-TO252-3 (DPAK) surface-mount package with exposed drain pad for thermal conduction. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate | Control terminal; requires 10 V drive for full enhancement; RG = 1.5 Ω internal |
| Pin 2 (D) | Drain | Main power output terminal; electrically connected to exposed copper tab for heatsinking |
| Pin 3 (S) | Source | Reference node for gate drive; common return path for load current and body diode conduction |
Key Features
| Feature | Design Value |
|---|---|
| Optimized FOM (Qg × RDS(on)) | Enables >95% efficiency in 300–500 kHz synchronous buck converters at 25–48 V input |
| 175 °C rated junction temperature | Eliminates need for external thermal derating in fanless industrial SMPS designs |
| Low Qgd/Qgs ratio (≈0.6) | Reduces Miller-induced shoot-through risk during hard commutation in half-bridge configurations |
| Fast reverse recovery (trr = 103 ns, Qrr = 255 nC) | Lowers switching losses and EMI in synchronous rectifier applications vs. standard FRDs |
Applications
| Server VRM Power Stage | Industrial DC-DC Converter |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (0.8–1.2 V @ up to 200 A). IC Role / Device Role / Timing Role: Synchronous rectifier switch in low-side position, operating at 300–600 kHz with precise dead-time control. Use Value: 12.4 mΩ RDS(on) minimizes conduction loss; 175 °C rating ensures reliability under sustained 150 °C board temperatures. |
Use Scenario: Isolated 24 V input to 5/12 V output DC-DC module for PLC I/O modules and HMI controllers. IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward or secondary-side synchronous rectifier in LLC resonant topology. Use Value: Low Coss (608–809 pF) and fast tf (8–12 ns) reduce switching loss and improve light-load efficiency. |
| Automotive Body Control Module | Brushless DC Motor Driver |
Use Scenario: 12 V battery-fed power distribution unit managing headlight, wiper, and HVAC loads. IC Role / Device Role / Timing Role: High-side load switch with integrated protection, driven by microcontroller GPIO via level-shifting circuit. Use Value: 85 V VDS rating accommodates load-dump transients (ISO 7637-2 Pulse 5a); 175 °C Tj supports under-hood placement. |
Use Scenario: 3-phase inverter driving 200–500 W BLDC motors in cordless power tools and HVAC blowers. IC Role / Device Role / Timing Role: Low-side switch in 60–100 kHz PWM-driven inverter stage with discrete gate drivers. Use Value: Fast tr/tf and low Qsw (21–30 nC) enable clean edge transitions and reduced EMI filtering burden. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB12CNE8N G | PG-TO263-3 package; RDS(on) max = 12.9 mΩ; higher thermal mass than TO252 | Better heat dissipation in forced-air cooled systems; larger footprint limits high-density layouts | Select when board-level airflow is available and thermal margin >20 K is required |
| IPP12CNE8N G | PG-TO220-3 package; RDS(on) max = 12.9 mΩ; through-hole mounting | Compatible with legacy wave-solder processes; lower thermal resistance to heatsink but no PCB copper area dependency | Prefer for prototyping, repair, or mixed-technology assemblies requiring mechanical robustness |
Compared with IPB12CNE8N G and IPP12CNE8N G, IPD12CNE8N G offers the smallest footprint and lowest RthJA on minimal PCB copper, making it optimal for space-constrained, surface-mount-only production of high-efficiency power stages.
Availability
IPD12CNE8N G is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and automotive body control modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for IPD12CNE8N G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and qualification infrastructure.
This device belongs to the OptiMOS®2 family - engineered specifically for high-efficiency, high-frequency power conversion in server, telecom, and industrial applications where low RDS(on) and fast switching are essential.
FAQ
Is IPD12CNE8N G suitable for synchronous rectification in LLC resonant converters?
Yes. With 12.4 mΩ RDS(on), 103 ns reverse recovery time, and 255 nC Qrr, IPD12CNE8N G reduces conduction and switching losses in secondary-side rectification. Its 175 °C rating supports operation under peak LLC burst-mode conditions without thermal throttling.
What is the recommended gate resistor value for hard-switched 200 kHz operation?
A 10 Ω series gate resistor is recommended to limit peak gate current while maintaining tr/tf within 25–35 ns. This value balances EMI suppression and switching loss, verified with VGS = 12 V drive and 1.5 Ω internal RG per datasheet Figure 16.
Does IPD12CNE8N G require external gate clamping for 12 V logic-level drive?
No. The device's ±20 V VGS rating and 5.5 V gate plateau voltage ensure safe operation with standard 12 V gate drivers. No external Zener clamp is needed unless system-level overshoot exceeds 15 V during layout parasitic ringing.
How does its thermal performance compare between TO252 and TO220 packages?
IPD12CNE8N G (TO252) achieves RthJA = 40 K/W on 6 cm² copper, while IPP12CNE8N G (TO220) reaches 50 K/W under identical conditions. The TO252's lower RthJA and smaller footprint make it superior for thermally dense, surface-mount-only designs.
IPD12CNE8N G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 85 V
- Current - Continuous Drain (Id) @ 25°C:
- 67A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 12.4mOhm @ 67A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 83µA
- Gate Charge (Qg) (Max) @ Vgs:
- 64 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4340 pF @ 40 V
- FET Feature:
- -
- Power Dissipation (Max):
- 125W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3
IPD12CNE8N G FAQ
1.How can I place an order for IPD12CNE8N G through Aetrix?
Please submit a Request for Quotation (RFQ) for IPD12CNE8N G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPD12CNE8N G reliable?
The price and inventory of IPD12CNE8N G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD12CNE8N G is usually 5 days.
3.What payment methods are accepted for IPD12CNE8N G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPD12CNE8N G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPD12CNE8N G?
IPD12CNE8N G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPD12CNE8N G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPD12CNE8N G?
For technical support, including IPD12CNE8N G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD12CNE8N G requirements.
6.How does Aetrix verify that IPD12CNE8N G is sourced from the original manufacturer or authorized distributors?
All IPD12CNE8N G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD12CNE8N G meets industry standards.
7.What is the process for return or replacement of IPD12CNE8N G?
All IPD12CNE8N G units undergo pre-shipment inspection (PSI). If there is an issue with IPD12CNE8N G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPD12CNE8N G part is unused and in its original packaging.
Return procedure for IPD12CNE8N G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPD12CNE8N G Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

