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Infineon Technologies IPD135N08N3GBTMA1

Part No.:
IPD135N08N3GBTMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixIPD135N08N3GBTMA1.pdf
Description:
MOSFET N-CH 80V 45A TO252-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,508

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Product details

Overview

IPD135N08N3GBTMA1 from Infineon Technologies is an N-channel 80 V, 45 A, 13.5 mΩ OptiMOS™ 3 power MOSFET in PG-TO-252-3 package, optimized for high-frequency DC/DC converters and featuring 19–25 nC total gate charge, 1.9 K/W junction-to-case thermal resistance, and 100% avalanche tested ruggedness. It serves as a primary synchronous rectifier or high-side switch in industrial SMPS and POL modules.

For engineers reviewing the IPD135N08N3GBTMA1 datasheet, IPD135N08N3GBTMA1 pinout, IPD135N08N3GBTMA1 application, or IPD135N08N3GBTMA1 equivalent, key selection criteria include RDS(on) at 6 V drive (≤26 mΩ), Qg/RDS(on) figure-of-merit (<2.0 nC·mΩ), SOA robustness at 100 µs pulse width, and thermal performance on 6 cm² FR4 copper.

Technical Context

This device employs trench-based silicon technology with optimized cell pitch and reduced gate-drain charge (Qgd = 4 nC) to minimize switching losses in hard-switched topologies. Its gate threshold voltage (2.0–3.5 V) ensures reliable turn-on with standard 5 V or 3.3 V logic-level drivers while maintaining noise immunity.

The integrated body diode exhibits trr = 50 ns and Qrr = 74 nC at 100 A/µs di/dt, enabling efficient synchronous rectification without external Schottky assistance in 48 V input buck converters up to 1 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
VDS80 V - supports 48 V nominal bus systems with ≥1.7× voltage margin for transient clamping
RDS(on) max13.5 mΩ @ VGS = 10 V, ID = 45 A - enables ≤0.027 W conduction loss at full load in 12 V output stages
Qg19–25 nC - determines gate driver current requirement (~1.25 A peak for 20 ns rise time)
EAS50 mJ - withstands single-pulse inductive energy without failure under worst-case short-circuit conditions
RthJC1.9 K/W - allows 79 W continuous dissipation with ≤150 °C junction rise above 25 °C case temperature
tr/tf35 ns / 5 ns - supports <1 MHz switching with minimal overlap loss in synchronous buck configurations
Qrr74 nC - quantifies reverse recovery charge affecting shoot-through risk during dead-time transitions

Pinout & Package

IPD135N08N3GBTMA1 uses the PG-TO-252-3 (DPAK) thermally enhanced surface-mount package with exposed drain pad for low-inductance, high-current routing and improved PCB heat spreading.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Power return path for channel currentLow-impedance connection to ground plane; ties directly to source of gate driver for stable reference
Pin 2 (Gate)Control electrode for channel modulationHigh-impedance input requiring RC snubber or active gate control to suppress ringing from 2 Ω gate resistance
Pin 3 (Drain)Main current-carrying terminal (connected to exposed pad)Thermally and electrically tied to large copper area; must be routed with minimum loop inductance for EMI control

Key Features

FeatureDesign Value
Optimized Qg × RDS(on) FOM≤2.0 nC·mΩ - reduces combined switching + conduction loss in high-frequency POL converters
100% avalanche rated50 mJ single-pulse energy - eliminates need for external overvoltage clamping in unregulated input stages
Enhanced body diode performancetrr = 50 ns, Qrr = 74 nC - enables clean zero-voltage switching transitions in synchronous rectifiers
JEDEC-compliant qualificationQualified per J-STD-20/JESD22 - validated for reflow compatibility and long-term reliability in industrial temperature cycling

Applications

Server VRMIndustrial SMPS

Use Scenario: 48 V to 12 V intermediate bus conversion in dual-phase buck regulators for CPU/GPU power delivery.

IC Role / Device Role / Timing Role: High-side synchronous switch operating at 500 kHz–1 MHz with precise gate timing controlled by multiphase PWM controller.

Use Value: 13.5 mΩ RDS(on) and 25 nC Qg enable >95% efficiency at 40 A load while minimizing thermal footprint on dense server PCBs.

Use Scenario: Primary-side switch in 300 W isolated flyback converter for factory automation PLC power supplies.

IC Role / Device Role / Timing Role: Main switching transistor handling 80 V clamp voltage during transformer reset with 100 µs SOA compliance.

Use Value: 50 mJ avalanche energy rating permits operation without snubber network, reducing BOM count and layout complexity.

Telecom DC/DCMotor Drive Half-Bridge

Use Scenario: Non-isolated point-of-load regulator converting -48 V telecom battery to 3.3 V for baseband processor rails.

IC Role / Device Role / Timing Role: Low-side switch in buck topology with fast 5 ns fall time minimizing dead-time losses.

Use Value: 74 nC Qrr and 50 ns trr reduce cross-conduction risk during high di/dt transitions in negative-input environments.

Use Scenario: Upper-leg switch in 24 V BLDC motor gate driver stage driving 10 A phase current.

IC Role / Device Role / Timing Role: High-side N-channel MOSFET driven via bootstrap circuit with 2.8 V typical VGS(th) ensuring safe turn-on margin.

Use Value: 2.0–3.5 V gate threshold range prevents accidental turn-on from dv/dt coupling while supporting 5 V logic-level gate drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 80 V power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STL135N8LH6AGRDS(on) = 12.5 mΩ @ 10 V but Qg = 32 nC; higher gate charge increases driver lossHigher Qg limits usable frequency to ≤600 kHz in same layoutPrefer when lowest RDS(on) dominates over switching speed in low-frequency, high-current designs
IRF135N8PBFRDS(on) = 14.5 mΩ @ 10 V; no specified Qrr or trr; not avalanche ratedLacks documented body diode recovery specs and avalanche ruggedness for unclamped inductive loadsSelect only in cost-sensitive, non-critical applications where transient stress is absent

Compared with STL135N8LH6AG and IRF135N8PBF, IPD135N08N3GBTMA1 delivers superior Qg/RDS(on) balance and guaranteed avalanche capability-critical for high-reliability 1 MHz DC/DC converters where both efficiency and fault tolerance are design requirements.

Availability

IPD135N08N3GBTMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial SMPS, telecom DC/DC converters, and motor drive half-bridges requiring stable component supply across multi-year production cycles.

Supply support for IPD135N08N3GBTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial sensors, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

This part belongs to the OptiMOS™ 3 product line-designed specifically for high-efficiency, high-frequency power conversion in data center, telecom, and industrial power supplies where thermal density and switching loss are critical constraints.

FAQ

What is the maximum recommended gate resistor value for reliable 1 MHz switching?

A 1.6 Ω external gate resistor is validated in the datasheet for 45 A switching at 10 V drive and 1.6 Ω RG,ext, yielding 35 ns rise time. Using >3.3 Ω risks exceeding safe dv/dt limits and increasing switching loss beyond thermal budget; lower values require careful layout to avoid oscillation due to 2 Ω intrinsic gate resistance.

Does this MOSFET support 5 V logic-level gate drive in practice?

Yes-its 2.0–3.5 V VGS(th) range ensures turn-on with 5 V logic, but RDS(on) rises to 16–26 mΩ at VGS = 6 V. For full 13.5 mΩ performance, 10 V drive is required; 5 V operation is viable only in derated current applications (<22.5 A) where conduction loss increase is acceptable.

How does the 1.9 K/W RthJC translate to PCB layout requirements?

With 1.9 K/W RthJC, achieving 79 W dissipation requires ≤150 °C junction rise above case temperature. This demands ≥6 cm² of 70 µm copper on FR4 connected directly to the exposed drain pad, vertical orientation in still air, and no thermal vias obstructing the main current path-per Figure 4 in the datasheet.

Is the body diode suitable for synchronous rectification without external diode parallel?

Yes-the 50 ns trr and 74 nC Qrr are characterized under 100 A/µs di/dt and enable clean commutation in synchronous buck topologies up to 1 MHz. However, in high-di/dt (>200 A/µs) or high-temperature (>125 °C) conditions, adding a Schottky may further reduce reverse recovery loss.

IPD135N08N3GBTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
80 V
Current - Continuous Drain (Id) @ 25°C:
45A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
13.5mOhm @ 45A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 33µA
Gate Charge (Qg) (Max) @ Vgs:
25 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1730 pF @ 40 V
FET Feature:
-
Power Dissipation (Max):
79W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO252-3

IPD135N08N3GBTMA1 FAQ

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Please submit a Request for Quotation (RFQ) for IPD135N08N3GBTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of IPD135N08N3GBTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD135N08N3GBTMA1 is usually 5 days.

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For technical support, including IPD135N08N3GBTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD135N08N3GBTMA1 requirements.

6.How does Aetrix verify that IPD135N08N3GBTMA1 is sourced from the original manufacturer or authorized distributors?

All IPD135N08N3GBTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD135N08N3GBTMA1 meets industry standards.

7.What is the process for return or replacement of IPD135N08N3GBTMA1?

All IPD135N08N3GBTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPD135N08N3GBTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPD135N08N3GBTMA1 part is unused and in its original packaging.

Return procedure for IPD135N08N3GBTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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