Infineon Technologies IPD50N03S2L06ATMA1
- Part No.:
- IPD50N03S2L06ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPD50N03S2L06ATMA1.pdf
- Description:
- MOSFET N-CH 30V 50A TO252-31
- Quantity:
- Payment:

- Shipping:

Inventory:4,653
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPD50N03S2L06ATMA1 from Infineon Technologies is an N-channel logic-level enhancement-mode MOSFET optimized for automotive and industrial high-current switching. It delivers 50 A continuous drain current at TC = 25 °C, 30 V VDS, and ultra-low 6.4 mΩ RDS(on) at VGS = 10 V, with AEC-Q101 qualification and 175 °C operation-used in 12 V battery-powered motor control and DC-DC converter primary-side switches.
For engineers reviewing the IPD50N03S2L06ATMA1 datasheet, IPD50N03S2L06ATMA1 pinout, IPD50N03S2L06ATMA1 application, or IPD50N03S2L06ATMA1 equivalent, key selection criteria include RDS(on) at 4.5 V gate drive, avalanche energy rating (250 mJ), thermal resistance (1.1 K/W junction-to-case), and TO252-3 package compatibility with high-power PCB layouts.
Technical Context
This OptiMOS® device uses trench-gate silicon technology to achieve low conduction loss and fast switching with controlled gate charge (Qg = 50–68 nC). Its logic-level gate threshold (VGS(th) = 1.2–2.0 V) enables direct drive from microcontrollers without level-shifting, while integrated body diode supports synchronous rectification and freewheeling in half-bridge topologies.
The MOSFET is characterized for stable operation across –55 °C to +175 °C, with 100% single-pulse avalanche testing and MSL1 reflow compatibility up to 260 °C. Thermal design relies on its 1.1 K/W RthJC, requiring copper area ≥6 cm² on FR4 PCB for rated 136 W power dissipation at TC = 25 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - maximum blocking voltage for 12 V automotive systems with margin against load-dump transients |
| RDS(on) max @ VGS=10 V | 6.4 mΩ - enables ≤3.2 W conduction loss at 50 A, critical for thermally constrained motor drivers |
| ID continuous @ TC=25 °C | 50 A - limited by bondwire; supports high-current solenoid and pump drivers without external heatsink |
| EAS | 250 mJ - ensures robustness against inductive switching surges in relay and actuator circuits |
| Qg | 50–68 nC - determines gate driver power requirement and switching speed in PWM applications |
| RthJC | 1.1 K/W - defines minimum heatsink interface performance needed to maintain Tj < 175 °C |
| VGS(th) | 1.2–2.0 V - guarantees turn-on with standard 3.3 V or 5 V logic outputs, eliminating gate driver ICs |
Pinout & Package
IPD50N03S2L06ATMA1 is housed in PG-TO252-3-11 (DPAK) package with exposed drain pad for thermal conduction. The leadframe design supports high-current flow and mechanical reliability under thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Low-side reference node; connects to ground or current-sense resistor in high-side switch configurations |
| Pin 2 (Gate) | Control input | Logic-level compatible; requires <1 µA leakage current and 6–8 nC Qgs for clean turn-on |
| Pin 3 (Drain) | Power output / high-side connection | Exposed metal pad; must be soldered to ≥6 cm² copper pour for thermal management and current handling |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive powertrain and chassis applications per stress test requirements |
| 100% avalanche tested | Each unit passes single-pulse EAS = 250 mJ test-ensures field reliability in inductive loads |
| Logic-level gate drive | VGS(th) range (1.2–2.0 V) allows direct MCU GPIO control without external level shifters |
| Green package | Lead-free, RoHS-compliant PG-TO252-3-11 with MSL1 rating for lead-free reflow assembly |
| Ultra-low RDS(on) | 5.1 mΩ typ. @ VGS=10 V reduces I²R losses in high-duty-cycle DC-DC converters |
Applications
| Automotive Body Control Module (BCM) | Industrial 12 V DC Motor Driver |
|---|---|
Use Scenario: Switching power to door locks, window lifts, and mirror actuators in 12 V vehicle electrical architecture. IC Role / Device Role / Timing Role: High-side load switch controlling up to 50 A peak current with integrated reverse polarity protection. Use Value: 6.4 mΩ RDS(on) limits voltage drop to <320 mV at 50 A, preserving battery voltage margin during cold-cranking. | Use Scenario: H-bridge half-bridge leg in conveyor belt and valve actuation systems. IC Role / Device Role / Timing Role: Low-side switching element with fast tf = 15 ns and Qgd = 16–27 nC for efficient PWM commutation. Use Value: 250 mJ avalanche rating absorbs flyback energy from 200 mH inductive loads without snubber networks. |
| Onboard Charger (OBC) Input Stage | 48 V Mild Hybrid DC-DC Converter |
Use Scenario: Primary-side synchronous rectifier in bidirectional AC/DC front-end stage. IC Role / Device Role / Timing Role: Logic-level N-channel MOSFET used in active clamp or auxiliary power supply rail. Use Value: VGS(th) stability over –40 °C to +150 °C ensures reliable start-up in extreme ambient conditions. | Use Scenario: High-frequency buck switch in 48 V–12 V bi-directional converter for regenerative braking. IC Role / Device Role / Timing Role: Main power switch operating at 100–200 kHz with low Qg/RDS(on) ratio. Use Value: 1.1 K/W RthJC enables >90% efficiency at 30 A output with minimal heatsink volume. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL120N3LLH6 | RDS(on) = 5.5 mΩ @ 10 V; Qg = 72 nC; same TO252-3 package | Higher gate charge increases driver loss; slightly lower RDS(on) improves conduction efficiency | Prefer when minimizing conduction loss dominates over switching loss in <50 kHz applications |
| IRLR024NPBF | RDS(on) = 27 mΩ @ 10 V; Qg = 21 nC; TO252-3, non-AEC-Q101 | Lower gate charge enables faster switching but higher RDS(on) raises conduction loss significantly | Select only for cost-sensitive non-automotive designs where 50 A rating is not required |
Compared with STL120N3LLH6 and IRLR024NPBF, IPD50N03S2L06ATMA1 offers optimal balance of low RDS(on), moderate Qg, and AEC-Q101 compliance-making it uniquely suitable for automotive-grade 12 V high-current switching where reliability and thermal headroom are critical.
Availability
IPD50N03S2L06ATMA1 is available at Aetrix Electronics and suitable for automotive body control modules, industrial motor drives, onboard chargers, and 48 V mild hybrid DC-DC converters requiring stable component supply and long-term lifecycle support.
Supply support for IPD50N03S2L06ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and R&D infrastructure.
This device belongs to the OptiMOS® 2nd generation logic-level power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in automotive and industrial 12 V–48 V systems.
FAQ
Is IPD50N03S2L06ATMA1 suitable for high-frequency PWM applications above 100 kHz?
Yes-it supports switching frequencies up to 200 kHz due to its low gate charge (Qg = 50–68 nC) and fast switching times (tr = 30 ns, tf = 15 ns). However, thermal design must account for increased switching losses; use of ≥6 cm² PCB copper and forced airflow is recommended above 100 kHz at full 50 A load.
What is the maximum safe operating temperature for continuous operation?
The device is rated for continuous operation from –55 °C to +175 °C junction temperature. At Tj = 175 °C, RDS(on) rises to ~12 mΩ (per Fig. 9), limiting usable current to ~35 A at VGS = 10 V. Derating curves on page 4 of the datasheet define safe operating area boundaries for voltage/current combinations.
Does the integrated body diode support synchronous rectification?
Yes-the device features a fast, low-VSD body diode (VSD = 0.9–1.3 V at 50 A, Tj = 25 °C) with trr = 40 ns and Qrr = 50 nC. This enables use in synchronous buck topologies, though external Schottky diodes may be preferred for lowest forward drop in high-efficiency designs.
Can IPD50N03S2L06ATMA1 replace older OptiMOS® 1st generation parts like IPD50N03S2-07?
Yes-IPD50N03S2L06ATMA1 is a direct upgrade with lower RDS(on) (6.4 mΩ vs. 7.5 mΩ), improved avalanche ruggedness (250 mJ vs. 200 mJ), and tighter VGS(th) distribution. Pinout, package, and footprint are identical, enabling drop-in replacement without layout changes.
IPD50N03S2L06ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6.4mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 85µA
- Gate Charge (Qg) (Max) @ Vgs:
- 68 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1900 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-11
IPD50N03S2L06ATMA1 FAQ
1.How can I place an order for IPD50N03S2L06ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPD50N03S2L06ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPD50N03S2L06ATMA1 reliable?
The price and inventory of IPD50N03S2L06ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD50N03S2L06ATMA1 is usually 5 days.
3.What payment methods are accepted for IPD50N03S2L06ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPD50N03S2L06ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPD50N03S2L06ATMA1?
IPD50N03S2L06ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPD50N03S2L06ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPD50N03S2L06ATMA1?
For technical support, including IPD50N03S2L06ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD50N03S2L06ATMA1 requirements.
6.How does Aetrix verify that IPD50N03S2L06ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPD50N03S2L06ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD50N03S2L06ATMA1 meets industry standards.
7.What is the process for return or replacement of IPD50N03S2L06ATMA1?
All IPD50N03S2L06ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPD50N03S2L06ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPD50N03S2L06ATMA1 part is unused and in its original packaging.
Return procedure for IPD50N03S2L06ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPD50N03S2L06ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

