Infineon Technologies IPD50N04S309ATMA1
- Part No.:
- IPD50N04S309ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPD50N04S309ATMA1.pdf
- Description:
- MOSFET N-CH 40V 50A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,338
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPD50N04S309ATMA1 from Infineon Technologies is an N-channel enhancement-mode automotive-qualified OptiMOS™-T power MOSFET in PG-TO252-3-11 package, rated for 40 V VDS, 9 mΩ RDS(on) at 10 V VGS, and 50 A continuous drain current at TC = 25 °C. It delivers high-current switching in engine control units, DC-DC converters, and motor drivers under harsh thermal conditions.
For engineers reviewing the IPD50N04S309ATMA1 datasheet, IPD50N04S309ATMA1 pinout, IPD50N04S309ATMA1 application, or IPD50N04S309ATMA1 equivalent, key selection criteria include its AEC-Q101 qualification, 175 °C maximum junction temperature, 140 mJ single-pulse avalanche energy, and integrated body diode with 30 ns reverse recovery time.
Technical Context
This MOSFET employs trench-based silicon technology optimized for low conduction and switching losses in 12 V automotive systems. Its gate threshold voltage (2.1–4.0 V) enables robust TTL/CMOS-level drive compatibility, while the 20–26 nC total gate charge supports efficient high-frequency PWM operation up to 100 kHz.
The device integrates a fast-recovery body diode (trr = 30 ns, Qrr = 32 nC) and is fully characterized for unclamped inductive switching (UIS), with 100% avalanche testing ensuring ruggedness in load-dump and inductive turn-off transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum blocking voltage for 12 V battery rail applications including start-stop and load-dump scenarios |
| RDS(on) max | 9 mΩ at VGS = 10 V, ID = 50 A - Enables <1.5 W conduction loss at 40 A, critical for thermally constrained PCB layouts |
| ID cont | 50 A at TC = 25 °C - Supported by 2.4 K/W junction-to-case thermal resistance for direct heatsink mounting |
| EAS | 140 mJ at ID = 25 A - Confirmed single-pulse avalanche capability for inductive load switching without external snubbers |
| trr | 30 ns - Fast body diode recovery minimizes shoot-through risk and switching loss in synchronous rectification |
| Qg | 20–26 nC - Enables gate drive with standard 1 A peak drivers at 50–100 kHz switching frequencies |
| Tj max | 175 °C - Rated for under-hood environments including transmission control modules and EPS systems |
Pinout & Package
IPD50N04S309ATMA1 uses the PG-TO252-3-11 (DPAK) surface-mount package with exposed drain pad for thermal performance. The three terminals are arranged in standard DPAK orientation: Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control input | Accepts 0–10 V logic-level signals; 8–11 nC Qgs ensures fast turn-on with minimal Miller effect |
| Pin 2 (Drain) | High-side switch node | Exposed copper tab electrically connected to drain; provides primary thermal path to PCB copper area |
| Pin 3 (Source) | Power return reference | Common source connection for gate driver return and current sensing; low-inductance layout essential for EMI control |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive powertrain and chassis applications per stress test requirements including HTGB, HTRB, and UIS |
| MSL1 reflow rating | Withstands peak solder temperatures up to 260 °C without delamination or parameter shift |
| 100% avalanche tested | Each unit verified for 140 mJ single-pulse energy handling-no screening lot sampling |
| Green RoHS-compliant package | Halogen-free, lead-free construction compliant with EU Directive 2011/65/EU and JESD204B |
| Optimized Ciss/Coss ratio | 1350–1750 pF input capacitance with 720–940 pF output capacitance enables stable gate drive in high dv/dt environments |
Applications
| Engine Control Unit (ECU) Injector Driver | Automotive DC-DC Converter Primary Switch |
|---|---|
Use Scenario: High-speed, high-current switching of fuel injectors in gasoline direct injection systems operating at 12 V nominal with ±20 % battery variation. IC Role / Device Role / Timing Role: Low-side power switch controlling injector coil current with precise on-time resolution down to 10 µs. Use Value: 9 mΩ RDS(on) reduces coil heating and improves fuel metering accuracy; 175 °C rating ensures reliability during extended idle-stop cycles. | Use Scenario: Primary-side synchronous rectifier in 12 V to 5 V/3.3 V buck converter powering ADAS sensors and infotainment ECUs. IC Role / Device Role / Timing Role: High-efficiency power switch operating at 200–500 kHz with tight duty-cycle control. Use Value: 30 ns trr and low Qrr minimize dead-time losses and enable >95 % efficiency at full load. |
| Electric Power Steering (EPS) Motor Phase Switch | Body Control Module (BCM) Load Driver |
Use Scenario: Half-bridge phase leg in 12 V brushed or BLDC motor drives for steering assist, subject to high surge currents and vibration. IC Role / Device Role / Timing Role: High-current, high-ruggedness switch handling bidirectional motor current up to 50 A peak. Use Value: 140 mJ EAS and 200 A pulsed rating protect against inductive kickback during emergency torque cut-off events. | Use Scenario: Driving resistive and inductive loads (headlights, relays, solenoids) in centralized BCMs with PWM dimming and diagnostics. IC Role / Device Role / Timing Role: Smart high-side or low-side load switch with overcurrent and thermal foldback protection. Use Value: Integrated body diode eliminates need for external freewheeling diodes; AEC-Q101 qualification ensures field longevity beyond 15-year vehicle life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL130N4LF6AG | 40 V, 1.3 mΩ RDS(on) at 10 V, but only rated to 150 °C Tj and not AEC-Q101 qualified | Suitable for industrial motor drives; lacks automotive stress validation and high-temp endurance | Select only if AEC-Q101 and 175 °C operation are not required |
| IRF3709ZCPBF | 30 V VDS, 10.5 mΩ RDS(on), non-automotive grade, MSL3 only | Limited to 12 V accessory circuits with no load-dump immunity or under-hood thermal margin | Use only in non-safety-critical cabin applications with controlled ambient conditions |
Compared with STL130N4LF6AG and IRF3709ZCPBF, IPD50N04S309ATMA1 uniquely combines AEC-Q101 qualification, 175 °C operation, and 100% avalanche testing-making it the only choice for safety-relevant powertrain switching where failure modes must be bounded.
Availability
IPD50N04S309ATMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and automotive DC-DC converters requiring stable component supply across multi-year production programs.
Supply support for IPD50N04S309ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the OptiMOS™-T product line-designed specifically for high-current, high-temperature automotive power switching with emphasis on avalanche ruggedness and AEC-Q101 compliance.
FAQ
Is IPD50N04S309ATMA1 pin-compatible with earlier IPD50N04S3-09 revisions?
Yes-IPD50N04S309ATMA1 is the tape-and-reel packaged version of the same die and package as IPD50N04S3-09. Electrical specifications, pinout, thermal characteristics, and marking (3N0409) are identical; only packaging format differs (reel vs. tray).
What is the recommended PCB layout for optimal thermal performance?
Mount the device on a minimum 6 cm² copper area connected directly to the drain tab using ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch). Use FR4 1.5 mm thick board in vertical orientation; this achieves RthJA = 40 K/W per datasheet condition.
Does the body diode support synchronous rectification in buck converters?
Yes-the body diode has trr = 30 ns and Qrr = 32 nC at IF = 50 A, enabling use in synchronous buck topologies up to 500 kHz. However, external Schottky diodes may still be preferred for ultra-low VSD (<0.5 V) requirements.
Can IPD50N04S309ATMA1 be driven directly by a 3.3 V microcontroller GPIO?
No-its gate threshold range is 2.1–4.0 V, but RDS(on) is only guaranteed ≤9 mΩ at VGS ≥ 10 V. A dedicated gate driver (e.g., IRS2007) or level-shifting buffer is required for full enhancement and low-loss operation.
IPD50N04S309ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 9mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 28µA
- Gate Charge (Qg) (Max) @ Vgs:
- 26 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1750 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 63W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-11
IPD50N04S309ATMA1 FAQ
1.How can I place an order for IPD50N04S309ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPD50N04S309ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPD50N04S309ATMA1 reliable?
The price and inventory of IPD50N04S309ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPD50N04S309ATMA1 is usually 5 days.
3.What payment methods are accepted for IPD50N04S309ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPD50N04S309ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPD50N04S309ATMA1?
IPD50N04S309ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPD50N04S309ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPD50N04S309ATMA1?
For technical support, including IPD50N04S309ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPD50N04S309ATMA1 requirements.
6.How does Aetrix verify that IPD50N04S309ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPD50N04S309ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPD50N04S309ATMA1 meets industry standards.
7.What is the process for return or replacement of IPD50N04S309ATMA1?
All IPD50N04S309ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPD50N04S309ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPD50N04S309ATMA1 part is unused and in its original packaging.
Return procedure for IPD50N04S309ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPD50N04S309ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

