Infineon Technologies IPDQ60T022S7XTMA1
- Part No.:
- IPDQ60T022S7XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
IPDQ60T022S7XTMA1.pdf
- Description:
- HIGH POWER_NEW
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Product details
Overview
IPDQ60T022S7XTMA1 from Infineon is a 600 V, 22 mΩ CoolMOS™ S7T superjunction MOSFET with integrated temperature sensor (TS), housed in PG-HDSOP-22 package. It delivers 24 A continuous drain current at TC = 25°C, supports 371 A pulsed operation, and features a body diode with 0.82 V forward voltage. Designed for static switching and high-current industrial power conversion, it enables solid-state relays and high-efficiency line rectification in UPS and solar inverters.
For engineers reviewing the IPDQ60T022S7XTMA1 datasheet, IPDQ60T022S7XTMA1 pinout, IPDQ60T022S7XTMA1 application, or IPDQ60T022S7XTMA1 equivalent, key selection criteria include RDS(on) stability over temperature, embedded junction temperature sensing accuracy, gate charge (150 nC), dv/dt ruggedness (20 V/ns), and thermal resistance (RthJC = 0.3 °C/W).
Technical Context
This device implements a silicon-based superjunction MOSFET architecture with optimized charge balance for low conduction loss and high avalanche robustness. Its integrated temperature sensor uses a calibrated silicon diode (forward voltage shift ≈5.2–5.96 mV/K) referenced to the source, enabling real-time junction temperature monitoring without external components.
The PG-HDSOP-22 package integrates a thermally enhanced exposed tab (Drain-connected) and separates Driver Source (Pin 4) from Power Source (Pins 5–11) to minimize source inductance and improve switching control fidelity. Gate drive requires careful resistor placement on Driver Source-not Gate-to ensure stable paralleling behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Withstands full mains-line transients in 400 V AC rectified systems without derating. |
| RDS(on),max | 22 mΩ @ Tj = 25°C - Enables <1.2 W conduction loss at 23 A, reducing heatsink requirements. |
| Qg,typ | 150 nC - Dictates gate driver power and rise/fall time control; compatible with standard 1–2 A peak drivers. |
| Tj max | 175°C (limited duration) - Supports extended thermal margin in high ambient environments like industrial enclosures. |
| RthJC | 0.3 °C/W - Allows direct thermal coupling to heatsink via exposed tab; enables >400 W dissipation at ΔT = 120 K. |
| VSD | 0.82 V @ IF = 23 A - Low body diode drop improves efficiency in freewheeling and synchronous rectification modes. |
| dv/dt ruggedness | 20 V/ns - Resists false turn-on during fast voltage transients in hard-switched topologies. |
Pinout & Package
IPDQ60T022S7XTMA1 uses the PG-HDSOP-22 surface-mount package with an exposed copper drain tab for thermal and electrical connection. The 22-pin layout separates high-current paths (Drain Pins 12–22 + Tab) from signal-level gate and sense terminals to minimize coupling and enable precise thermal feedback.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Pins 12–22 + Tab) | Main current return path and thermal interface | Tab is electrically connected to Drain; must be soldered to PCB copper pour for thermal performance and EMI control. |
| Gate (Pins 1–2) | Control electrode for channel formation | Dual-pin configuration reduces gate loop inductance; requires low-inductance routing to driver IC. |
| Power Source (Pins 5–11) | Reference node for main load current | Carries full output current; connects to system ground or low-side return path in half-bridge configurations. |
| Driver Source (Pin 4) | Reference node for gate driver circuit | Isolated from Power Source to eliminate source inductance effects on gate control; gate resistor must be placed here. |
| Temperature Sensor (Pin 3) | Junction temperature sensing diode anode | Provides calibrated forward voltage (1.60–2.13 V @ 25°C, 0.67–1.37 V @ 175°C) for closed-loop thermal protection. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded temperature sensor | ±2°C junction temperature measurement accuracy over 25–175°C range using factory-trimmed diode forward voltage slope (5.2–5.96 mV/K). |
| Optimized for static switching | Low RDS(on) and high pulse current (371 A) support contactor replacement in PLCs and energy storage disconnects without forced cooling. |
| High dv/dt ruggedness | 20 V/ns rating ensures immunity to parasitic turn-on in high-di/dt applications like motor drives and UPS inverters. |
| Separate Driver/Power Source pins | Eliminates source inductance-induced gate oscillation during switching, improving reliability in paralleled configurations. |
Applications
| Solid-State Relay (SSR) | High-Power Line Rectification |
|---|---|
Use Scenario: Replacing electromechanical relays in programmable logic controllers for battery isolation and grid-tie disconnection. IC Role / Device Role / Timing Role: High-voltage, high-current static switch operating in on/off mode with thermal fault detection. Use Value: Eliminates mechanical wear, enables 10× faster switching, and provides real-time junction temperature feedback for predictive maintenance. |
Use Scenario: Active front-end rectification in 10–20 kW telecom rectifiers and solar string inverters. IC Role / Device Role / Timing Role: Unidirectional power switch in boost PFC or Vienna rectifier stages, conducting at line frequency. Use Value: Reduces conduction losses by 35% vs. legacy 600 V MOSFETs, lowering heatsink mass and system footprint. |
| Industrial Circuit Breaker | Energy Storage System (ESS) Disconnect |
Use Scenario: Fast-acting DC breaker in medium-voltage battery racks for EV charging infrastructure. IC Role / Device Role / Timing Role: Bidirectional blocking element with active overtemperature shutdown via integrated TS pin. Use Value: Achieves <100 µs fault response using local thermal sensing-no external thermistor or delay from remote sensing. |
Use Scenario: Isolation switch between lithium-ion battery banks and bidirectional DC/DC converters in microgrids. IC Role / Device Role / Timing Role: High-reliability, low-RDS(on) disconnect MOSFET with built-in thermal derating capability. Use Value: Enables automatic current derating based on real-time junction temperature, extending cell lifetime under partial-load thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage, high-current static switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPW60R024P7XKSA1 | No integrated temperature sensor; RDS(on) = 24 mΩ; same 600 V rating and PG-TO247-4 package. | Lacks on-die thermal monitoring; requires external NTC and ADC channel for junction temperature estimation. | Select when cost sensitivity outweighs need for embedded diagnostics and thermal optimization. |
| IPP60R035C7XKSA1 | Higher RDS(on) (35 mΩ); no TS; CoolMOS™ C7 generation; lower Qg (110 nC); TO-220FP package. | Lower switching loss but higher conduction loss; unsuitable for >15 A continuous applications without aggressive cooling. | Select for space-constrained designs where TO-220FP mounting is preferred and thermal budget allows higher RDS(on). |
Compared with IPDQ60T022S7XTMA1, IPW60R024P7XKSA1 trades thermal intelligence for lower unit cost and broader second-source availability, while IPP60R035C7XKSA1 prioritizes ease of gate drive and legacy package compatibility at the expense of conduction efficiency and thermal visibility.
Availability
IPDQ60T022S7XTMA1 is available at Aetrix Electronics and suitable for solid-state relay design, high-power line rectification, and industrial circuit breaker development requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for IPDQ60T022S7XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy markets.
This part belongs to the CoolMOS™ S7T product line, engineered specifically for static switching and high-current, low-frequency power control-emphasizing thermal intelligence, avalanche robustness, and system-level reliability in mission-critical infrastructure.
FAQ
What is the function of Pin 4 (Driver Source) versus Pins 5–11 (Power Source)?
Pin 4 (Driver Source) serves exclusively as the reference node for the gate driver circuit, isolating gate control from high-current return paths. Pins 5–11 form the Power Source terminal, carrying full load current back to the system ground. This separation prevents source inductance from distorting gate voltage waveforms-critical for stable paralleling and noise immunity in high-di/dt applications.
How is the temperature sensor calibrated and used in practice?
The temperature sensor is a factory-calibrated silicon diode (Pin 3 anode, Power Source as cathode) with a forward voltage that decreases linearly with junction temperature (slope ≈5.2–5.96 mV/K). Users apply a constant 10–500 µA current source and measure VF to derive Tj using the provided lookup tables or polynomial coefficients in the datasheet-enabling real-time thermal protection without external sensors.
Can IPDQ60T022S7XTMA1 be paralleled with identical units?
Yes, but only with strict adherence to layout guidelines: gate resistors must be placed on Driver Source (Pin 4), not Gate; drain and source traces must be symmetrical; and thermal coupling to the heatsink must be uniform across all devices. The separate Driver/Power Source pins and matched RDS(on) tolerance (±20%) enable stable current sharing up to four devices in parallel.
What is the maximum allowable pulsed drain current and under what conditions?
The pulsed drain current is rated at 371 A for pulses ≤100 µs at TC = 25°C, limited by single-pulse SOA and junction temperature rise. This value assumes proper gate drive (VGS ≥ 12 V), minimal trace inductance, and adequate heatsinking to prevent cumulative thermal stress. Exceeding 100 µs pulse width requires derating per the Safe Operating Area curves in the datasheet.
IPDQ60T022S7XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
IPDQ60T022S7XTMA1 FAQ
1.How can I place an order for IPDQ60T022S7XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPDQ60T022S7XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of IPDQ60T022S7XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPDQ60T022S7XTMA1 is usually 5 days.
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Once your IPDQ60T022S7XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for IPDQ60T022S7XTMA1?
For technical support, including IPDQ60T022S7XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPDQ60T022S7XTMA1 requirements.
6.How does Aetrix verify that IPDQ60T022S7XTMA1 is sourced from the original manufacturer or authorized distributors?
All IPDQ60T022S7XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPDQ60T022S7XTMA1 meets industry standards.
7.What is the process for return or replacement of IPDQ60T022S7XTMA1?
All IPDQ60T022S7XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPDQ60T022S7XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPDQ60T022S7XTMA1 part is unused and in its original packaging.
Return procedure for IPDQ60T022S7XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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