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Infineon Technologies IPDQ65R029CFD7AXTMA1

Part No.:
IPDQ65R029CFD7AXTMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
22-PowerBSOP Module
Datasheet:
AetrixIPDQ65R029CFD7AXTMA1.pdf
Description:
AUTOMOTIVE_COOLMOS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5

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Product details

Overview

IPDQ65R029CFD7AXTMA1 from Infineon is a 650 V, 29 mΩ automotive-qualified Superjunction MOSFET in PG-HDSOP-22 package with Kelvin source configuration, integrated fast body diode (di/dt = 1300 A/μs), and 139 nC total gate charge - optimized for ZVS phase-shift full-bridge and LLC resonant DC-DC converters in on-board chargers.

For engineers reviewing the IPDQ65R029CFD7AXTMA1 datasheet, IPDQ65R029CFD7AXTMA1 pinout, IPDQ65R029CFD7AXTMA1 application, or IPDQ65R029CFD7AXTMA1 equivalent, key selection criteria include RDS(on) temperature stability, avalanche ruggedness (358 mJ), dv/dt immunity (120 V/ns), and source-sense pin separation for accurate high-side current sensing in high-frequency PFC stages.

Technical Context

This CoolMOS™ CFD7A device implements a silicon-based superjunction structure with charge compensation, enabling ultra-low RDS(on) × Qg and RDS(on) × Eoss figures of merit. Its Kelvin source architecture separates driver and power return paths to suppress common-source inductance effects during hard switching.

The integrated fast-recovery body diode (trr = 208 ns, Qrr = 1.60 μC) supports zero-voltage switching in resonant topologies without external anti-parallel diodes. It is fully qualified per AEC-Q101 and 100% avalanche tested at IAS = 7.3 A, VDD = 50 V.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 650 V - Maximum blocking voltage compatible with 400 V AC input PFC and 400–800 V DC bus systems
RDS(on) 29 mΩ @ Tj = 25°C - Enables low conduction loss in high-current OBC primary side (ID,pulse = 304 A)
Qg 139 nC - Total gate charge determines drive strength requirement and switching loss trade-off at >100 kHz
Eoss 20.9 μJ @ 400 V - Low output energy enables efficient soft-switching in LLC converters
di/dt (body diode) 1300 A/μs - Supports fast commutation in phase-shifted full-bridge without oscillation or shoot-through risk
Tj,max 150 °C - Junction temperature rating allows operation in sealed automotive power modules without derating
RthJC 0.27 °C/W - Low thermal resistance enables 463 W power dissipation at TC = 25°C with minimal heatsink

Pinout & Package

IPDQ65R029CFD7AXTMA1 uses the PG-HDSOP-22 package - a 22-pin thermally enhanced surface-mount outline with exposed metal tab for direct heatsinking and dual-source Kelvin configuration.

Pin/Terminal Circuit Role Design Meaning
Drain (Pins 12–22 + Tab) Main power drain connection All drain pins and metal tab are internally shorted - provides parallel current paths and low-inductance thermal path to heatsink
Gate (Pin 1) Control terminal Standard MOSFET gate input; requires gate resistor placement on Driver Source (Pin 2), not Gate, when paralleling devices
Power Source (Pins 3–11) High-current source return Carries full load current; connects to main PCB ground plane or busbar - must not be interchanged with Sense Source
Driver Source (Pin 2) Kelvin sense reference Provides low-noise gate drive reference; separates control loop from power loop to minimize switching noise coupling
Internal Body Diode Integrated antiparallel diode Fast recovery (trr = 208 ns) and high di/dt capability enable use in resonant topologies without external diode

Key Features

Feature Design Value
AEC-Q101 qualification Validated for automotive powertrain and charging applications including 15-year lifetime under thermal cycling stress
Ultra-low RDS(on) × Qg Enables >98% efficiency in 3.3 kW OBC PFC stage at 100 kHz while reducing gate driver power demand
Kelvin source terminals Eliminates source inductance impact on switching waveform fidelity - critical for precise timing control in ZVS circuits
100% single-pulse avalanche rated Guarantees robustness against transient overvoltage events (EAS = 358 mJ) without derating in unregulated bus conditions
Low Eoss & fast body diode Reduces turn-off loss and eliminates reverse recovery spikes in LLC half-bridge operation up to 1 MHz

Applications

On-Board Charger (OBC) PFC Stage LLC Resonant DC-DC Converter

Use Scenario: 6.6 kW bidirectional OBC with active front-end PFC operating at 70–100 kHz.

IC Role / Device Role / Timing Role: High-side switching element in continuous conduction mode (CCM) boost PFC with precise current regulation.

Use Value: 29 mΩ RDS(on) and Kelvin source reduce conduction loss by 18% vs. prior-gen CFD6, improving light-load efficiency by 1.2%.

Use Scenario: Isolated 3.3 kW DC-DC stage converting 400 V battery to 400 V HV auxiliary supply in BEV platforms.

IC Role / Device Role / Timing Role: Primary-side switch in asymmetric half-bridge LLC topology with ZVS across full load range.

Use Value: Integrated fast body diode (di/dt = 1300 A/μs) enables reliable ZVS down to 10% load without snubbers or dead-time tuning.

ZVS Phase-Shift Full-Bridge Industrial 3-Phase PFC Rectifier

Use Scenario: 15 kW traction charger using phase-shift modulation with 200 kHz switching frequency.

IC Role / Device Role / Timing Role: Lagging-leg switch subjected to hard-commutated turn-on; relies on body diode conduction before gate activation.

Use Value: 1300 A/μs di/dt rating prevents diode snap-off and voltage overshoot during commutation, eliminating need for external diodes.

Use Scenario: 11 kW industrial EVSE with three-phase Vienna rectifier topology requiring high reliability and low THD.

IC Role / Device Role / Timing Role: Active switch in boost leg with bidirectional current capability and high dv/dt immunity.

Use Value: 120 V/ns dv/dt ruggedness ensures stable operation under fast grid transients (e.g., capacitor bank switching) without false triggering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPW65R030CFD7XKSA1 TO-247-4L package, same RDS(on) (30 mΩ), higher RthJC (0.45 °C/W), no Kelvin source Limited to lower-power (<5 kW) or forced-air-cooled designs; lacks driver-source isolation for precision gate control Prefer for cost-sensitive industrial SMPS where Kelvin source is unnecessary and through-hole mounting is required
IPP65R045CFD7XKSA1 PG-TO220-3-1 package, higher RDS(on) (45 mΩ), 100% avalanche tested, no Kelvin source Suitable only for <3 kW applications; higher conduction loss increases thermal design margin requirements Select when board space constraints prohibit HDSOP-22 footprint and system power level permits higher RDS(on)

Compared with IPW65R030CFD7XKSA1 and IPP65R045CFD7XKSA1, IPDQ65R029CFD7AXTMA1 delivers superior thermal performance (0.27 °C/W), precise gate control via Kelvin source, and higher pulse current rating (304 A), making it the only choice for compact, high-power automotive OBCs requiring ZVS reliability.

Availability

IPDQ65R029CFD7AXTMA1 is available at Aetrix Electronics and suitable for on-board chargers, LLC DC-DC converters, and ZVS phase-shift full-bridge inverters requiring stable component supply across automotive production lifecycles.

Supply support for IPDQ65R029CFD7AXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor leader specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.

This device belongs to the CoolMOS™ CFD7A product line - engineered specifically for automotive-grade high-efficiency power conversion in electric vehicle charging and traction systems, emphasizing reliability under thermal cycling and radiation-hardened operation.

FAQ

Can IPDQ65R029CFD7AXTMA1 be used in linear mode operation?

No. Infineon explicitly advises against linear-mode operation for this device. The datasheet states "We do not recommend using the CoolMOS™ mentioned in this datasheet to operate in 'linear mode'" due to uncontrolled thermal runaway risk. For applications requiring analog conduction, contact Infineon sales for validated alternatives with SOA-rated linear operation capability.

What is the purpose of separating Power Source and Driver Source pins?

The separation isolates the high-current power return path (Pins 3–11) from the low-noise gate drive reference (Pin 2). This prevents voltage drop across source inductance from distorting the gate-to-source voltage waveform, ensuring clean switching edges and stable ZVS behavior - especially critical in high-frequency resonant converters.

Is the internal body diode suitable for reverse conduction in bidirectional OBC operation?

Yes. The integrated body diode is characterized for reverse recovery (trr = 208 ns, Qrr = 1.60 μC) and di/dt (1300 A/μs), making it suitable for bidirectional conduction in V2G-capable OBCs. However, its forward voltage (VSD = 1.0 V @ 35.8 A) is higher than discrete SiC diodes, so efficiency trade-offs must be evaluated at full load.

How does the PG-HDSOP-22 package improve thermal performance over TO-247?

The PG-HDSOP-22 package features an exposed metal tab directly soldered to the PCB, achieving RthJC = 0.27 °C/W - 40% lower than typical TO-247-4L (0.45 °C/W). This enables higher power density and eliminates mechanical mounting hardware, reducing assembly cost and thermal interface resistance in automotive module integration.

IPDQ65R029CFD7AXTMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
22-PowerBSOP Module
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
85A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
29mOhm @ 35.8A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 1.79mA
Gate Charge (Qg) (Max) @ Vgs:
139 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
7149 pF @ 400 V
FET Feature:
-
Power Dissipation (Max):
463W (Tc)
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
PG-HDSOP-22-1

IPDQ65R029CFD7AXTMA1 FAQ

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The price and inventory of IPDQ65R029CFD7AXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPDQ65R029CFD7AXTMA1 is usually 5 days.

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5.How can I obtain technical support or documentation for IPDQ65R029CFD7AXTMA1?

For technical support, including IPDQ65R029CFD7AXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPDQ65R029CFD7AXTMA1 requirements.

6.How does Aetrix verify that IPDQ65R029CFD7AXTMA1 is sourced from the original manufacturer or authorized distributors?

All IPDQ65R029CFD7AXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPDQ65R029CFD7AXTMA1 meets industry standards.

7.What is the process for return or replacement of IPDQ65R029CFD7AXTMA1?

All IPDQ65R029CFD7AXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPDQ65R029CFD7AXTMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPDQ65R029CFD7AXTMA1 part is unused and in its original packaging.

Return procedure for IPDQ65R029CFD7AXTMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IPDQ65R029CFD7AXTMA1 Tags

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