Infineon Technologies IPF019N12NM6ATMA1
- Part No.:
- IPF019N12NM6ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
IPF019N12NM6ATMA1.pdf
- Description:
- TRENCH >=100V
- Quantity:
- Payment:

- Shipping:

Inventory:2,021
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPF019N12NM6ATMA1 from Infineon Technologies is a 120 V, 1.9 mΩ N-channel OptiMOSTM 6 power MOSFET in PG-TO263-7 (D²-PAK) package, rated for 254 A continuous drain current at TC=25 °C and optimized for high-frequency switching in industrial DC-DC converters and motor drives. Its low Qg (113 nC), ultra-low Qrr (336 nC @ 1000 A/µs), and 175 °C operation enable robust performance in hard-switched SMPS and synchronous rectification.
For engineers reviewing the IPF019N12NM6ATMA1 datasheet, IPF019N12NM6ATMA1 pinout, IPF019N12NM6ATMA1 application, or IPF019N12NM6ATMA1 equivalent, key selection criteria include RDS(on) stability over temperature, gate charge × RDS(on) figure-of-merit (FOM), reverse recovery behavior under high di/dt, thermal resistance (RthJC = 0.38 °C/W), and D²-PAK 7-pin layout with tab-as-drain configuration.
Technical Context
This device implements a trench-gate, superjunction-based N-channel MOSFET architecture with integrated body diode optimized for low Qrr and soft recovery. It operates with normal-level gate drive (VGS(th) = 2.6–3.6 V) and delivers stable RDS(on) up to 175 °C junction temperature, supported by a 1406 mJ single-pulse avalanche energy rating.
The PG-TO263-7 package features an exposed drain tab (Pin 4 + metal tab) for low-inductance, high-current conduction and thermal path optimization. Pin 1 is gate, Pins 2/3/5/6/7 are source terminals - enabling parallel-source routing and reduced source inductance critical for high-speed switching stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 120 V - Maximum blocking voltage for 48 V–96 V bus applications with 20 % margin |
| RDS(on), max | 1.9 mΩ @ VGS=10 V, ID=100 A - Enables <1.9 W conduction loss at 100 A, critical for high-efficiency power stages |
| ID, cont | 254 A @ TC=25 °C - Supports high-current output stages without paralleling in compact industrial inverters |
| Qg | 113 nC - Low gate charge reduces driver power demand and enables >500 kHz switching with standard gate drivers |
| Qrr | 336 nC @ dI/dt=1000 A/µs - Minimizes turn-on losses and EMI in hard-switched topologies with fast current transients |
| EAS | 1406 mJ - Robust single-pulse avalanche capability ensures reliability during load dump or short-circuit events |
| RthJC | 0.38 °C/W - Enables high-power dissipation with minimal junction-to-case temperature rise on properly heatsinked PCBs |
Pinout & Package
IPF019N12NM6ATMA1 uses the PG-TO263-7 (D²-PAK) surface-mount package with an exposed copper drain tab for thermal and electrical conduction. The 7-pin layout supports low-inductance source return paths and high-current drain routing via the tab and Pin 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Control input requiring ≤10 V logic-level drive; low Ciss (8.1–11 nF) eases driver selection |
| Pins 2,3,5,6,7 | Source | Multiple parallel source terminals reduce package inductance and improve switching stability |
| Pin 4 + Tab | Drain | Main high-current drain path; tab provides primary thermal path and low-inductance connection to PCB copper |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) × Qg FOM | 215 Ω·nC - Directly improves efficiency in high-frequency SMPS by minimizing combined conduction and switching losses |
| Optimized body diode Qrr | 336 nC @ 1000 A/µs - Reduces turn-on loss and voltage overshoot in synchronous rectifiers and half-bridge freewheeling |
| 175 °C maximum junction temperature | Enables operation in sealed enclosures or high-ambient environments without derating, extending system lifetime |
| MSL 1 moisture sensitivity | Eliminates bake requirements before reflow, supporting standard SMT assembly processes without special handling |
| Halogen-free & RoHS-compliant plating | Meets IPC-1752A and IEC 61249-2-21 standards for environmentally regulated industrial and automotive-adjacent systems |
Applications
| Industrial Motor Drives | Server & Telecom DC-DC Converters |
|---|---|
Use Scenario: 3-phase inverter stage in 5–15 kW servo drives operating at 20–100 kHz switching frequency with forced-air cooling. IC Role / Device Role / Timing Role: High-side and low-side power switch in 6-pack IGBT/MOSFET inverter modules, handling peak currents >300 A. Use Value: 1.9 mΩ RDS(on) and 0.38 °C/W RthJC maintain <100 °C junction temperature under full load, avoiding thermal shutdown. | Use Scenario: Primary-side switch in 48 V input, 12 V output isolated LLC resonant converter for AI accelerator racks. IC Role / Device Role / Timing Role: High-frequency hard-switched MOSFET in asymmetric half-bridge topology, operating at 300–600 kHz. Use Value: Low Qrr (336 nC) and soft-recovery body diode minimize dead-time losses and EMI generation during ZVS transitions. |
| Onboard EV Chargers | Renewable Energy Inverters |
Use Scenario: DC-link switching stage in 11 kW bidirectional OBC handling both AC/DC and DC/AC conversion. IC Role / Device Role / Timing Role: Bidirectional power switch in dual-active-bridge (DAB) topology, conducting up to 223 A in reverse diode mode. Use Value: 223 A continuous diode current rating and 1406 mJ EAS ensure safe operation during grid fault conditions and regenerative braking surges. | Use Scenario: MPPT boost stage in 10 kW string inverters interfacing PV arrays with 100–120 V DC input. IC Role / Device Role / Timing Role: Main switching element in interleaved boost converter, operating at 100 kHz with 50 % duty cycle. Use Value: Stable RDS(on) across –40 °C to 175 °C ensures consistent efficiency across outdoor ambient extremes and solar thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current, high-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW70N120K5 | 1200 V, 70 A, TO-247 package, RDS(on) = 22 mΩ - higher voltage rating but 11× higher on-resistance | Targeted at 600–1200 V systems (e.g., solar string inverters); unsuitable for 48–96 V high-current designs | Select only if system requires >600 V blocking; not drop-in due to voltage/current mismatch and package incompatibility |
| IXFH50N120P | 1200 V, 50 A, TO-247, RDS(on) = 32 mΩ - significantly higher RDS(on), lower current, no Qrr optimization | Designed for snubberless switching in medium-frequency industrial UPS; lacks low-Qrr body diode | Not suitable for high-frequency, high-di/dt applications where Qrr and FOM are critical |
Compared with STW70N120K5 and IXFH50N120P, IPF019N12NM6ATMA1 delivers 11× lower RDS(on) and 10× higher continuous current in a surface-mount package, making it uniquely suited for compact, high-efficiency 120 V industrial power stages - whereas alternatives serve higher-voltage, lower-current niches with different thermal and layout constraints.
Availability
IPF019N12NM6ATMA1 is available at Aetrix Electronics and suitable for industrial motor drives, server DC-DC converters, onboard EV chargers, and renewable energy inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IPF019N12NM6ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with leadership in silicon and wide-bandgap power devices.
This part belongs to the OptiMOSTM 6 family - engineered for high-current, high-frequency industrial power conversion, emphasizing low FOM, rugged avalanche performance, and thermally efficient packaging for demanding embedded power systems.
FAQ
What is the maximum continuous drain current for IPF019N12NM6ATMA1 at 100 °C case temperature?
At TC = 100 °C, the maximum continuous drain current is 195 A with VGS = 10 V, per Table 2 of the datasheet. This reflects thermal derating from the 254 A rating at 25 °C, maintaining safe junction temperature limits under sustained high-power operation.
Does IPF019N12NM6ATMA1 support gate drive voltages below 10 V?
Yes - it is specified for VGS = 8 V operation, delivering RDS(on) ≤ 2.23 mΩ at ID = 50 A. Gate threshold voltage ranges from 2.6 V to 3.6 V, enabling reliable enhancement-mode turn-on with standard 8 V logic or level-shifted gate drivers.
How does the body diode performance compare to standard silicon MOSFETs?
Its body diode achieves Qrr = 336 nC at 1000 A/µs - approximately 40–60 % lower than typical Gen 5 silicon MOSFETs - due to optimized carrier lifetime control. This results in lower turn-on loss, reduced voltage overshoot, and improved EMI behavior in synchronous rectification and freewheeling applications.
Is the drain tab electrically isolated from other pins in the PG-TO263-7 package?
No - the exposed drain tab is electrically connected to Pin 4 and forms the primary drain terminal. It must be soldered to a dedicated, isolated copper pour on the PCB serving as both thermal interface and high-current drain path; no insulation layer is required or recommended beneath the tab.
IPF019N12NM6ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
IPF019N12NM6ATMA1 FAQ
1.How can I place an order for IPF019N12NM6ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPF019N12NM6ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPF019N12NM6ATMA1 reliable?
The price and inventory of IPF019N12NM6ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPF019N12NM6ATMA1 is usually 5 days.
3.What payment methods are accepted for IPF019N12NM6ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPF019N12NM6ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPF019N12NM6ATMA1?
IPF019N12NM6ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPF019N12NM6ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPF019N12NM6ATMA1?
For technical support, including IPF019N12NM6ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPF019N12NM6ATMA1 requirements.
6.How does Aetrix verify that IPF019N12NM6ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPF019N12NM6ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPF019N12NM6ATMA1 meets industry standards.
7.What is the process for return or replacement of IPF019N12NM6ATMA1?
All IPF019N12NM6ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPF019N12NM6ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPF019N12NM6ATMA1 part is unused and in its original packaging.
Return procedure for IPF019N12NM6ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPF019N12NM6ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

