Infineon Technologies IPF09N03LA G
- Part No.:
- IPF09N03LA G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IPF09N03LA G.pdf
- Description:
- MOSFET N-CH 25V 50A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,607
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Product details
Overview
IPF09N03LA G from Infineon Technologies is an N-channel logic-level MOSFET optimized for high-frequency DC/DC converters, featuring 25 V VDS, 8.6 mΩ RDS(on) (SMD version, VGS=10 V), 50 A continuous drain current at TC=25 °C, and 175 °C maximum junction temperature - deployed in synchronous buck converters for server VRMs and telecom power supplies.
For engineers reviewing the IPF09N03LA G datasheet, IPF09N03LA G pinout, IPF09N03LA G application, or IPF09N03LA G equivalent, key selection criteria include gate charge (Qg = 10–13 nC), thermal resistance (RthJC = 2.4 K/W), reverse diode performance (VSD = 0.97–1.2 V @ 50 A), and JEDEC-qualified reliability for industrial power conversion.
Technical Context
This OptiMOS®2 device uses a trench-gate superjunction structure enabling low RDS(on) × Qg figure-of-merit (FOM) critical for high-efficiency, high-switching-frequency operation. Its logic-level gate drive (VGS(th) = 1.2–2.0 V) ensures full enhancement with 4.5 V control rails.
Thermal design is supported by a low junction-to-case resistance (2.4 K/W) and validated 175 °C operation, while its reverse diode exhibits fast recovery (Qrr = 10 nC) and robust dv/dt immunity (6 kV/µs), making it suitable for hard-switched synchronous rectification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 25 V - rated blocking voltage for 12 V input bus applications with margin |
| RDS(on) max | 8.6 mΩ @ VGS=10 V, SMD version - enables <1 W conduction loss at 50 A |
| Qg | 10–13 nC - determines gate drive power and switching speed in 300–1000 kHz converters |
| ID continuous | 50 A @ TC=25 °C - limited by bondwire; actual chip capability is 67 A |
| RthJC | 2.4 K/W - allows direct heatsink mounting for thermal management without PCB copper area dependency |
| VGS(th) | 1.2–2.0 V - ensures reliable turn-on with standard 3.3 V or 5 V logic-level controllers |
| Qrr | 10 nC - minimizes body-diode conduction loss and EMI during dead-time in synchronous FETs |
Pinout & Package
IPF09N03LA G is housed in PG-TO252-3-23 package (leadless DPAK variant), with drain-connected tab for thermal and electrical integration. The three terminals are arranged in standard TO252 footprint for surface-mount assembly on FR4 PCBs with 6 cm² copper cooling area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Low-side reference node; connects to ground or output rail in buck topology |
| Pin 2 (Gate) | Control input | Receives PWM signal; requires <13 nC charge for full 0→10 V transition |
| Pin 3 (Drain) | Power input/output node | Connected to high-side switch node or input bus; tab is electrically tied to drain |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V - compatible with microcontroller GPIO and low-voltage gate drivers |
| Optimized FOM (RDS(on) × Qg) | ~85 mΩ·nC - reduces combined conduction and switching losses in 500 kHz+ DC/DC stages |
| 175 °C rated junction | Enables operation in sealed enclosures or high-ambient environments without derating |
| JEDEC-qualified reliability | Qualified per J-STD-020 and JESD22 - validated for reflow, humidity, and temperature cycling in production |
| Low Qrr body diode | 10 nC reverse recovery charge - suppresses shoot-through risk and improves light-load efficiency |
Applications
| Server VRM | Telecom DC/DC Converter |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (0.8–1.2 V @ up to 200 A). IC Role / Device Role / Timing Role: Synchronous rectifier FET in low-side position, switching at 500–800 kHz with precise dead-time control. Use Value: 8.6 mΩ RDS(on) and 10–13 nC Qg enable >95% efficiency at 50 A load while minimizing gate driver power consumption. | Use Scenario: Isolated 48 V to 12 V intermediate bus converter in 19-inch rack systems. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in forward or active-clamp forward topology. Use Value: 175 °C rating and 6 kV/µs dv/dt immunity ensure stable operation under transient overvoltage and high ambient temperatures. |
| Industrial PLC Power Supply | Automotive ADAS Camera Module PSU |
Use Scenario: Non-isolated 24 V to 5 V/3.3 V point-of-load regulator powering I/O and communication interfaces. IC Role / Device Role / Timing Role: Low-side switch in buck controller IC-integrated or discrete driver configuration. Use Value: Logic-level threshold (1.2–2.0 V) guarantees turn-on with 3.3 V MCU outputs, eliminating level-shifter circuitry. | Use Scenario: Compact 12 V to 1.8 V/2.5 V power stage for image sensor and ISP in automotive camera ECU. IC Role / Device Role / Timing Role: High-efficiency synchronous FET in space-constrained buck regulator operating at 1 MHz. Use Value: PG-TO252-3-23 package provides 2.4 K/W RthJC with minimal PCB area - critical for thermally dense ADAS modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPD09N03LA G | PG-TO252-3-11 package; RDS(on) = 8.8 mΩ (max) @ 10 V; same die, different leadframe | Identical electrical specs but higher RthJA due to different thermal pad layout | Select when legacy board layout uses TO252-3-11 footprint and thermal path relies on PCB copper |
| IRLHS6342TRPBF | 20 V VDS, 6.5 mΩ RDS(on) @ 4.5 V, 30 A ID; Micro3™ package (smaller, lower capacitance) | Better low-VGS performance but lower voltage rating and current capacity | Select for 5 V input systems requiring ultra-low Qg (6.2 nC) and compact size, not for 12 V+ buses |
Compared with IPD09N03LA G and IRLHS6342TRPBF, IPF09N03LA G uniquely balances 25 V rating, 50 A capability, and logic-level drive in a thermally optimized DPAK variant - making it optimal for 12–24 V industrial and telecom converters where both current and thermal headroom are critical.
Availability
IPF09N03LA G is available at Aetrix Electronics and suitable for server VRMs, telecom DC/DC converters, and industrial PLC power supplies requiring stable component supply, long-term lifecycle support, and JEDEC-qualified reliability.
Supply support for IPF09N03LA G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
This part belongs to the OptiMOS®2 family, designed specifically for high-efficiency, high-frequency DC/DC conversion in enterprise and infrastructure power systems - emphasizing low FOM, thermal robustness, and logic-level compatibility.
FAQ
What is the maximum safe operating frequency for IPF09N03LA G in a synchronous buck converter?
IPF09N03LA G supports switching frequencies up to 1 MHz in well-designed layouts, based on its 10–13 nC total gate charge and 5.1 ns fall time. Real-world operation at 500–800 kHz is typical for 50 A loads, provided gate drive strength exceeds 2 A peak and PCB parasitics are minimized to avoid ringing.
Does IPF09N03LA G require a gate resistor, and if so, what value is recommended?
A gate resistor of 2.7 Ω is used in the datasheet's switching characterization (td(off), tf). For most 500 kHz applications, 2.2–4.7 Ω balances switching speed and gate driver stress. Lower values (<2 Ω) increase EMI risk; higher values (>10 Ω) degrade efficiency via prolonged transition times.
Can IPF09N03LA G be used as a replacement for IPD09N03LA G in existing designs?
Yes - both share identical die, RDS(on), Qg, and thermal specs. The only difference is package variant: IPF09N03LA G uses PG-TO252-3-23 (enhanced thermal pad), while IPD09N03LA G uses PG-TO252-3-11. Mechanical fit must be verified, but electrical performance is interchangeable.
Is the body diode suitable for continuous freewheeling in non-synchronous configurations?
Yes - the integrated Schottky-like body diode supports 50 A continuous forward current (IS) and 350 A pulsed current (IS,pulse). However, VSD = 0.97–1.2 V at 50 A means ~50 W conduction loss, so synchronous operation is strongly preferred for efficiency-critical designs.
IPF09N03LA G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 8.6mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 20µA
- Gate Charge (Qg) (Max) @ Vgs:
- 13 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1642 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 63W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO252-3-23
IPF09N03LA G FAQ
1.How can I place an order for IPF09N03LA G through Aetrix?
Please submit a Request for Quotation (RFQ) for IPF09N03LA G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPF09N03LA G reliable?
The price and inventory of IPF09N03LA G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPF09N03LA G is usually 5 days.
3.What payment methods are accepted for IPF09N03LA G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPF09N03LA G transactions.
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4.How is shipping managed for IPF09N03LA G?
IPF09N03LA G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPF09N03LA G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPF09N03LA G?
For technical support, including IPF09N03LA G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPF09N03LA G requirements.
6.How does Aetrix verify that IPF09N03LA G is sourced from the original manufacturer or authorized distributors?
All IPF09N03LA G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPF09N03LA G meets industry standards.
7.What is the process for return or replacement of IPF09N03LA G?
All IPF09N03LA G units undergo pre-shipment inspection (PSI). If there is an issue with IPF09N03LA G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPF09N03LA G part is unused and in its original packaging.
Return procedure for IPF09N03LA G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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