Infineon Technologies IPI084N06L3GXKSA1
- Part No.:
- IPI084N06L3GXKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IPI084N06L3GXKSA1.pdf
- Description:
- MOSFET N-CH 60V 50A TO262-3
- Quantity:
- Payment:

- Shipping:

Inventory:6,054
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPI084N06L3GXKSA1 from Infineon Technologies is an N-channel logic-level power MOSFET in PG-TO262-3 package, rated for 60 V VDS, 8.1 mΩ RDS(on) at VGS = 10 V and ID = 50 A, with 100% avalanche tested ruggedness and optimized FOM for high-frequency DC/DC converters.
For engineers reviewing the IPI084N06L3GXKSA1 datasheet, IPI084N06L3GXKSA1 pinout, IPI084N06L3GXKSA1 application, or IPI084N06L3GXKSA1 equivalent, key selection criteria include gate charge (Qg = 22–29 nC), low RDS(on) at 4.5 V (9.4–14 mΩ), thermal resistance (RthJC = 1.9 K/W), and synchronous rectification capability in compact industrial power supplies.
Technical Context
This OptiMOS™3 device employs trench-gate superjunction technology to achieve low gate charge × RDS(on) product (FOM), enabling efficient switching up to several hundred kHz in isolated and non-isolated DC/DC topologies. Its logic-level gate drive (VGS(th) = 1.2–2.2 V) supports direct interfacing with 3.3 V and 5 V controllers.
The integrated body diode features fast reverse recovery (trr = 40 ns, Qrr = 39 nC) and low forward voltage (VSD = 1.0–1.2 V at IF = 50 A), making it suitable for synchronous rectification where diode conduction loss and switching loss must be minimized simultaneously.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum blocking voltage for 48 V input bus applications with margin |
| RDS(on) max | 8.1 mΩ @ VGS = 10 V, ID = 50 A - Enables <1.5 W conduction loss at full load in 50 A power stages |
| Qg | 22–29 nC - Low total gate charge reduces driver power and enables high-frequency PWM operation |
| tr/tf | 26 ns / 7 ns - Fast switching transitions minimize overlap loss in hard-switched converters |
| EAS | 43 mJ - Single-pulse avalanche energy rating ensures robustness against inductive turn-off transients |
| RthJC | 1.9 K/W - Junction-to-case thermal resistance supports high-power density mounting on heatsinks |
| VGS(th) | 1.2–2.2 V - Logic-level threshold allows reliable turn-on with standard microcontroller GPIOs |
Pinout & Package
Package: PG-TO262-3 (straight lead variant of TO-262, surface-mount compatible with through-hole footprint). Case material: thermally enhanced epoxy; drain-connected tab for direct heatsink mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Low-side reference node; connects to ground or low-side switch node in half-bridge |
| Pin 2 (Gate) | Control input | High-impedance MOSFET gate requiring low-current drive; sensitive to ESD |
| Pin 3 (Drain) | Power output / high-side connection | Internally connected to metal tab; electrically and thermally ties to heatsink |
Key Features
| Feature | Design Value |
|---|---|
| Optimized FOM (Qg × RDS(on)) | Enables >95% efficiency in 300–500 kHz 48 V→12 V DC/DC converters with minimal gate drive loss |
| 100% avalanche tested | Guarantees single-pulse ruggedness up to 43 mJ without derating, eliminating need for external snubbers in flyback designs |
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V, compatible with standard PWM controllers and MCU outputs without level-shifting |
| Halogen-free & RoHS compliant | Meets IEC61249-2-21 and JEDEC J-STD-020 standards for lead-free assembly and environmental compliance |
Applications
| Server VRM Power Stage | Industrial DC/DC Converter |
|---|---|
Use Scenario: High-current, high-efficiency point-of-load regulation in 1U server motherboards with 48 V intermediate bus. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in multiphase buck converter, switching at 400–600 kHz. Use Value: 8.1 mΩ RDS(on) and 29 nC Qg reduce conduction + switching losses by 18% vs. prior-gen MOSFETs at 50 A load. | Use Scenario: Primary-side switch and secondary-side synchronous rectifier in isolated 24 V→5 V/3.3 V telecom power supplies. IC Role / Device Role / Timing Role: Secondary-side MOSFET in active clamp forward or LLC resonant converter, driven by transformer-coupled gate signal. Use Value: Fast tf = 7 ns and low Qrr = 39 nC suppress shoot-through risk and diode reverse recovery loss during zero-voltage switching transitions. |
| Automotive Body Control Module | Renewable Energy Inverter Auxiliary Supply |
Use Scenario: Load switching and motor drive in 12 V/24 V automotive BCMs with strict EMC and thermal constraints. IC Role / Device Role / Timing Role: High-side load switch controlling solenoids, fans, or LED arrays with PWM dimming. Use Value: VGS(th) = 1.7 V typ ensures stable turn-on across -40 °C to 150 °C ambient, avoiding cold-start failure. | Use Scenario: Auxiliary 24 V→5 V supply in solar string inverters, operating continuously under high ambient temperature. IC Role / Device Role / Timing Role: Primary switch in flyback controller powering gate drivers and sensing circuitry. Use Value: RthJC = 1.9 K/W and Tj(max) = 175 °C allow sustained 50 A operation with passive heatsinking in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPP084N06L3G | Same die, PG-TO220-3 package; RthJC = 1.9 K/W identical, but higher RthJA due to leadframe geometry | Preferred for prototyping and lower-volume through-hole assembly; less suitable for automated SMT lines | Select when manual soldering or heatsink clamping is used; avoid if board space or thermal via count is constrained |
| IPB081N06L3G | Lower RDS(on) (7.0–8.4 mΩ), same VDS/Qg; uses PG-TO263-3 package with exposed drain pad | Better suited for ultra-high-density layouts requiring minimal PCB area and maximum thermal transfer to copper planes | Choose for space-constrained 6-layer boards with internal thermal planes; requires reflow profile optimization for large pad |
Compared with IPP084N06L3G and IPB081N06L3G, IPI084N06L3GXKSA1 offers identical electrical performance in a PG-TO262-3 package that balances SMT compatibility, mechanical robustness, and thermal interface simplicity-ideal for high-reliability industrial power modules where lead coplanarity and wave-solder tolerance matter.
Availability
IPI084N06L3GXKSA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC/DC converters, and automotive body control modules requiring stable component supply and long-term lifecycle support.
Supply support for IPI084N06L3GXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
This part belongs to the OptiMOS™3 product line, engineered specifically for high-efficiency, high-frequency power conversion in server, telecom, and industrial applications where low RDS(on) and low gate charge are critical.
FAQ
What is the maximum continuous drain current at 100 °C case temperature?
The maximum continuous drain current ID is rated at 50 A up to TC = 100 °C, limited by bondwire capacity-not junction temperature. At TC = 100 °C, the chip itself can sustain 73 A, but the package limits safe operation to 50 A per JEDEC qualification.
Does this MOSFET require a gate resistor for stability in high-speed switching?
Yes-a gate resistor (typically 1.6 Ω, as specified in dynamic test conditions) is required to dampen ringing caused by gate loop inductance and prevent unintended oscillation. The device's low gate resistance (RG = 0.9 Ω typ) makes it especially sensitive to PCB layout parasitics above 300 kHz.
Can IPI084N06L3GXKSA1 be used in linear mode (constant-current regulation)?
No-it is not characterized or qualified for linear-mode operation. The Safe Operating Area (SOA) graph shows only single-pulse capability; sustained operation in the linear region risks thermal runaway due to positive temperature coefficient of RDS(on) and insufficient SOA margin below 10 V VDS.
Is the drain tab electrically isolated from the package leads?
No-the drain is internally connected to the metal tab and Pin 3. The tab must be electrically tied to the drain net and thermally attached to a heatsink; no insulating pad is needed unless system isolation requirements dictate reinforced insulation between heatsink and circuit ground.
IPI084N06L3GXKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 8.4mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 34µA
- Gate Charge (Qg) (Max) @ Vgs:
- 29 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4900 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 79W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO262-3-1
IPI084N06L3GXKSA1 FAQ
1.How can I place an order for IPI084N06L3GXKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPI084N06L3GXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPI084N06L3GXKSA1 reliable?
The price and inventory of IPI084N06L3GXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPI084N06L3GXKSA1 is usually 5 days.
3.What payment methods are accepted for IPI084N06L3GXKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPI084N06L3GXKSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPI084N06L3GXKSA1?
IPI084N06L3GXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPI084N06L3GXKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPI084N06L3GXKSA1?
For technical support, including IPI084N06L3GXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPI084N06L3GXKSA1 requirements.
6.How does Aetrix verify that IPI084N06L3GXKSA1 is sourced from the original manufacturer or authorized distributors?
All IPI084N06L3GXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPI084N06L3GXKSA1 meets industry standards.
7.What is the process for return or replacement of IPI084N06L3GXKSA1?
All IPI084N06L3GXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPI084N06L3GXKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPI084N06L3GXKSA1 part is unused and in its original packaging.
Return procedure for IPI084N06L3GXKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPI084N06L3GXKSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

