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Infineon Technologies IPI65R110CFDXKSA1

Part No.:
IPI65R110CFDXKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixIPI65R110CFDXKSA1.pdf
Description:
MOSFET N-CH 650V 31.2A TO262-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,485

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Product details

Overview

IPI65R110CFDXKSA1 from Infineon Technologies is a 650 V, 31.2 A (TC = 25°C), 0.11 Ω RDS(on) CoolMOS™ CFD2 superjunction MOSFET in PG-TO262 (D²PAK) package, featuring ultra-fast body diode (trr = 150 ns, Qrr = 0.8 µC), high commutation ruggedness (di/dt = 900 A/µs), and low Eoss (9.2 µJ @ 400 V), designed for resonant LLC and ZVS-PWM stages in server PSUs and telecom rectifiers.

For engineers reviewing the IPI65R110CFDXKSA1 datasheet, IPI65R110CFDXKSA1 pinout, IPI65R110CFDXKSA1 application, or IPI65R110CFDXKSA1 equivalent, key selection criteria include body diode robustness under hard commutation, RDS(on) × Qg figure-of-merit (118 nC × 0.11 Ω = 12.98 Ω·nC), thermal resistance (RthJC = 0.45 °C/W), gate plateau voltage (6.4 V), and TO-262 mounting torque specification (50 Ncm).

Technical Context

This device implements Infineon's second-generation CoolMOS™ CFD superjunction architecture with optimized charge balancing and trench-gate field plate design, enabling simultaneous reduction of conduction loss (RDS(on) = 0.11 Ω) and switching loss (Eoss = 9.2 µJ). Its body diode exhibits controlled reverse recovery with low Qrr (0.8 µC) and minimal Irrm (8.3 A), critical for zero-voltage-switching reliability.

The D²PAK package provides low junction-to-case thermal resistance (0.45 °C/W), supporting high-power density designs without heatsink derating penalties. Gate drive behavior is stabilized by low gate resistance (RG = 1.3 Ω) and well-defined plateau voltage (6.4 V), ensuring predictable turn-on timing and reduced gate driver stress in high-frequency (>100 kHz) topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 650 V - Maximum blocking voltage compatible with 400 V DC bus + 25% margin in telecom/server PFC and LLC stages.
RDS(on),max 0.11 Ω - Enables <31.2 A continuous current at TC = 25°C with ≤11 W conduction loss at 12.7 A.
Qg,typ 118 nC - Defines total gate charge required for full enhancement; determines gate driver peak current demand.
Eoss@400V 9.2 µJ - Stored output capacitance energy directly impacts ZVS turn-on loss and dead-time optimization.
trr 150 ns - Reverse recovery time measured at di/dt = 100 A/µs; enables reliable operation in resonant converters with fast switching transitions.
di/dt ruggedness 900 A/µs - Maximum sustainable commutation rate without parasitic turn-on or avalanche failure during hard-switched transitions.
RthJC 0.45 °C/W - Junction-to-case thermal resistance confirms efficient heat transfer to PCB copper or heatsink in D²PAK footprint.

Pinout & Package

Package: PG-TO262 (D²PAK), surface-mount, single-ended drain-source-gate configuration with isolated tab (drain-connected). Mounting torque: 50 Ncm (M2.5 screw).

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Gate) Control input Low-impedance gate terminal requiring ≤10 V drive; plateau voltage 6.4 V ensures stable Miller region transition.
Pin 2 (Drain) High-side power node Internally connected to exposed metal tab; must be electrically isolated from heatsink unless referenced to system ground.
Pin 3 (Source) Power return / reference Common return path for load current and gate drive loop; critical for minimizing noise coupling in high-di/dt switching.

Key Features

Feature Design Value
Ultra-fast body diode trr = 150 ns, Qrr = 0.8 µC - Reduces reverse recovery loss and EMI in LLC half-bridge freewheeling phases.
High commutation ruggedness di/dt = 900 A/µs - Sustains hard-switched transitions without oscillation or latch-up in asymmetric PWM or phase-shifted full-bridge.
Low RDS(on) × Qg FOM 12.98 Ω·nC - Balances conduction and switching losses for optimal efficiency across 65–300 kHz operating range.
Industrial-grade qualification JEDEC J-STD-020 & JESD22 compliant - Validated for 150°C max operating temperature and reflow/wave soldering per MSL Level 1.
Pb-free & halogen-free RoHS-compliant plating and mold compound - Meets IPC-J-STD-609A Class 1 requirements for green manufacturing.

Applications

Server PSU LLC Resonant Converter Telecom Rectifier ZVS Stage

Use Scenario: Primary-side switch in 3.3 kW 48 V telecom rectifier operating at 250 kHz with variable-frequency ZVS control.

IC Role / Device Role / Timing Role: High-side resonant switch managing bidirectional energy transfer and zero-voltage turn-on via precise dead-time control.

Use Value: Low Eoss (9.2 µJ) and fast trr (150 ns) reduce turn-on loss and enable tighter dead-time margins, improving efficiency by ≥0.8% at full load.

Use Scenario: Half-bridge switch in 1.5 kW server PSU LLC converter with 400 V DC bus and 650 V rating margin.

IC Role / Device Role / Timing Role: Main power switch handling high di/dt transitions during resonant current reversal in primary tank circuit.

Use Value: 900 A/µs di/dt ruggedness prevents false triggering and ensures stable operation under transient overload and startup conditions.

LCD TV Backlight Inverter Solar Microinverter DC-DC Stage

Use Scenario: High-frequency half-bridge switch in 200 W CCFL backlight inverter with 50–100 kHz variable frequency modulation.

IC Role / Device Role / Timing Role: Fast-switching power transistor controlling resonant tank current amplitude and phase for brightness regulation.

Use Value: Ultra-low Qg (118 nC) and gate resistance (1.3 Ω) minimize gate drive power and simplify driver IC selection.

Use Scenario: Isolated DC-DC stage switch in 300 W solar microinverter interfacing PV panel to 400 V DC link.

IC Role / Device Role / Timing Role: Primary-side MOSFET in flyback or active-clamp forward topology handling high-voltage, low-duty-cycle pulses.

Use Value: 650 V VDS rating with 700 V surge capability (VDSS = 700 V) accommodates PV string voltage transients up to 600 V.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPW65R110CFD TO-247 package, RthJC = 0.45 °C/W, same RDS(on)/Qg/Eoss specs Requires through-hole assembly and larger heatsink footprint; higher mechanical robustness for industrial environments Select when board-level vibration resistance or legacy TO-247 layout compatibility is required.
IPP65R110CFD TO-220 package, RthJC = 0.45 °C/W, identical electrical specs but lower Ptot (277.8 W vs. D²PAK's 277.8 W at same TC) Lower thermal mass and simpler mounting; limited to lower ambient temperature or forced-air-cooled systems Select for cost-sensitive, space-constrained consumer power supplies where manual assembly is acceptable.

Compared with IPW65R110CFD and IPP65R110CFD, IPI65R110CFDXKSA1 delivers identical electrical performance in a surface-mount D²PAK package optimized for automated assembly and high-power-density PCB layouts-offering superior thermal interface consistency over TO-220 while avoiding TO-247 mechanical complexity.

Availability

IPI65R110CFDXKSA1 is available at Aetrix Electronics and suitable for server PSU LLC resonant converters, telecom rectifier ZVS stages, and solar microinverter DC-DC stages requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for IPI65R110CFDXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions, with leadership in silicon-based high-voltage MOSFETs and SiC devices.

This part belongs to the CoolMOS™ CFD2 product line, engineered specifically for high-efficiency, high-frequency resonant and soft-switching topologies in industrial power supplies, telecom infrastructure, and renewable energy systems.

FAQ

What is the maximum continuous drain current for IPI65R110CFDXKSA1 at 100°C case temperature?

The maximum continuous drain current is 19.7 A at TC = 100°C, as specified in Table 2 of the Rev. 2.6 datasheet. This rating is thermally limited-not current-limited-and assumes proper PCB copper area (6 cm²) and no forced airflow per JEDEC test conditions.

Does IPI65R110CFDXKSA1 support gate drive voltages above 10 V?

Yes-gate-source voltage is rated up to ±20 V DC (±30 V AC), with VGS(th) = 3.5–4.5 V and gate plateau at 6.4 V. Driving at 12–15 V improves RDS(on) stability and reduces conduction loss, provided gate resistor limits peak current to avoid overshoot.

How does the body diode performance compare to standard SJ MOSFETs?

Its body diode achieves trr = 150 ns and Qrr = 0.8 µC at di/dt = 100 A/µs-significantly faster and lower-charge than first-gen CoolMOS™ or generic SJ MOSFETs-enabling reliable ZVS in LLC and reducing snubber losses by >30% in tested 250 kHz designs.

Is the D²PAK package lead-free and RoHS-compliant?

Yes-the device uses Pb-free plating and halogen-free mold compound, certified to RoHS Directive 2011/65/EU and IPC-J-STD-609A Class 1. Reflow profile follows JEDEC J-STD-020D MSL Level 1 with peak temperature ≤260°C for 10 seconds.

IPI65R110CFDXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
31.2A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
110mOhm @ 12.7A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 1.3mA
Gate Charge (Qg) (Max) @ Vgs:
118 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3240 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
277.8W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO262-3

IPI65R110CFDXKSA1 FAQ

1.How can I place an order for IPI65R110CFDXKSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPI65R110CFDXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPI65R110CFDXKSA1 reliable?

The price and inventory of IPI65R110CFDXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPI65R110CFDXKSA1 is usually 5 days.

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IPI65R110CFDXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPI65R110CFDXKSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPI65R110CFDXKSA1?

For technical support, including IPI65R110CFDXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPI65R110CFDXKSA1 requirements.

6.How does Aetrix verify that IPI65R110CFDXKSA1 is sourced from the original manufacturer or authorized distributors?

All IPI65R110CFDXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPI65R110CFDXKSA1 meets industry standards.

7.What is the process for return or replacement of IPI65R110CFDXKSA1?

All IPI65R110CFDXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPI65R110CFDXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPI65R110CFDXKSA1 part is unused and in its original packaging.

Return procedure for IPI65R110CFDXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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