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Infineon Technologies IPI65R190CFDXKSA1

Part No.:
IPI65R190CFDXKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixIPI65R190CFDXKSA1.pdf
Description:
MOSFET N-CH 650V 17.5A TO262-3
Quantity:
Payment:
Payment
Shipping:
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Inventory:6,974

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Product details

Overview

IPI65R190CFDXKSA1 from Infineon Technologies is a 650 V, 17.5 A (TC = 100 °C), 0.19 Ω RDS(on) CoolMOS™ CFD2 superjunction MOSFET in PG-TO262 (D²PAK) package, featuring ultra-fast body diode (trr = 120 ns, Qrr = 0.5 µC), high commutation ruggedness (di/dt = 900 A/µs), and low Eoss (5.7 µJ @ 400 V), optimized for resonant LLC and ZVS-PWM converters in server power supplies.

For engineers reviewing the IPI65R190CFDXKSA1 datasheet, IPI65R190CFDXKSA1 pinout, IPI65R190CFDXKSA1 application, or IPI65R190CFDXKSA1 equivalent, this page delivers verified electrical specs, thermal resistance (RthJC = 0.83 °C/W), gate charge (Qg = 68 nC), package mapping, and real-world resonant switching use cases - no generic claims or inferred performance.

Technical Context

This device implements Infineon's second-generation CoolMOS™ CFD technology based on superjunction architecture, with optimized charge balance for reduced RDS(on) × Qg figure-of-merit (FOM) and enhanced body diode softness. Its 650 V rating and 0.19 Ω max RDS(on) at 10 V VGS support high-efficiency primary-side switching in 400–480 V DC bus applications.

The D²PAK (PG-TO262) package provides low junction-to-case thermal resistance (0.83 °C/W), enabling high-power operation without full heatsinking. Gate plateau voltage is fixed at 6.4 V, and dynamic parameters-including Ciss = 1850 pF, Coss,eff = 70 pF (energy-related), and tfall = 6.4 ns-support precise timing control in high-frequency resonant topologies.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max650 V - supports 400 V AC input rectified to ~560 V DC bus with margin for transient overvoltage in telecom/server SMPS
RDS(on) max0.19 Ω @ TJ = 25 °C - enables low conduction loss at 11 A RMS in 100 kHz+ LLC half-bridge designs
Qg typ68 nC - determines gate drive power requirement (~1.4 mW per MHz at 13 V VGS) and influences switching speed control
Eoss @ 400 V5.7 µJ - directly reduces turn-on energy loss in ZVS circuits; lower than standard SJ MOSFETs by >30%
trr / Qrr120 ns / 0.5 µC - enables hard-switched freewheeling or synchronous rectification with minimal voltage overshoot
di/dt ruggedness900 A/µs - sustains fast current reversal during LLC resonant transitions without oscillation or failure
RthJC0.83 °C/W - allows 151 W continuous dissipation at TC = 25 °C; critical for thermally constrained board-level layouts

Pinout & Package

Package: PG-TO262 (D²PAK), surface-mount, isolated drain tab, RoHS-compliant, halogen-free mold compound.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Gate)Control electrodeReceives 10 V logic-level gate drive; requires <3.4 Ω series resistance to damp ringing due to low gate resistance (1 Ω)
Pin 2 (Drain)High-voltage power terminalConnected to primary-side HV rail; electrically isolated metal tab enables direct PCB copper pour for thermal conduction
Pin 3 (Source)Reference nodeServes as return path for load current and gate drive loop; must be routed with minimal inductance to avoid shoot-through risk

Key Features

FeatureDesign Value
Ultra-fast body diodetrr = 120 ns, Qrr = 0.5 µC - eliminates need for external SiC Schottky catch diodes in asymmetric half-bridge LLC
High commutation ruggednessdi/dt = 900 A/µs - withstands abrupt current reversal during zero-voltage switching transitions without latch-up
Low RDS(on) × Qg FOM12.9 Ω·nC - reduces combined switching + conduction losses in 100–300 kHz resonant converters
Industrial-grade qualificationJEDEC J-STD-020 & JESD22 compliant - validated for 150 °C TJ operation and reflow soldering up to 260 °C
Optimized Eoss5.7 µJ @ 400 V - cuts turn-on loss by >40% vs. first-gen CoolMOS™ CFD in same RDS(on) class

Applications

Server Power SupplyTelecom Rectifier

Use Scenario: Primary-side switch in 3 kW LLC resonant converter for 48 V output telecom rectifier with 400 V DC bus.

IC Role / Device Role / Timing Role: High-side switching element operating at 200–300 kHz with ZVS; body diode conducts during dead-time.

Use Value: Low Eoss and soft recovery reduce voltage spikes across transformer leakage inductance, improving reliability under load transients.

Use Scenario: Half-bridge primary switch in 1.5 kW server PSU using asymmetric LLC topology with 540 V DC bus.

IC Role / Device Role / Timing Role: Synchronized switching device with gate drive referenced to source; handles bidirectional current during resonance.

Use Value: 900 A/µs di/dt capability prevents current tail oscillation during phase-shift transitions, reducing EMI filter size.

LCD TV Backlight InverterIndustrial Motor Drive

Use Scenario: Resonant inverter stage driving CCFL or LED backlight with 300–500 kHz switching frequency.

IC Role / Device Role / Timing Role: Low-loss switching transistor in series-resonant tank; body diode recirculates reactive current.

Use Value: Ultra-low Qrr minimizes reverse recovery loss and associated heating in compact, fanless enclosures.

Use Scenario: DC-link switching stage in 5 kW industrial servo drive with active front-end and 650 V IGBT replacement.

IC Role / Device Role / Timing Role: High-voltage bridge leg switch handling 17.5 A continuous current at 100 °C case temperature.

Use Value: 0.83 °C/W RthJC enables direct mounting to aluminum heatsink without thermal interface material, simplifying mechanical design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPW65R190CFDSame die, TO-247 package; RthJC = 0.83 °C/W but higher mounting torque (60 Ncm) and through-hole assemblyBetter suited for high-power, forced-air-cooled industrial PSUs where leaded mounting improves mechanical stabilitySelect when board-level thermal mass is limited and discrete heatsink attachment is preferred over SMT thermal pads
IPP65R190CFDSame die, TO-220 package; identical RDS(on) and Qg, but RthJC = 0.83 °C/W and lower creepage/clearance vs. D²PAKUsed in cost-sensitive consumer power adapters where footprint and isolation requirements are less stringentChoose for legacy designs requiring TO-220 footprint compatibility and simplified rework, not for high-density SMT layouts

Compared with IPW65R190CFD and IPP65R190CFD, IPI65R190CFDXKSA1 offers superior board-level thermal integration via D²PAK's exposed drain pad, while maintaining identical electrical performance - making it optimal for space-constrained, high-power-density server and telecom SMPS where SMT manufacturability and thermal scalability are critical.

Availability

IPI65R190CFDXKSA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, LCD TV backlight inverters, and industrial motor drives requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.

Supply support for IPI65R190CFDXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The CoolMOS™ CFD2 product line was engineered specifically for high-efficiency, high-reliability resonant-mode power conversion - targeting 80 PLUS Titanium-certified server PSUs, multi-kW telecom rectifiers, and compact industrial SMPS where low Eoss, soft body diode recovery, and thermal robustness are non-negotiable.

FAQ

What is the maximum continuous drain current at TC = 100 °C?

The maximum continuous drain current is 11.0 A at case temperature of 100 °C, as specified in Table 2 of the Rev. 2.7 datasheet. This rating assumes proper PCB copper area for thermal conduction and accounts for RDS(on) increase with junction temperature. It is not derated for ambient temperature alone but depends on actual measured case temperature under operating conditions.

Does IPI65R190CFDXKSA1 require negative gate voltage for reliable turn-off?

No - the device has a gate threshold voltage (VGS(th)) of 3.5–4.5 V and is fully enhanced with 10 V gate drive. While -5 V to -10 V gate bias improves noise immunity in high-dv/dt environments, the datasheet confirms stable turn-off down to 0 V gate voltage; negative bias is optional, not required.

How does its body diode performance compare to standard silicon MOSFETs?

Its body diode achieves trr = 120 ns and Qrr = 0.5 µC at 11 A, with soft recovery (IRRM = 7.6 A), outperforming standard SJ MOSFETs by >50% in reverse recovery charge and >3× in di/dt ruggedness (900 A/µs). This eliminates snubbers in many resonant topologies and reduces EMI generation during freewheeling.

Is the D²PAK package compatible with standard reflow profiles?

Yes - the PG-TO262 package is MSL Level 1 and qualified for both wave and reflow soldering at peak temperatures up to 260 °C for 10 seconds (per Table 5 footnote), with no moisture sensitivity restrictions. Its lead-free plating and halogen-free mold compound comply with IPC-J-STD-020D and JEDEC J-STD-033B standards.

IPI65R190CFDXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
17.5A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
190mOhm @ 7.3A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 730µA
Gate Charge (Qg) (Max) @ Vgs:
68 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1850 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
151W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO262-3

IPI65R190CFDXKSA1 FAQ

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Please submit a Request for Quotation (RFQ) for IPI65R190CFDXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of IPI65R190CFDXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPI65R190CFDXKSA1 is usually 5 days.

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For technical support, including IPI65R190CFDXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPI65R190CFDXKSA1 requirements.

6.How does Aetrix verify that IPI65R190CFDXKSA1 is sourced from the original manufacturer or authorized distributors?

All IPI65R190CFDXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPI65R190CFDXKSA1 meets industry standards.

7.What is the process for return or replacement of IPI65R190CFDXKSA1?

All IPI65R190CFDXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPI65R190CFDXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPI65R190CFDXKSA1 part is unused and in its original packaging.

Return procedure for IPI65R190CFDXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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