Infineon Technologies IPL60R299CPAUMA1
- Part No.:
- IPL60R299CPAUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 4-PowerTSFN
- Datasheet:
-
IPL60R299CPAUMA1.pdf
- Description:
- MOSFET N-CH 600V 11.1A 4VSON
- Quantity:
- Payment:

- Shipping:

Inventory:3,823
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPL60R299CPAUMA1 from Infineon Technologies is a 600 V, 0.299 Ω RDS(on) CoolMOS™ CP superjunction MOSFET in ThinPAK 8x8 package, designed for high-efficiency, high-density SMPS in server and adapter applications. It delivers 22 nC total gate charge, 4.2 µJ Eoss at 400 V, and supports 34 A pulsed drain current with 200 A/µs diode commutation speed.
For engineers reviewing the IPL60R299CPAUMA1 datasheet, IPL60R299CPAUMA1 pinout, IPL60R299CPAUMA1 application, or IPL60R299CPAUMA1 equivalent, key selection criteria include its low FOM (RDS(on) × Qg), JEDEC-qualified reliability for server/adapter use, ultra-low-profile ThinPAK packaging, and robust dv/dt ruggedness (50 V/ns).
Technical Context
This device employs a superjunction architecture optimized for hard-switched and resonant topologies, featuring a 5.0 V gate plateau voltage and 1.9 Ω intrinsic gate resistance-enabling predictable drive timing and reduced external gate resistor dependency. Its 46 pF energy-related output capacitance (Co(er)) and 120 pF time-related output capacitance (Co(tr)) support fast, low-loss switching transitions under 400–480 V bus conditions.
The integrated body diode exhibits 0.9 V forward voltage at 6.6 A and 300 ns reverse recovery time with 3.9 µC Qrr, enabling reliable operation in synchronous rectification and LLC half-bridge configurations where diF/dt up to 200 A/µs is encountered.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - rated blocking voltage for primary-side switching in 400 V DC-link SMPS |
| RDS(on), max | 0.299 Ω @ Tj = 150 °C - ensures low conduction loss at full thermal load |
| Qg, typ | 22 nC - enables efficient gate drive with minimal driver power and reduced switching loss |
| Eoss @ 400 V | 4.2 µJ - lowers turn-off energy loss in high-frequency ZVS/ZCS designs |
| diF/dt capability | 200 A/µs - supports fast body-diode commutation without oscillation in bridge legs |
| Tj max | 150 °C - allows sustained operation in thermally constrained server PSU modules |
| RthJC | 1.3 °C/W - enables high-power dissipation with minimal junction-to-case thermal rise |
Pinout & Package
ThinPAK 8x8 (PG-VSON-4) is a leadless surface-mount package measuring 8 mm × 8 mm × 1 mm, offering 64 mm² footprint (43% smaller than D²PAK) and ultra-low parasitic inductance for high-speed switching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control input | High-impedance MOSFET gate terminal requiring <20 V absolute max rating; drives channel via 5.0 V plateau |
| Pin 2 (Source) | Driver return path | Low-inductance source connection for gate driver loop; shared with power source return in half-bridge layout |
| Pins 3 & 4 (Power Source) | Main current return | Parallel-source configuration reduces effective RDS(on) and improves thermal spreading across PCB copper |
| Drain (exposed pad) | High-voltage output | Thermally and electrically connected to PCB drain copper; carries full switched current and dissipates heat directly |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) × Qg figure-of-merit | Enables >95% efficiency in 100–300 kHz server PSUs while reducing gate driver stress |
| JEDEC-qualified reliability | Validated per J-STD-020 and JESD22 for server and adapter end equipment lifetimes |
| ThinPAK 8x8 mechanical profile | 1 mm height enables integration into ultra-thin power modules and low-profile adapters |
| 200 A/µs body diode diF/dt rating | Eliminates need for external snubbers in high-dV/dt bridge-leg commutation |
| 50 V/ns MOSFET dv/dt ruggedness | Prevents spurious turn-on during high-slew-rate switching transients in multi-kW converters |
Applications
| Server Power Supply Units | USB-C PD Adapters |
|---|---|
Use Scenario: Primary-side switch in 1–3 kW AC-DC front-end converters with active clamp or LLC topology. IC Role / Device Role / Timing Role: High-voltage, high-frequency switching element handling 400 V DC bus with ZVS-assisted turn-on. Use Value: 4.2 µJ Eoss and 22 nC Qg reduce switching losses by ~18% vs. prior-gen 600 V SJ MOSFETs at 200 kHz. | Use Scenario: Primary-side switch in compact 65–140 W GaN-assisted or all-Si USB-C PD adapters. IC Role / Device Role / Timing Role: Hard-switched flyback or quasi-resonant controller driving 600 V rail with tight board space constraints. Use Value: 8×8 mm ThinPAK footprint saves >70 mm² PCB area versus D²PAK, enabling sub-20 mm height designs. |
| Industrial AC-DC Converters | Telecom Rectifiers |
Use Scenario: Input stage switch in 500–1500 W industrial DIN-rail power supplies operating at -40 to +70 °C ambient. IC Role / Device Role / Timing Role: Continuous conduction mode (CCM) PFC boost switch with 150 °C Tj rating. Use Value: 0.299 Ω RDS(on) at 150 °C maintains <1.2 W conduction loss at 10 A RMS, supporting extended thermal margin. | Use Scenario: Primary-side switch in -48 V telecom rectifier modules with high reliability and long service life requirements. IC Role / Device Role / Timing Role: Fixed-frequency hard-switched forward converter switch with 50 V/ns dv/dt immunity. Use Value: JEDEC qualification and 290 mJ single-pulse avalanche energy ensure field robustness against line surges and load dumps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 600 V superjunction MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPW60R099P7 | RDS(on) = 0.099 Ω, Qg = 55 nC, TO-247 package | Higher power density but larger footprint and higher gate drive loss | Select when lower conduction loss dominates over switching loss and board space is unconstrained |
| IPP60R190C7 | RDS(on) = 0.190 Ω, Qg = 34 nC, TO-220FP package | Lower cost, through-hole mounting, higher thermal resistance (RthJC = 1.8 °C/W) | Select for cost-sensitive industrial PSUs where 1 mm profile is not required and manual assembly is acceptable |
Compared with IPW60R099P7 and IPP60R190C7, IPL60R299CPAUMA1 offers optimal balance of low RDS(on), moderate Qg, and ultra-compact ThinPAK packaging-making it uniquely suited for space-constrained, high-efficiency server and adapter designs where thermal and electrical performance must coexist within strict mechanical envelopes.
Availability
IPL60R299CPAUMA1 is available at Aetrix Electronics and suitable for server power supply units, USB-C PD adapters, and industrial AC-DC converters requiring stable component supply, JEDEC-qualified reliability, and high power density in compact form factors.
Supply support for IPL60R299CPAUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with leadership in silicon and wide-bandgap power devices.
This part belongs to the CoolMOS™ CP series-a family of 600–650 V superjunction MOSFETs engineered specifically for high-efficiency, high-power-density SMPS in datacenter, computing, and consumer adapter applications.
FAQ
What is the maximum continuous drain current for IPL60R299CPAUMA1 at 100 °C case temperature?
The maximum continuous drain current is 7.0 A at TC = 100 °C, as specified in Table 2 of the datasheet. This rating reflects thermal derating due to junction-to-case thermal resistance (1.3 °C/W) and safe operating area limits-not just RDS(on) conduction loss. Operation above this current requires forced cooling or reduced duty cycle to maintain Tj ≤ 150 °C.
Does IPL60R299CPAUMA1 have an integrated body diode, and what are its key recovery parameters?
Yes, it features a monolithic body diode with 0.9 V forward voltage at 6.6 A and 25 °C, 300 ns reverse recovery time (trr), 3.9 µC reverse recovery charge (Qrr), and 26 A peak reverse recovery current (Irrm). Its 200 A/µs diF/dt rating is validated under 400 V reverse bias and supports fast, oscillation-free commutation in half-bridge and LLC topologies.
Can IPL60R299CPAUMA1 be used in zero-voltage switching (ZVS) circuits?
Yes-its 4.2 µJ Eoss at 400 V and low Coss (60 pF) enable efficient ZVS operation in LLC and phase-shifted full-bridge converters. The 46 pF energy-related output capacitance (Co(er)) ensures predictable resonant tank behavior, and the 50 V/ns dv/dt ruggedness prevents false triggering during soft-switching transitions.
Is IPL60R299CPAUMA1 RoHS and halogen-free compliant?
Yes-the device uses Pb-free plating and is halogen-free, meeting JEDEC J-STD-020 moisture sensitivity level (MSL) 2a requirements. It is qualified for reflow soldering at peak temperatures up to 260 °C on leads only, and its ThinPAK 8x8 package is compatible with standard SMD assembly processes.
IPL60R299CPAUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ CP
- Package/Case:
- 4-PowerTSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 11.1A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 299mOhm @ 6.6A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 440µA
- Gate Charge (Qg) (Max) @ Vgs:
- 22 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1100 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 96W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VSON-4
IPL60R299CPAUMA1 FAQ
1.How can I place an order for IPL60R299CPAUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPL60R299CPAUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPL60R299CPAUMA1 reliable?
The price and inventory of IPL60R299CPAUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPL60R299CPAUMA1 is usually 5 days.
3.What payment methods are accepted for IPL60R299CPAUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPL60R299CPAUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPL60R299CPAUMA1?
IPL60R299CPAUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPL60R299CPAUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPL60R299CPAUMA1?
For technical support, including IPL60R299CPAUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPL60R299CPAUMA1 requirements.
6.How does Aetrix verify that IPL60R299CPAUMA1 is sourced from the original manufacturer or authorized distributors?
All IPL60R299CPAUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPL60R299CPAUMA1 meets industry standards.
7.What is the process for return or replacement of IPL60R299CPAUMA1?
All IPL60R299CPAUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPL60R299CPAUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPL60R299CPAUMA1 part is unused and in its original packaging.
Return procedure for IPL60R299CPAUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPL60R299CPAUMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
