Infineon Technologies IPP023N04NGHKSA1
- Part No.:
- IPP023N04NGHKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
IPP023N04NGHKSA1.pdf
- Description:
- MOSFET N-CH 40V 90A TO220-3
- Quantity:
- Payment:

- Shipping:

Inventory:8,760
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPP023N04NGHKSA1 from Infineon Technologies is a 40 V, 180 A, 2.3 mΩ single N-channel TrenchMOS™ power transistor in PG-TO263-3 package, optimized for high-efficiency synchronous rectification and DC-DC conversion in server VRMs and industrial motor drives. It features ultra-low RDS(on), avalanche-rated operation, and gate charge of 102 nC at VGS = 10 V.
For engineers reviewing the IPP023N04NGHKSA1 datasheet, IPP023N04NGHKSA1 pinout, IPP023N04NGHKSA1 application, or IPP023N04NGHKSA1 equivalent, key selection criteria include continuous drain current (180 A), RDS(on) at 10 V (2.3 mΩ), thermal resistance (0.5 K/W junction-to-case), gate threshold voltage (2.0–4.0 V), and safe operating area under pulsed conditions.
Technical Context
This device uses Infineon's TrenchMOS™ process to achieve low on-resistance with robust body diode performance and controlled gate charge profile. Its vertical structure supports high-current conduction with minimal voltage drop and fast switching transitions.
Designed for hard-switched and synchronous rectifier topologies, it delivers stable RDS(on) over temperature (≤3.7 mΩ at Tj = 150 °C) and withstands repetitive unclamped inductive switching up to 100 mJ at 25 °C with ID = 90 A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum drain-source blocking voltage for 12 V/48 V input systems |
| ID, cont | 180 A - Continuous drain current at TC = 25 °C enables high-power density board layouts |
| RDS(on) | 2.3 mΩ @ VGS = 10 V - Enables <1.5 W conduction loss at 80 A in VRM output stages |
| Qg | 102 nC @ VGS = 10 V - Supports efficient 300–500 kHz switching with standard gate drivers |
| ZthJC | 0.5 K/W - Junction-to-case thermal resistance allows direct heatsink mounting without thermal interface degradation |
| EAS | 100 mJ - Avalanche energy rating ensures reliability in inductive load switching |
| VGS(th) | 2.0–4.0 V - Gate threshold compatible with 3.3 V and 5 V logic-level control |
Pinout & Package
PG-TO263-3 (D²PAK) package with exposed drain pad for thermal and electrical connection; three terminals: Drain (tab), Source (pin 2), Gate (pin 1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path collector | Electrically and thermally connected to PCB copper pour; requires solder mask opening and ≥100 mm² 2-oz copper area |
| Source (Pin 2) | Reference node for gate drive | Low-inductance return path for gate loop; critical for EMI control in high-dI/dt applications |
| Gate (Pin 1) | Control electrode | Requires 10–15 Ω series gate resistor to damp oscillation; sensitive to layout parasitics |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ cell architecture | Enables 2.3 mΩ RDS(on) in D²PAK while maintaining >100 mJ avalanche capability |
| Ultra-low gate charge (102 nC) | Reduces driver power loss and enables use with cost-effective 1-A peak gate drivers |
| Optimized body diode recovery (trr = 55 ns) | Minimizes reverse recovery losses in synchronous buck converters |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1) for reflow compatibility |
Applications
| Server VRM Output Stage | Industrial BLDC Motor Inverter |
|---|---|
Use Scenario: High-current, high-frequency buck converter delivering 50–100 A at 0.8–1.2 V to CPU/GPU cores. IC Role / Device Role / Timing Role: Synchronous rectifier MOSFET replacing Schottky diode to reduce conduction loss and improve efficiency above 90%. Use Value: 2.3 mΩ RDS(on) cuts conduction loss by >60% vs. 4.5 mΩ alternatives, enabling 1–2 °C lower junction temperature at full load. | Use Scenario: 3-phase inverter driving 1–5 kW permanent magnet motors in CNC spindles and pumps. IC Role / Device Role / Timing Role: Low-side switch in 6-pack topology handling 40–80 A phase current with 20 kHz PWM. Use Value: 102 nC Qg and 0.5 K/W ZthJC allow stable operation at 85 °C case temperature without derating. |
| Telecom 48 V DC-DC Converter | EV Onboard Charger Auxiliary Stage |
Use Scenario: Isolated forward or LLC converter stepping 48 V down to 12 V for base station subsystems. IC Role / Device Role / Timing Role: Primary-side switch in active clamp forward topology operating at 250–400 kHz. Use Value: 100 mJ EAS rating ensures robustness against voltage spikes during transformer reset transitions. | Use Scenario: Secondary-side synchronous rectifier in 3.3 kW AC/DC stage converting 400 V DC to 12 V for vehicle control modules. IC Role / Device Role / Timing Role: High-current rectifier in center-tapped or full-bridge configuration. Use Value: Low RDS(on) and fast body diode enable >97% efficiency at 100 A output, reducing heatsink mass by 35%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB023N04N G | Same die, PG-TO220 package; higher ZthJC (0.9 K/W) and larger footprint | Suitable for lower-power designs (<100 A) where heatsinking is less constrained | Select when mechanical fit or legacy TO-220 socket compatibility is required |
| IRFB4115PBF | Higher RDS(on) (3.2 mΩ), higher Qg (130 nC), non-avalanche rated | Limited to non-inductive or clamped switching; not recommended for unclamped flyback or motor freewheeling | Choose only if cost is primary constraint and avalanche stress is absent in system design |
Compared with IPB023N04N G and IRFB4115PBF, IPP023N04NGHKSA1 delivers superior thermal performance and ruggedness in high-current synchronous rectification, making it optimal for space-constrained, high-reliability server and industrial power stages.
Availability
IPP023N04NGHKSA1 is available at Aetrix Electronics and suitable for server VRMs, industrial motor inverters, and telecom DC-DC converters requiring stable component supply and long-term production continuity.
Supply support for IPP023N04NGHKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
This part belongs to Infineon's OptiMOS™ 5 family, engineered for high-efficiency, high-current power conversion in datacenter, industrial, and renewable energy systems.
FAQ
What is the maximum allowable junction temperature for reliable operation?
The absolute maximum junction temperature is 175 °C per datasheet limits. For continuous operation, Infineon recommends limiting Tj to ≤150 °C to ensure 10-year lifetime under thermal cycling. Derating curves show RDS(on) increases to 3.7 mΩ at 150 °C, requiring appropriate heatsink sizing based on ZthJC = 0.5 K/W and ambient conditions.
Does this MOSFET require a negative gate turn-off voltage?
No. The device operates reliably with 0 V to 10 V gate drive and does not require negative turn-off bias. Its VGS(th) range (2.0–4.0 V) ensures clean turn-on with standard 3.3 V or 5 V logic, and its low Miller charge (Qgd = 22 nC) minimizes risk of false turn-on during high dV/dt events.
Can IPP023N04NGHKSA1 be used in parallel configurations?
Yes - its positive temperature coefficient of RDS(on) enables stable current sharing. Layout must ensure matched gate drive paths and symmetrical source inductance; typical practice uses individual 10 Ω gate resistors and Kelvin source connections. Parallel operation beyond two units requires careful thermal coupling analysis due to localized hot spots.
Is the PG-TO263-3 package lead-free and halogen-free?
Yes. The device complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 MSL1 classification. The terminations are 100% matte tin, and the molding compound is halogen-free per IEC 61249-2-21, supporting lead-free reflow profiles up to 260 °C peak temperature.
IPP023N04NGHKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™ 3
- Package/Case:
- -
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
IPP023N04NGHKSA1 FAQ
1.How can I place an order for IPP023N04NGHKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPP023N04NGHKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPP023N04NGHKSA1 reliable?
The price and inventory of IPP023N04NGHKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPP023N04NGHKSA1 is usually 5 days.
3.What payment methods are accepted for IPP023N04NGHKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPP023N04NGHKSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPP023N04NGHKSA1?
IPP023N04NGHKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPP023N04NGHKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPP023N04NGHKSA1?
For technical support, including IPP023N04NGHKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPP023N04NGHKSA1 requirements.
6.How does Aetrix verify that IPP023N04NGHKSA1 is sourced from the original manufacturer or authorized distributors?
All IPP023N04NGHKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPP023N04NGHKSA1 meets industry standards.
7.What is the process for return or replacement of IPP023N04NGHKSA1?
All IPP023N04NGHKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPP023N04NGHKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPP023N04NGHKSA1 part is unused and in its original packaging.
Return procedure for IPP023N04NGHKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPP023N04NGHKSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

