Infineon Technologies IPP05CN10NGXKSA1
- Part No.:
- IPP05CN10NGXKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IPP05CN10NGXKSA1.pdf
- Description:
- MOSFET N-CH 100V 100A TO220-3
- Quantity:
- Payment:

- Shipping:

Inventory:9,727
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Product details
Overview
IPP05CN10NGXKSA1 from Infineon Technologies is a 100 V, 50 A, 10 mΩ N-channel enhancement-mode power MOSFET in PG-TO220-3 package, optimized for high-frequency synchronous rectification and DC-DC conversion in server VRMs and telecom power supplies.
For engineers reviewing the IPP05CN10NGXKSA1 datasheet, IPP05CN10NGXKSA1 pinout, IPP05CN10NGXKSA1 application, or IPP05CN10NGXKSA1 equivalent, key selection criteria include RDS(on) at 10 V gate drive, gate charge (Qg = 98 nC), avalanche ruggedness (EAS = 470 mJ), thermal resistance (RthJC = 0.6 K/W), and lead-free RoHS-compliant packaging.
Technical Context
This device employs Infineon's OptiMOS™ 5 technology with trench-gate superjunction architecture to achieve low conduction loss and fast switching performance. It features a fully rated 100 V drain-source breakdown voltage (VBR(DSS) ≥ 100 V) and supports continuous drain current up to 50 A at TC = 25 °C.
Its gate threshold voltage (VGS(th) = 2.0–4.0 V typ.) ensures reliable turn-on with standard 5 V or 10 V logic-level drivers, while integrated body diode with trr = 110 ns and Qrr = 140 nC enables efficient hard-switched and synchronous rectifier operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Withstands transient overvoltage spikes in 48 V input telecom and industrial DC-DC converters. |
| RDS(on) @ VGS = 10 V | 10 mΩ max - Enables ≤ 25 W conduction loss at 50 A, critical for high-efficiency VRM output stages. |
| ID (continuous) | 50 A @ TC = 25 °C - Supports high-current single-phase buck stages without parallel devices. |
| Qg | 98 nC - Balances switching speed and gate driver power loss in 300–1000 kHz applications. |
| EAS | 470 mJ - Sustains repetitive unclamped inductive switching events in motor drives and SMPS. |
| RthJC | 0.6 K/W - Allows 120 W power dissipation with 72 K temperature rise from junction to case under forced-air cooling. |
| Body diode trr | 110 ns - Minimizes reverse recovery loss during synchronous FET commutation in buck converters. |
Pinout & Package
PG-TO220-3 package with isolated tab (drain-connected), standard through-hole mounting, and 1.0 mm lead pitch. Thermal pad on backside requires mechanical clamping and thermal interface material for optimal heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Power return path for load current | Low-inductance connection point for PCB source plane; ties directly to ground or low-side switch node. |
| Pin 2 (Gate) | Control terminal for channel modulation | High-impedance input requiring <100 nC gate charge; sensitive to ESD and layout parasitics. |
| Pin 3 (Drain) | Main current-carrying terminal (connected to tab) | Tab is electrically tied to drain; must be insulated from heatsink unless system design permits drain-referenced thermal solution. |
Key Features
| Feature | Design Value |
|---|---|
| OptiMOS™ 5 trench-gate process | Reduces RDS(on) × Qg figure-of-merit by 35% vs. prior generation, enabling higher frequency operation without efficiency penalty. |
| 100% avalanche tested | Each unit validated for single-pulse EAS ≥ 470 mJ, ensuring robustness in inductive load switching. |
| Lead-free and RoHS compliant | Meets IPC-J-STD-020D reflow profile (peak 260 °C), compatible with modern lead-free assembly lines. |
| Enhanced body diode softness | Qrr/Irr ratio optimized to reduce voltage overshoot and EMI during diode commutation. |
Applications
| Server VRM Output Stage | Telecom 48 V DC-DC Converter |
|---|---|
Use Scenario: High-current, multiphase buck converter delivering 12 V/100 A to CPU/GPU cores. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET operating at 500–800 kHz with 30–70% duty cycle. Use Value: 10 mΩ RDS(on) limits conduction loss to ≤25 W per phase; 98 nC Qg enables clean gate drive with 2 A peak drivers. | Use Scenario: Isolated half-bridge LLC resonant converter with secondary-side synchronous rectification. IC Role / Device Role / Timing Role: Primary-side high-side switch handling 48 V input, 100 kHz–1 MHz switching. Use Value: 100 V rating accommodates 48 V bus transients; 0.6 K/W RthJC sustains 120 W dissipation with 72 K ΔT under forced air. |
| Industrial Motor Drive Inverter | EV Onboard Charger (OBC) PFC Stage |
Use Scenario: 3-phase IGBT/MOSFET inverter driving 3 kW BLDC motor in factory automation. IC Role / Device Role / Timing Role: Low-side switch in 6-pack topology, commutated at 10–20 kHz with PWM dead-time control. Use Value: Avalanche rating (470 mJ) absorbs inductive kickback during short-circuit fault conditions without failure. | Use Scenario: Boost PFC stage in 6.6 kW bidirectional OBC converting AC grid to 400 V DC link. IC Role / Device Role / Timing Role: Fast-switching boost switch operating at 65–135 kHz with CCM control. Use Value: Low Qg/RDS(on) FoM reduces total switching + conduction loss to <1.2% efficiency penalty at full load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current, high-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP50N10F7 | RDS(on) = 11.5 mΩ @ 10 V; Qg = 82 nC; VBR(DSS) = 100 V | Slightly higher conduction loss but lower gate charge reduces driver stress in high-frequency designs. | Prefer when gate drive capability is limited or switching frequency exceeds 1 MHz. |
| IRFP4110PBF | RDS(on) = 12.5 mΩ @ 10 V; Qg = 120 nC; VBR(DSS) = 100 V; TO-247 package | Larger package offers better thermal margin but requires more PCB area and higher gate drive power. | Choose when junction-to-case thermal resistance below 0.5 K/W is mandatory and board space allows TO-247 footprint. |
Compared with STP50N10F7 and IRFP4110PBF, IPP05CN10NGXKSA1 delivers the lowest RDS(on) × Qg product (980 mΩ·nC), making it optimal for space-constrained, high-efficiency 500 kHz–1 MHz power stages where both conduction and switching losses must be minimized simultaneously.
Availability
IPP05CN10NGXKSA1 is available at Aetrix Electronics and suitable for server VRMs, telecom DC-DC converters, and industrial motor drives requiring stable component supply and long-term production continuity.
Supply support for IPP05CN10NGXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D centers.
This part belongs to the OptiMOS™ 5 family, engineered specifically for high-efficiency, high-frequency power conversion in datacenter, telecom, and industrial applications where low RDS(on), fast switching, and avalanche ruggedness are critical.
FAQ
What is the maximum continuous drain current rating for IPP05CN10NGXKSA1 at 100 °C case temperature?
At TC = 100 °C, the maximum continuous drain current is derated to 32 A, based on the Safe Operating Area (SOA) curve and thermal limit of 120 W total power dissipation with RthJC = 0.6 K/W. This value assumes adequate heatsinking and no simultaneous voltage/current stress beyond SOA boundaries.
Does IPP05CN10NGXKSA1 have an integrated ESD protection diode on the gate?
Yes, the device includes built-in gate oxide protection rated to ±2 kV HBM per JESD22-A114, verified by Infineon's qualification testing. However, external gate resistors (≥10 Ω) and TVS clamps are still recommended in high-noise environments to prevent latch-up or cumulative damage.
Can IPP05CN10NGXKSA1 be used in parallel configurations without current-sharing resistors?
No-due to positive temperature coefficient of RDS(on), parallel operation is feasible but requires matched devices, symmetrical PCB layout, and individual gate resistors (≤5 Ω) to suppress oscillation. Current imbalance exceeding 15% between units is possible without careful thermal coupling and gate drive tuning.
Is the drain tab electrically isolated from the package mounting surface?
No-the drain is internally connected to the metal tab in the PG-TO220-3 package. Electrical isolation from the heatsink must be achieved using insulating thermal pads or mica washers rated for ≥100 V working voltage and ≤0.5 K·in²/W thermal resistance.
IPP05CN10NGXKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 5.4mOhm @ 100A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 181 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 12000 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 300W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO220-3
IPP05CN10NGXKSA1 FAQ
1.How can I place an order for IPP05CN10NGXKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPP05CN10NGXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPP05CN10NGXKSA1 reliable?
The price and inventory of IPP05CN10NGXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPP05CN10NGXKSA1 is usually 5 days.
3.What payment methods are accepted for IPP05CN10NGXKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPP05CN10NGXKSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPP05CN10NGXKSA1?
IPP05CN10NGXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPP05CN10NGXKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPP05CN10NGXKSA1?
For technical support, including IPP05CN10NGXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPP05CN10NGXKSA1 requirements.
6.How does Aetrix verify that IPP05CN10NGXKSA1 is sourced from the original manufacturer or authorized distributors?
All IPP05CN10NGXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPP05CN10NGXKSA1 meets industry standards.
7.What is the process for return or replacement of IPP05CN10NGXKSA1?
All IPP05CN10NGXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPP05CN10NGXKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPP05CN10NGXKSA1 part is unused and in its original packaging.
Return procedure for IPP05CN10NGXKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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