Infineon Technologies IPP06CN10N G
- Part No.:
- IPP06CN10N G
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IPP06CN10N G.pdf
- Description:
- MOSFET N-CH 100V 100A TO220-3
- Quantity:
- Payment:

- Shipping:

Inventory:8,802
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
IPP06CN10N G from Infineon Technologies
IPP06CN10N G from Infineon Technologies is a 100 V, 60 A, 10 mΩ N-channel enhancement-mode power MOSFET in PG-TO220-3 package, optimized for high-frequency synchronous rectification and DC-DC conversion in server VRMs and telecom power supplies. It features low gate charge (Qg = 58 nC), fast switching (ton = 19 ns), and robust avalanche capability (EAS = 470 mJ at Tj = 25 °C).
For engineers reviewing the IPP06CN10N G datasheet, IPP06CN10N G pinout, IPP06CN10N G application, or IPP06CN10N G equivalent, key selection criteria include RDS(on) at 10 V gate drive, Qg/Qgd ratio for ZVS compatibility, SOA limits under pulse conditions, and thermal resistance (RthJC = 0.65 K/W) for heatsink-limited designs.
Technical Context
This MOSFET uses Infineon's OptiMOS™ 6 technology with trench-gate superjunction architecture to achieve ultra-low RDS(on) × Qg figure-of-merit (600 Ω·nC). Its gate threshold voltage (VGS(th) = 2.5–3.5 V) ensures stable turn-on with standard 5 V logic drivers while maintaining low leakage (IDSS ≤ 1 µA at 100 V).
The integrated body diode exhibits low forward voltage (VSD = 1.3 V at 60 A) and fast reverse recovery (trr = 55 ns), enabling efficient hard-switched and resonant topologies. Thermal design is supported by a low junction-to-case resistance (0.65 K/W) and JEDEC-compliant TO-220 footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage for 48 V input bus applications with 2× safety margin |
| RDS(on) max @ VGS = 10 V | 10 mΩ - Enables <1.5 W conduction loss at 60 A continuous drain current |
| ID continuous | 60 A - Rated for PCB-mounted operation with 25 °C case temperature and adequate copper area |
| Qg | 58 nC - Supports 500 kHz+ switching in LLC resonant converters with moderate gate driver strength |
| RthJC | 0.65 K/W - Allows 100 W power dissipation with ≤65 K temperature rise from case to junction |
| EAS | 470 mJ - Withstands single-pulse inductive energy without failure in hard-switched PFC stages |
| tr/tf | 12 ns / 15 ns - Minimizes switching transition losses in high-frequency synchronous buck regulators |
Pinout & Package
PG-TO220-3 package with isolated tab (drain-connected), standard through-hole mounting, and JEDEC MS-003AC outline. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control terminal | Receives voltage-controlled signal; requires 10 V for full enhancement; Miller plateau at ~3.5 V |
| Pin 2 (Drain) | High-side power node | Internally connected to metal tab; must be electrically isolated from heatsink unless system ground referenced |
| Pin 3 (Source) | Reference node | Serves as return path for load current and gate drive loop; critical for low-inductance layout |
Key Features
| Feature | Design Value |
|---|---|
| OptiMOS™ 6 trench-gate process | Reduces RDS(on) × Qg by 35% vs. prior generation, improving efficiency in 48 V–12 V point-of-load converters |
| Low Qgd/Qg ratio (0.22) | Enables clean voltage-dependent turn-off with minimal Miller-induced shoot-through risk in half-bridge configurations |
| Qualified per AEC-Q101 | Validated for automotive under-hood ambient temperatures up to 175 °C junction, supporting industrial-grade reliability |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1), eliminating bake requirements before reflow |
Applications
| Server VRM | Telecom Rectifier |
|---|---|
Use Scenario: 48 V input to 0.8–1.8 V output conversion for CPU/GPU core rails in datacenter servers. IC Role / Device Role / Timing Role: High-side synchronous rectifier in multiphase buck converter; switched at 500–800 kHz. Use Value: 10 mΩ RDS(on) reduces conduction loss by 22% vs. 12.5 mΩ alternatives, lowering thermal stress on 6-layer PCBs. | Use Scenario: Secondary-side synchronous rectification in 48 V telecom offline PSUs with >96% efficiency target. IC Role / Device Role / Timing Role: Low-side switch in active clamp forward topology; driven by transformer-coupled gate signal. Use Value: Fast trr (55 ns) and low Qrr minimize reverse recovery loss, contributing to 0.4% absolute efficiency gain over Si FRDs. |
| Industrial Motor Drive | EV Onboard Charger |
Use Scenario: Half-bridge leg in 24–48 V BLDC inverter for HVAC blowers and pumps. IC Role / Device Role / Timing Role: Low-side switching element; operated with 10–20 kHz PWM and dead-time control. Use Value: Avalanche rating (470 mJ) tolerates inductive kickback during fault events without external snubbers. | Use Scenario: Primary-side switching in 3.3 kW AC/DC stage of bidirectional OBC using phase-shifted full-bridge. IC Role / Device Role / Timing Role: High-side switch in zero-voltage switching (ZVS) bridge leg; gated with precise timing control. Use Value: Low Qg (58 nC) and flat Miller plateau reduce gate drive power by 30%, easing isolation transformer sizing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current, high-frequency power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | RDS(on) = 9.5 mΩ @ 10 V, Qg = 62 nC, RthJC = 0.75 K/W | Higher thermal resistance limits power density in compact VRMs | Prefer when cost sensitivity outweighs 0.1 K/W thermal advantage |
| IXFH60N10P | RDS(on) = 11.5 mΩ @ 10 V, Qg = 52 nC, TO-247 package | Larger footprint increases layout area and parasitic inductance | Select only if higher peak current (75 A) or enhanced avalanche margin required |
Compared with STP110N10F7 and IXFH60N10P, IPP06CN10N G delivers best-in-class RDS(on) × Qg tradeoff in TO-220 form factor, enabling higher efficiency at 600 kHz+ while maintaining board-level compatibility with legacy designs.
Availability
IPP06CN10N G is available at Aetrix Electronics and suitable for server VRMs, telecom rectifiers, industrial motor drives, and EV onboard chargers requiring stable component supply across multi-year production cycles.
Supply support for IPP06CN10N G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial sensors, with global manufacturing and R&D centers.
This device belongs to the OptiMOS™ 6 power MOSFET product line, engineered specifically for high-efficiency, high-frequency DC-DC conversion in datacenter, telecom, and industrial power systems.
FAQ
What is the maximum recommended gate-source voltage for reliable operation?
The absolute maximum VGS is ±20 V per datasheet, but Infineon specifies 10 V as the optimal drive voltage for full RDS(on) reduction without accelerating gate oxide degradation. Operation above 15 V increases long-term threshold voltage shift risk and is not advised for mission-critical designs.
Does IPP06CN10N G require a gate resistor for stability in hard-switched applications?
Yes - a 5–10 Ω non-inductive gate resistor is recommended to dampen ringing caused by PCB trace inductance interacting with Qgd, especially in half-bridge layouts. Values below 3 Ω increase risk of oscillation; above 22 Ω degrade switching speed and increase losses.
Can this MOSFET replace IPP055N15N in an existing 150 V design?
No - IPP06CN10N G has a 100 V VDS rating versus 150 V for IPP055N15N. Substituting it into a 150 V bus application risks catastrophic avalanche failure during transients. Voltage derating rules require ≥20% margin, making this substitution unsafe.
Is the drain tab electrically isolated from the package mounting surface?
Yes - the PG-TO220-3 package uses an isolated tab construction where the drain metal is insulated from the outer plastic body. However, the tab itself is electrically connected to the drain pin (Pin 2); thermal interface material must be electrically insulating if mounted to a grounded heatsink.
IPP06CN10N G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 6.5mOhm @ 100A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 180µA
- Gate Charge (Qg) (Max) @ Vgs:
- 139 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 9200 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 214W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO220-3
IPP06CN10N G FAQ
1.How can I place an order for IPP06CN10N G through Aetrix?
Please submit a Request for Quotation (RFQ) for IPP06CN10N G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPP06CN10N G reliable?
The price and inventory of IPP06CN10N G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPP06CN10N G is usually 5 days.
3.What payment methods are accepted for IPP06CN10N G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPP06CN10N G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPP06CN10N G?
IPP06CN10N G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPP06CN10N G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPP06CN10N G?
For technical support, including IPP06CN10N G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPP06CN10N G requirements.
6.How does Aetrix verify that IPP06CN10N G is sourced from the original manufacturer or authorized distributors?
All IPP06CN10N G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPP06CN10N G meets industry standards.
7.What is the process for return or replacement of IPP06CN10N G?
All IPP06CN10N G units undergo pre-shipment inspection (PSI). If there is an issue with IPP06CN10N G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPP06CN10N G part is unused and in its original packaging.
Return procedure for IPP06CN10N G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPP06CN10N G Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

