Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies IPP65R660CFDXKSA1

Part No.:
IPP65R660CFDXKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixIPP65R660CFDXKSA1.pdf
Description:
MOSFET N-CH 650V 6A TO220-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,033

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IPP65R660CFDXKSA1 from Infineon Technologies is a 650V superjunction N-channel power MOSFET in the CoolMOS™ CFD2 family, designed for high-efficiency resonant switching topologies. It delivers RDS(on) = 0.66 Ω (max), Qg = 22 nC (typ), Eoss = 1.8 µJ @ 400V, and features an ultra-fast, robust body diode with trr = 65 ns and di/dt capability of 900 A/µs. It is used in LLC resonant converters for server PSUs and telecom rectifiers.

For engineers reviewing the IPP65R660CFDXKSA1 datasheet, IPP65R660CFDXKSA1 pinout, IPP65R660CFDXKSA1 application, or IPP65R660CFDXKSA1 equivalent, key selection criteria include its 650V VDS, low RDS(on) × Qg figure-of-merit, commutation ruggedness, thermal resistance (RthJC = 2 °C/W), and TO-220 package compatibility with industrial PCB layouts.

Technical Context

This device implements Infineon's superjunction (SJ) cell architecture with charge compensation, enabling high voltage blocking while minimizing conduction and switching losses. Its optimized gate charge profile supports ZVS operation in soft-switching converters, and its body diode exhibits controlled reverse recovery with low Qrr (0.2 µC) and Irrm (4.5 A).

The CFD2 generation integrates enhanced avalanche ruggedness (EAS = 115 mJ) and dv/dt immunity (50 V/ns) for reliable operation in noisy, high-dV/dt environments such as PFC and half-bridge LLC stages. Thermal design is supported by a low junction-to-case resistance of 2 °C/W in TO-220 mounting.

Key Specifications

ParameterValue and Actual Design Meaning
VDS650 V - Enables use in 400 V AC input systems with margin for surge and ringing.
RDS(on), max0.66 Ω - Determines conduction loss at rated current; enables <6.0 A continuous drain at Tc = 100°C.
Qg, typ22 nC - Defines gate drive energy requirement; compatible with standard 1–2 A peak gate drivers.
Eoss @ 400V1.8 µJ - Directly impacts turn-on switching loss in hard- and soft-switching applications.
trr65 ns - Enables fast, predictable body diode commutation in synchronous and resonant topologies.
RthJC2 °C/W - Allows direct heatsink mounting on TO-220 tab; supports 62.5 W power dissipation at Tc = 25°C.
ID,pulse17 A - Supports short-term overload conditions without thermal runaway.

Pinout & Package

IPP65R660CFDXKSA1 is housed in a TO-220 package with isolated tab (PG-TO220), featuring three leads: drain connected to the metal tab, gate on lead 1, source on lead 3. The package supports screw-mount heatsinking and complies with JEDEC TO-220 mechanical standards.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Gate)Control terminalReceives gate drive signal; requires ≤20 V rating and low-impedance path to minimize ringing.
Pin 2 (Drain)High-voltage power terminalConnected to switch node; electrically tied to metal tab-requires isolation from heatsink unless referenced to same potential.
Pin 3 (Source)Reference and return pathServes as local ground reference for gate drive; carries full load current and must be routed with low inductance.

Key Features

FeatureDesign Value
Ultra-fast body diodetrr = 65 ns, Qrr = 0.2 µC - Reduces dead-time losses and EMI in bridge-leg commutation.
High commutation ruggednessdi/dt = 900 A/µs - Sustains rapid current reversal without failure in LLC and phase-shifted full-bridge circuits.
Low RDS(on) × Qg FOM14.52 Ω·nC - Balances conduction and switching loss for optimal efficiency across 50–300 kHz operation.
Industrial-grade qualificationJEDEC J-STD-20 & JESD22 compliant - Validated for reflow, temperature cycling, and humidity exposure per industrial reliability requirements.

Applications

Server Power SupplyTelecom Rectifier

Use Scenario: Primary-side switch in 1–3 kW LLC resonant DC-DC converters for datacenter PSUs.

IC Role / Device Role / Timing Role: High-voltage power switch operating in zero-voltage switching mode with precise timing control via resonant tank.

Use Value: Enables >96% efficiency at full load due to low Eoss and fast body diode recovery, reducing heatsink size by 30% vs. prior-generation SJ MOSFETs.

Use Scenario: Active clamp forward or phase-shifted full-bridge stage in 48 V telecom rectifiers.

IC Role / Device Role / Timing Role: Main switching transistor handling 380–400 V DC bus with high dv/dt immunity during clamping transitions.

Use Value: Survives repetitive 50 V/ns transients and delivers stable performance over -40°C to +125°C ambient, meeting NEBS Level 3 requirements.

LCD TV Backlight InverterSolar Microinverter

Use Scenario: Half-bridge switch in resonant inverter driving CCFL or LED backlight modules.

IC Role / Device Role / Timing Role: Fast-switching power device synchronized to high-frequency PWM carrier (50–200 kHz).

Use Value: Minimizes audible noise and EMI through controlled diode recovery and low Qg, supporting compact transformer designs.

Use Scenario: DC-AC H-bridge switch in single-phase microinverters converting PV panel output (30–60 V DC) to 230 V AC.

IC Role / Device Role / Timing Role: High-reliability switching element in bidirectional topology with reverse conduction demands.

Use Value: Robust body diode eliminates need for external anti-parallel diodes, reducing BOM count and improving thermal coupling in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPW65R660CFDSame die, TO-247 package; RthJC = 2 °C/W, Ptot = 62.5 W at Tc = 25°CBetter thermal performance in forced-air or large heatsink setups; larger footprintSelect when higher power derating margin or lower junction temperature is required.
IPB65R660CFDSame die, D²PAK (PG-TO263); RthJC = 2 °C/W, surface-mount compatibleRequires PCB copper area for thermal management; no mechanical mounting optionSelect for automated SMT assembly where board space permits and heatsinking is via copper pour.

Compared with IPW65R660CFD and IPB65R660CFD, IPP65R660CFDXKSA1 offers identical electrical performance in a through-hole TO-220 package-ideal for cost-sensitive, medium-power industrial designs requiring manual assembly or field serviceability without SMT infrastructure.

Availability

IPP65R660CFDXKSA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, LCD TV inverters, and solar microinverters requiring stable component supply, long-lifecycle support, and JEDEC-qualified industrial reliability.

Supply support for IPP65R660CFDXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The CoolMOS™ CFD2 product line was engineered specifically for high-efficiency resonant and soft-switching power conversion, targeting reduced system size, improved thermal behavior, and enhanced reliability in 650 V industrial and telecom power stages.

FAQ

What is the maximum continuous drain current for IPP65R660CFDXKSA1 at 100°C case temperature?

The maximum continuous drain current is 3.8 A at Tc = 100°C, limited by thermal constraints-not by silicon capability. This value is derived from the device's 62.5 W power dissipation rating and RthJC = 2 °C/W, ensuring safe operation without exceeding Tj,max = 150°C under steady-state conditions with proper heatsinking.

Does IPP65R660CFDXKSA1 require a negative gate voltage for reliable turn-off?

No. The device specifies a gate-source voltage range of ±20 V (static), and stable turn-off is achieved with 0 V gate bias. A small negative bias (e.g., –5 V) may improve noise immunity in high-dv/dt environments but is not required for functional operation per datasheet characterization at VGS = 0 V.

Can IPP65R660CFDXKSA1 replace older CoolMOS™ CFD1 devices in existing designs?

Yes-electrical parameters including VDS, RDS(on), Qg, and body diode characteristics are improved or matched, and the TO-220 footprint is identical. However, layout review is recommended due to lower Eoss and faster switching, which may increase gate drive loop sensitivity and require updated snubber or gate resistor tuning.

Is the metal tab of IPP65R660CFDXKSA1 electrically connected to the drain?

Yes-the TO-220 metal tab is internally connected to the drain terminal (Pin 2). When mounted to a heatsink, electrical isolation (e.g., mica washer or insulating pad) is mandatory unless the heatsink is referenced to the drain potential. This configuration is confirmed in Infineon's package outline PG-TO220 and thermal test setup diagrams.

IPP65R660CFDXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
660mOhm @ 2.1A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 200µA
Gate Charge (Qg) (Max) @ Vgs:
22 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
615 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
62.5W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO220-3

IPP65R660CFDXKSA1 FAQ

1.How can I place an order for IPP65R660CFDXKSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPP65R660CFDXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPP65R660CFDXKSA1 reliable?

The price and inventory of IPP65R660CFDXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPP65R660CFDXKSA1 is usually 5 days.

3.What payment methods are accepted for IPP65R660CFDXKSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPP65R660CFDXKSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPP65R660CFDXKSA1?

IPP65R660CFDXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPP65R660CFDXKSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPP65R660CFDXKSA1?

For technical support, including IPP65R660CFDXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPP65R660CFDXKSA1 requirements.

6.How does Aetrix verify that IPP65R660CFDXKSA1 is sourced from the original manufacturer or authorized distributors?

All IPP65R660CFDXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPP65R660CFDXKSA1 meets industry standards.

7.What is the process for return or replacement of IPP65R660CFDXKSA1?

All IPP65R660CFDXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPP65R660CFDXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPP65R660CFDXKSA1 part is unused and in its original packaging.

Return procedure for IPP65R660CFDXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IPP65R660CFDXKSA1 Tags

  • IPP65R660CFDXKSA1
  • IPP65R660CFDXKSA1 PDF
  • IPP65R660CFDXKSA1 Datasheet
  • IPP65R660CFDXKSA1 Specifications
  • IPP65R660CFDXKSA1 Images
  • Infineon Technologies
  • Infineon Technologies IPP65R660CFDXKSA1
  • Buy IPP65R660CFDXKSA1
  • IPP65R660CFDXKSA1 Price
  • IPP65R660CFDXKSA1 Distributor
  • IPP65R660CFDXKSA1 Supplier
  • IPP65R660CFDXKSA1 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER