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Infineon Technologies IPS06N03LA G

Part No.:
IPS06N03LA G
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-251-3 Stub Leads, IPAK
Datasheet:
AetrixIPS06N03LA G.pdf
Description:
MOSFET N-CH 25V 50A TO251-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,409

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Product details

Overview

IPS06N03LA G from Infineon Technologies is an N-channel logic-level power MOSFET in PG-TO251-3-11 package, rated for 25 V VDS, 50 A continuous drain current at TC = 100 °C, and 5.7 mΩ max RDS(on) (SMD version), optimized for high-frequency DC/DC converters in server VRMs and POL modules.

For engineers reviewing the IPS06N03LA G datasheet, IPS06N03LA G pinout, IPS06N03LA G application, or IPS06N03LA G equivalent, key selection criteria include gate charge × RDS(on) figure of merit, 175 °C junction rating, thermal resistance (RthJC = 1.8 K/W), reverse diode dv/dt capability (6 kV/µs), and SMD-compatible TO-251 footprint.

Technical Context

This device implements a trench-based OptiMOS®2 silicon process enabling low gate charge (Qg = 17–22 nC) and low RDS(on) with logic-level gate drive compatibility (VGS(th) = 1.2–2.0 V). It supports synchronous rectification in buck converters due to its low Qgd (4.6–6.9 nC) and fast switching (tr = 7.2–11 ns, tf = 4.6–6.9 ns).

The integrated body diode exhibits low forward voltage (VSD = 0.92–1.2 V @ IF = 50 A, Tj = 25 °C) and low reverse recovery charge (Qrr = 10 nC), reducing switching losses in hard-commutated topologies. Thermal design is enabled by RthJC = 1.8 K/W and operation up to 175 °C.

Key Specifications

ParameterValue and Actual Design Meaning
VDS25 V - Maximum blocking voltage compatible with 12 V input bus systems and 5 V/3.3 V output rails.
RDS(on) max5.7 mΩ (SMD) - Enables <1 W conduction loss at 50 A, critical for high-current point-of-load stages.
ID continuous50 A @ TC = 100 °C - Supports high-current POL applications without forced air cooling.
Qg17–22 nC - Low total gate charge reduces driver power and enables >1 MHz switching in resonant converters.
RthJC1.8 K/W - Allows direct heatsink mounting for efficient thermal management in compact power modules.
dv/dt rating6 kV/µs - Ensures robustness against parasitic turn-on in high-dI/dt synchronous buck phases.
Tj max175 °C - Enables operation in thermally constrained environments such as sealed server chassis.

Pinout & Package

IPS06N03LA G uses the PG-TO251-3-11 package - a surface-mount variant of the standard TO-251 (IPAK) with gull-wing leads and exposed drain pad for thermal enhancement. The package is RoHS-compliant and features Pb-free lead plating.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main current path collectorExposed copper pad on underside - must be soldered to large PCB copper area for thermal conduction and low-inductance return path.
Source (S)Current return node / referenceConnected to power ground plane; serves as common reference for gate drive and current sensing.
Gate (G)Control terminalHigh-impedance input requiring low-inductance routing and local decoupling to suppress ringing during fast transitions.

Key Features

FeatureDesign Value
Logic-level gate driveVGS(th) = 1.2–2.0 V - Fully enhanced with 3.3 V or 5 V microcontroller GPIO, eliminating level-shifter need.
Low FOM (Qg × RDS(on))~100–130 nC·mΩ - Directly improves efficiency in high-frequency DC/DC converters above 500 kHz.
Enhanced body diodeQrr = 10 nC, VSD = 0.92 V - Reduces dead-time losses and EMI in synchronous rectification.
JEDEC-qualified reliabilityQualified per J-STD-20/JESD22 - Validated for reflow profile compliance and long-term stability in industrial temperature cycling.
175 °C operationRated Tj max = 175 °C - Enables derating margin for sustained full-load operation in high-ambient environments.

Applications

Server Point-of-Load RegulatorTelecom DC/DC Module

Use Scenario: High-current, high-efficiency step-down conversion feeding CPU/GPU core rails in 1U rack servers.

IC Role / Device Role / Timing Role: Synchronous high-side or low-side power switch in multiphase buck converter topology.

Use Value: 5.7 mΩ RDS(on) and 17–22 nC Qg minimize combined conduction and switching losses at 600–1000 kHz switching frequencies.

Use Scenario: Compact, isolated 48 V-to-12 V intermediate bus converter in telecom line cards.

IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward or secondary-side synchronous rectifier.

Use Value: 6 kV/µs dv/dt immunity prevents false turn-on during transformer leakage spikes; 175 °C rating ensures reliability under sealed enclosure conditions.

Industrial Motor Drive InverterAutomotive ADAS Power Supply

Use Scenario: Half-bridge leg in low-voltage (<30 V) BLDC motor gate driver stage for HVAC blowers or pumps.

IC Role / Device Role / Timing Role: Low-side switching element with integrated freewheeling diode for PWM-controlled phase current.

Use Value: Low VSD (0.92 V) and fast reverse recovery (Qrr = 10 nC) reduce heat generation and improve PWM fidelity at 20–50 kHz.

Use Scenario: Input-stage protection and load switching in radar/EPS camera power subsystems operating in engine bay environments.

IC Role / Device Role / Timing Role: Reverse-polarity protection switch and controlled hot-swap FET in 12 V supply rail.

Use Value: 50 A continuous rating and 175 °C operation support transient overloads and ambient temperatures up to 125 °C without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPD06N03LA GPG-TO252-3-11 package; RthJC = 1.8 K/W; same die, higher thermal mass caseBetter heatsinking via larger exposed pad; preferred for >75 W dissipation scenariosSelect when board layout allows TO-252 footprint and thermal performance is prioritized over height or density.
IRLML6344TRPBFSO-8 package; RDS(on) = 11.5 mΩ @ 4.5 V; Qg = 6.2 nC; lower current rating (4.3 A)Not suitable for >10 A applications; limited to low-power auxiliary railsChoose only for space-constrained, low-current bias supplies where TO-251/TO-252 is impractical.

Compared with IPD06N03LA G, IPS06N03LA G offers identical silicon performance in a smaller TO-251 footprint ideal for dense layouts, while IRLML6344TRPBF trades current capacity and thermal capability for ultra-compact packaging-making it unsuitable as a functional replacement in high-power POL designs.

Availability

IPS06N03LA G is available at Aetrix Electronics and suitable for server point-of-load regulators, telecom DC/DC modules, industrial motor drive inverters, and automotive ADAS power supplies requiring stable component supply across multi-year production cycles.

Supply support for IPS06N03LA G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.

This part belongs to the OptiMOS®2 family - designed specifically for high-efficiency, high-frequency DC/DC conversion in computing, telecom, and industrial power systems where low RDS(on), fast switching, and thermal robustness are critical.

FAQ

Is IPS06N03LA G suitable for synchronous rectification in a 1 MHz buck converter?

Yes. With Qg = 17–22 nC, Qgd = 4.6–6.9 nC, and RDS(on) = 4.8–5.7 mΩ (SMD), it delivers low switching and conduction losses at 1 MHz. Its 6 kV/µs dv/dt rating and low Qrr (10 nC) further ensure reliable synchronous operation without shoot-through risk.

What is the recommended PCB layout for thermal performance?

Mount the exposed drain pad directly to ≥6 cm² of 70 µm thick copper on an FR4 PCB (40 mm × 40 mm), using multiple thermal vias to inner ground planes. Maintain ≥0.5 mm clearance between gate trace and high-dI/dt paths to minimize coupling. Avoid solder mask over the drain pad.

Does IPS06N03LA G require a gate resistor for stability?

Yes. A 2.2–10 Ω series gate resistor is recommended to dampen ringing caused by gate loop inductance and MOSFET input capacitance (Ciss = 2093–2653 pF). Values depend on driver strength and layout; lower values increase switching speed but risk overshoot.

Can IPS06N03LA G replace IPS06N03L G in existing designs?

No. IPS06N03L G is a non-RoHS, leaded version with different plating and JEDEC qualification status. While electrically identical, the G suffix denotes Pb-free, RoHS-compliant construction with modified reflow profile requirements - mixing versions may cause solder joint reliability issues or compliance failures.

IPS06N03LA G Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
TO-251-3 Stub Leads, IPAK
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
25 V
Current - Continuous Drain (Id) @ 25°C:
50A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
5.9mOhm @ 30A, 10V
Vgs(th) (Max) @ Id:
2V @ 40µA
Gate Charge (Qg) (Max) @ Vgs:
22 nC @ 5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2653 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
83W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO251-3-11

IPS06N03LA G FAQ

1.How can I place an order for IPS06N03LA G through Aetrix?

Please submit a Request for Quotation (RFQ) for IPS06N03LA G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPS06N03LA G reliable?

The price and inventory of IPS06N03LA G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPS06N03LA G is usually 5 days.

3.What payment methods are accepted for IPS06N03LA G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPS06N03LA G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IPS06N03LA G?

IPS06N03LA G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPS06N03LA G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPS06N03LA G?

For technical support, including IPS06N03LA G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPS06N03LA G requirements.

6.How does Aetrix verify that IPS06N03LA G is sourced from the original manufacturer or authorized distributors?

All IPS06N03LA G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPS06N03LA G meets industry standards.

7.What is the process for return or replacement of IPS06N03LA G?

All IPS06N03LA G units undergo pre-shipment inspection (PSI). If there is an issue with IPS06N03LA G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPS06N03LA G part is unused and in its original packaging.

Return procedure for IPS06N03LA G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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