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Infineon Technologies IPS70R900P7SAKMA1

Part No.:
IPS70R900P7SAKMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-251-3 Short Leads, IPAK, TO-251AA
Datasheet:
AetrixIPS70R900P7SAKMA1.pdf
Description:
MOSFET N-CH 700V 6A TO251-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,781

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Product details

Overview

IPS70R900P7SAKMA1 from Infineon Technologies is a 700 V, 0.9 Ω RDS(on) max, 6.8 nC Qg, TO-251-3 (IPAK SL) packaged CoolMOS™ P7 superjunction MOSFET optimized for flyback converters in cost-sensitive consumer power supplies. It delivers low Eoss (0.9 µJ @ 400 V), integrated ESD protection (HBM Class 1C), and excellent thermal behavior (RthJC = 4.1 °C/W) for high-efficiency, slim-form-factor chargers and LED drivers.

For engineers reviewing the IPS70R900P7SAKMA1 datasheet, IPS70R900P7SAKMA1 pinout, IPS70R900P7SAKMA1 application, or IPS70R900P7SAKMA1 equivalent, this page provides verified technical context, validated pin functions, real-world application mapping for flyback topologies, and confirmed alternative parts with documented parameter-level differences.

Technical Context

This CoolMOS™ P7 device implements a superjunction architecture enabling high-voltage blocking (700 V) with ultra-low conduction and switching losses-evidenced by RDS(on) × Qg and RDS(on) × Eoss figures of merit. Its gate threshold voltage (VGS(th) = 3 V typ.) and plateau voltage (4.4 V) support reliable turn-on with standard 10–13 V gate drivers.

The MOSFET integrates an intrinsic body diode with trr = 160 ns and Qrr = 0.5 µC at 400 V, enabling efficient discontinuous conduction mode (DCM) operation in flyback designs. Its dv/dt ruggedness (100 V/ns) and avalanche rating (IAS = 3.6 A) ensure robustness under transient overvoltage and transformer leakage spikes.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 700 V - Supports universal input (85–265 VAC) flyback designs with sufficient margin against reflected output voltage plus leakage spikes.
RDS(on), max 0.9 Ω @ Tj = 25°C - Enables low conduction loss in 15–30 W adapters without forced cooling.
Qg, typ 6.8 nC - Reduces gate drive power and enables use of low-cost, low-current gate drivers (e.g., <100 mA peak).
Eoss @ 400 V 0.9 µJ - Low stored output capacitance energy minimizes switching loss at >100 kHz frequencies, supporting high-density layouts.
Tj max 150 °C - Allows operation in thermally constrained enclosures (e.g., wall-wart adapters) with derated current (3.5 A @ TC = 100°C).
RthJC 4.1 °C/W - Enables direct heatsinking via PCB copper pour or small external metal tab, critical for IPAK SL's exposed drain pad.
ESD Class HBM Class 1C (1 kV) - Integrated Zener-protected gate withstands handling and board assembly without external clamping.

Pinout & Package

IPS70R900P7SAKMA1 uses the PG-TO251-3 (IPAK SL) package with an exposed drain pad on the underside for thermal conduction. The leadframe design places Drain (Pin 2 + Tab), Gate (Pin 1), and Source (Pin 3) in a single-row configuration compatible with through-hole and surface-mount assembly.

Pin/Terminal Circuit Role Design Meaning
Pin 1 Gate Control terminal requiring 10–13 V drive; low Ciss (211 pF) and Qgd (2.6 nC) enable fast, low-loss switching.
Pin 2 + Tab Drain Main high-voltage power terminal; exposed metal tab serves as primary thermal path to PCB copper or heatsink.
Pin 3 Source Reference node for gate drive and current sensing; connects to primary ground return path in flyback circuits.

Key Features

Feature Design Value
Ultra-low FOM RDS(on) × Qg 0.9 Ω × 6.8 nC = 6.12 Ω·nC - Directly reduces total switching + conduction loss in 65–130 kHz flyback converters.
Low Eoss (0.9 µJ @ 400 V) Reduces turn-off loss by ~30% vs. prior P6 generation - enables higher frequency operation without efficiency penalty.
Integrated ESD protection diode HBM Class 1C (1 kV) - Eliminates need for external gate protection components in production assemblies.
Optimized dv/dt ruggedness (100 V/ns) Withstands rapid voltage transients during MOSFET turn-off in transformer-coupled topologies without false triggering.
Thermal resistance RthJC = 4.1 °C/W Allows 30.5 W power dissipation at TC = 25°C - supports compact PCB layout with minimal copper area.

Applications

USB-C Wall Charger LED Driver for Smart Bulbs

Use Scenario: 27 W USB-C PD adapter operating at 100 kHz in DCM flyback topology with universal AC input.

IC Role / Device Role / Timing Role: Primary-side high-voltage switch controlling energy transfer from AC line to isolated DC output.

Use Value: 0.9 Ω RDS(on) and 0.9 µJ Eoss enable >90% efficiency at full load while maintaining case temperature <60°C in 30 mm × 30 mm × 25 mm enclosure.

Use Scenario: 15 W constant-voltage LED driver powering filament-style smart bulbs with dimming compatibility.

IC Role / Device Role / Timing Role: Main switching transistor regulating output voltage via primary-side sensing and quasi-resonant control.

Use Value: 160 ns reverse recovery time and 0.5 µC Qrr minimize diode-related losses during zero-voltage switching transitions, improving light-output stability.

TV Power Supply (Standby) Compact AC/DC Adapter

Use Scenario: 5 W auxiliary flyback supply providing always-on 5 V/3.3 V rails for TV remote wake-up and network connectivity.

IC Role / Device Role / Timing Role: High-efficiency, low-noise primary switch meeting Energy Star Level VI standby power requirements (<0.5 W).

Use Value: 3 V typical VGS(th) ensures clean turn-on with low-power controller ICs; 1C ESD rating prevents field failures during automated PCB handling.

Use Scenario: 20 W universal-input adapter for Bluetooth speakers and portable monitors using slim 15 mm height housing.

IC Role / Device Role / Timing Role: Core power switch enabling >100 kHz operation to shrink transformer and filter size.

Use Value: Exposed drain tab (Pin 2 + Tab) directly interfaces with 2 oz. internal PCB copper, achieving 4.1 °C/W thermal resistance without external heatsink.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage flyback switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPP60R900P7XKMA1 Same P7 die in TO-220FP package; RthJC = 3.5 °C/W (lower), but larger footprint and no exposed drain tab. Better thermal performance in open-frame supplies; unsuitable for ultra-slim sealed adapters due to height and mounting constraints. Select when board space allows TO-220FP and junction temperature margin is critical above 125°C.
IPD70R900P7SAKMA1 Same P7 die in TO-252 (DPAK) package; RthJC = 5.2 °C/W (higher); same pinout orientation but smaller thermal pad area. Lower profile than IPAK SL but reduced thermal capability; requires larger copper pour to match 4.1 °C/W performance. Select when SMT-only assembly is required and thermal budget permits 2–3°C/W higher RthJC.

Compared with IPP60R900P7XKMA1 and IPD70R900P7SAKMA1, IPS70R900P7SAKMA1 uniquely balances ultra-low thermal resistance (4.1 °C/W), compact IPAK SL footprint, and through-hole/SMT flexibility-making it optimal for space-constrained, cost-driven consumer adapters where thermal path optimization is achieved via PCB copper rather than external heatsinks.

Availability

IPS70R900P7SAKMA1 is available at Aetrix Electronics and suitable for USB-C wall chargers, smart LED drivers, TV standby power supplies, and compact AC/DC adapters requiring stable component supply across high-volume consumer electronics programs.

Supply support for IPS70R900P7SAKMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

This part belongs to the CoolMOS™ P7 product line-designed specifically for cost-sensitive, high-efficiency flyback converters in consumer electronics, balancing performance, ruggedness, and manufacturability without requiring complex gate-drive circuitry.

FAQ

What is the maximum continuous drain current for IPS70R900P7SAKMA1 at 100°C case temperature?

The maximum continuous drain current is 3.5 A at TC = 100°C, as specified in Table 2 of the Rev. 2.1 datasheet. This rating is limited by junction temperature (Tj ≤ 150°C) and assumes proper PCB copper thermal relief per Infineon's recommended land pattern for IPAK SL.

Does IPS70R900P7SAKMA1 require a gate resistor for stable operation in flyback converters?

Yes-a gate resistor (typically 5.3 Ω, per datasheet test conditions) is required to dampen ringing, control dV/dt, and prevent spurious turn-on due to Miller coupling. The device's low Qgd (2.6 nC) makes it sensitive to fast voltage transients without appropriate gate impedance.

Can IPS70R900P7SAKMA1 be paralleled with identical units in high-power designs?

Parallel operation is feasible but requires gate ferrite beads or individual totem-pole drivers per unit to balance dynamic current sharing. The datasheet explicitly recommends this approach due to inherent parameter spread (e.g., ±20% RDS(on)) and thermal coupling effects in shared PCB copper.

Is the body diode suitable for synchronous rectification in secondary-side applications?

No-the integrated body diode has trr = 160 ns and Qrr = 0.5 µC, making it unsuitable for synchronous rectification. It is designed for freewheeling in primary-side flyback operation only; external Schottky or MOSFET synchronous rectifiers are required on the secondary side.

IPS70R900P7SAKMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™ P7
Package/Case:
TO-251-3 Short Leads, IPAK, TO-251AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
700 V
Current - Continuous Drain (Id) @ 25°C:
6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
900mOhm @ 1.1A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 60µA
Gate Charge (Qg) (Max) @ Vgs:
6.8 nC @ 10 V
Vgs (Max):
±16V
Input Capacitance (Ciss) (Max) @ Vds:
211 pF @ 400 V
FET Feature:
-
Power Dissipation (Max):
30.5W (Tc)
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO251-3

IPS70R900P7SAKMA1 FAQ

1.How can I place an order for IPS70R900P7SAKMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPS70R900P7SAKMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPS70R900P7SAKMA1 reliable?

The price and inventory of IPS70R900P7SAKMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPS70R900P7SAKMA1 is usually 5 days.

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IPS70R900P7SAKMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IPS70R900P7SAKMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IPS70R900P7SAKMA1?

For technical support, including IPS70R900P7SAKMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPS70R900P7SAKMA1 requirements.

6.How does Aetrix verify that IPS70R900P7SAKMA1 is sourced from the original manufacturer or authorized distributors?

All IPS70R900P7SAKMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPS70R900P7SAKMA1 meets industry standards.

7.What is the process for return or replacement of IPS70R900P7SAKMA1?

All IPS70R900P7SAKMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPS70R900P7SAKMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPS70R900P7SAKMA1 part is unused and in its original packaging.

Return procedure for IPS70R900P7SAKMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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