Infineon Technologies IPT039N15N5ATMA1
- Part No.:
- IPT039N15N5ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSFN
- Datasheet:
-
IPT039N15N5ATMA1.pdf
- Description:
- OPTIMOS 5 POWER MOSFET
- Quantity:
- Payment:

- Shipping:

Inventory:9,504
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPT039N15N5ATMA1 from Infineon is an N-channel 150 V OptiMOS™ 5 power MOSFET in PG-HSOF-8 (TOLL) package, rated for 190 A continuous drain current at TC = 25 °C, with RDS(on) = 3.9 mΩ max at VGS = 10 V and Qg = 78 nC. It features 100% avalanche tested ruggedness, ultra-low thermal resistance (RthJC = 0.47 °C/W), and is qualified for industrial applications.
For engineers reviewing the IPT039N15N5ATMA1 datasheet, IPT039N15N5ATMA1 pinout, IPT039N15N5ATMA1 application, or IPT039N15N5ATMA1 equivalent, key selection criteria include its 150 V breakdown voltage, 3.9 mΩ on-resistance, 219 nC output charge, TOLL package thermal performance, and suitability for high-current DC-DC and motor drive switching stages.
Technical Context
This device employs Infineon's OptiMOS™ 5 trench-gate superjunction technology optimized for high-voltage, high-current switching with minimized conduction and switching losses. Its gate threshold voltage (VGS(th) = 3.0–4.6 V) enables robust 5 V logic-level drive compatibility while maintaining noise immunity.
The MOSFET integrates a low-loss body diode with trr = 53.4–106.8 ns and Qrr = 77.2–154.4 nC, supporting synchronous rectification and hard-switched topologies. Thermal design is enabled by the exposed drain tab in the TOLL package and RthJC = 0.47 °C/W, allowing direct heatsink mounting without isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 150 V - Withstands up to 150 V drain-source blocking voltage, suitable for 48 V–96 V bus systems and 100 V-class industrial supplies. |
| RDS(on) max | 3.9 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 50 A, critical for high-efficiency power stages. |
| ID cont | 190 A @ TC = 25 °C - Supports high-current motor phases or server VRMs without parallel devices. |
| Qg | 78 nC - Determines gate driver power requirement; compatible with standard 2 A peak drivers for ≤100 kHz switching. |
| RthJC | 0.47 °C/W - Allows >300 W power dissipation with modest heatsinking, enabling compact thermal design. |
| EAS | 255 mJ - Confirmed single-pulse avalanche energy rating ensures reliability under inductive load turn-off stress. |
| Qoss | 219 nC - Defines output capacitance charge; impacts zero-voltage switching (ZVS) feasibility and turn-off loss. |
Pinout & Package
Supplied in PG-HSOF-8 (TOLL) package: thermally enhanced surface-mount outline with exposed drain tab on bottom side for direct heatsink attachment. Dimensions: 9.9 mm × 7.9 mm × 1.9 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain Tab | Main power drain connection | Exposed copper pad on underside; primary thermal path and high-current return path-must be soldered to large PCB copper pour or heatsink. |
| Gate (Pin 1) | Control terminal | Low-impedance input requiring <2 A peak drive; sensitive to ringing-requires local gate resistor and Kelvin source routing. |
| Source (Pins 2–8) | Reference node for gate drive and current sensing | Parallel pins reduce source inductance; essential for stable high-dI/dt operation and accurate RDS(on)-based current monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| OptiMOS™ 5 trench technology | Delivers 3.9 mΩ RDS(on) at 150 V, achieving best-in-class figure-of-merit (RDS(on) × Qg) for industrial-grade HV MOSFETs. |
| 100% avalanche tested | Guarantees robustness against inductive switching transients without derating-no additional snubbers required in motor drive H-bridges. |
| TOLL package thermal performance | RthJC = 0.47 °C/W enables >300 W continuous power handling with passive cooling, reducing need for forced air or liquid solutions. |
| Pb-free & halogen-free | Complies with RoHS and IEC61249-2-21, supporting environmentally regulated industrial and automotive-adjacent deployments. |
| Industrial qualification | Fully JEDEC-qualified for extended temperature range (−55 °C to +175 °C), ensuring reliability in factory automation and UPS systems. |
Applications
| Motor Drive Inverter Stage | Server VRM High-Side Switch |
|---|---|
Use Scenario: Three-phase BLDC inverter for industrial pumps operating at 48–72 V bus with 150 A peak phase current. IC Role / Device Role / Timing Role: High-side N-channel power switch in 6-pack half-bridge configuration, switching at 20–40 kHz with PWM-controlled torque. Use Value: 3.9 mΩ RDS(on) reduces conduction loss by >35% vs. legacy 150 V MOSFETs, enabling smaller heatsinks and higher power density. | Use Scenario: Primary high-side switch in 48 V input → 1 V/300 A output multiphase buck converter for AI accelerators. IC Role / Device Role / Timing Role: Synchronous rectifier switch in interleaved buck stage, driven by dedicated gate controller with adaptive dead-time control. Use Value: Low Qoss (219 nC) and fast tf (5.4 ns) minimize turn-off loss and improve light-load efficiency above 92%. |
| Uninterruptible Power Supply (UPS) Output Stage | EV Onboard Charger (OBC) PFC Switch |
Use Scenario: 5 kVA double-conversion UPS delivering clean 230 VAC output from 384 VDC battery bank. IC Role / Device Role / Timing Role: Full-bridge inverter switch handling 20–50 kHz sinusoidal PWM with bidirectional current capability via integrated body diode. Use Value: 255 mJ EAS withstands repeated line-surge events and battery reversal transients without failure. | Use Scenario: Boost switch in 6.6 kW two-stage OBC PFC front-end operating at 70 kHz with 400 VDC output. IC Role / Device Role / Timing Role: Fast-switching high-voltage switch in continuous conduction mode (CCM) boost topology with active clamp. Use Value: Optimized Ciss/Coss ratio (5900 pF / 1500 pF) supports ZVS across wide load range, reducing EMI and improving efficiency at full load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current 150 V MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB039N15N5 | Same die, but in TO-263 (D²PAK) package; RthJC = 0.55 °C/W; larger footprint; no Kelvin source pins. | Preferred where manual assembly or through-hole rework is needed; less optimal for >100 kHz due to higher source inductance. | Select when thermal margin allows larger package and board space is available; avoid in ultra-dense motor drive modules. |
| STL220N15F7 | 150 V, 220 A, RDS(on) = 3.5 mΩ, but Qg = 105 nC; TSDSON-8 package; RthJC = 0.50 °C/W. | Better conduction loss but higher switching loss; requires stronger gate driver; lower avalanche rating (EAS = 190 mJ). | Choose only if conduction loss dominates system loss budget and gate drive capability supports 105 nC charge. |
Compared with IPB039N15N5 and STL220N15F7, IPT039N15N5ATMA1 offers superior switching efficiency (lower Qg and Qoss) and best-in-class thermal resistance, making it optimal for high-frequency, space-constrained industrial inverters where both loss and thermal management are critical.
Availability
IPT039N15N5ATMA1 is available at Aetrix Electronics and suitable for industrial motor drives, server VRMs, uninterruptible power supplies, and EV onboard chargers requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IPT039N15N5ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and sensor solutions, with global manufacturing and R&D infrastructure.
This part belongs to the OptiMOS™ 5 family-designed specifically for high-efficiency, high-power-density industrial and computing power conversion, emphasizing low RDS(on), fast switching, and rugged avalanche performance.
FAQ
What is the maximum recommended gate drive voltage for IPT039N15N5ATMA1?
The absolute maximum gate-source voltage is ±20 V, but the recommended operating range is 10 V to 15 V for reliable RDS(on) optimization and long-term gate oxide integrity. Driving above 15 V yields diminishing RDS(on) improvement while increasing risk of gate overvoltage during transients.
Can IPT039N15N5ATMA1 be used in paralleled configurations?
Yes-its positive temperature coefficient of RDS(on) and matched dynamic parameters enable stable current sharing. Use identical gate trace lengths, individual gate resistors (≤5 Ω), and Kelvin source connections. Derate total current by 15% for thermal imbalance in multi-device layouts.
Is the body diode suitable for synchronous rectification in a buck converter?
Yes-the body diode has trr = 53.4–106.8 ns and Qrr = 77–154 nC, enabling use in synchronous buck topologies up to 100 kHz. However, external Schottky diodes are preferred for >150 kHz or where reverse recovery noise must be minimized.
Does IPT039N15N5ATMA1 require a gate driver with negative turn-off capability?
No-its VGS(th) (3.0–4.6 V) and low Miller plateau voltage (5.3 V typ.) allow clean turn-off with 0 V gate drive. A negative turn-off (e.g., −5 V) is unnecessary but may improve dV/dt immunity in noisy environments with high parasitic inductance.
IPT039N15N5ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Ta), 190A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 8V, 10V
- Rds On (Max) @ Id, Vgs:
- 3.9mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 4.6V @ 257µA
- Gate Charge (Qg) (Max) @ Vgs:
- 98 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 7700 pF @ 75 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 319W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-HSOF-8
IPT039N15N5ATMA1 FAQ
1.How can I place an order for IPT039N15N5ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPT039N15N5ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPT039N15N5ATMA1 reliable?
The price and inventory of IPT039N15N5ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPT039N15N5ATMA1 is usually 5 days.
3.What payment methods are accepted for IPT039N15N5ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPT039N15N5ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPT039N15N5ATMA1?
IPT039N15N5ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPT039N15N5ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPT039N15N5ATMA1?
For technical support, including IPT039N15N5ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPT039N15N5ATMA1 requirements.
6.How does Aetrix verify that IPT039N15N5ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPT039N15N5ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPT039N15N5ATMA1 meets industry standards.
7.What is the process for return or replacement of IPT039N15N5ATMA1?
All IPT039N15N5ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPT039N15N5ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPT039N15N5ATMA1 part is unused and in its original packaging.
Return procedure for IPT039N15N5ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPT039N15N5ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

