Infineon Technologies IPTG025N10NM5ATMA1
- Part No.:
- IPTG025N10NM5ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSMD, Gull Wing
- Datasheet:
-
IPTG025N10NM5ATMA1.pdf
- Description:
- TRENCH >=100V PG-HSOG-8
- Quantity:
- Payment:

- Shipping:

Inventory:4,794
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Product details
Overview
IPTG025N10NM5 from Infineon Technologies is a 100 V, 2.5 mΩ N-channel enhancement-mode MOSFET in PG-HSOG-8-1 package, optimized for high-frequency synchronous rectification and high-current DC-DC conversion. It delivers 206 A continuous drain current at TC = 25 °C, features 96 nC total gate charge and 123 nC output charge, and is 100% avalanche tested for ruggedness in industrial power stages.
For engineers reviewing the IPTG025N10NM5 datasheet, IPTG025N10NM5 pinout, IPTG025N10NM5 application, or IPTG025N10NM5 equivalent, key selection criteria include RDS(on) stability over temperature, Qg/Qoss trade-off for ZVS/ZCS operation, thermal resistance (RthJC = 0.4 °C/W), and HSOG-8 layout compatibility with high-current PCB copper areas.
Technical Context
This OptiMOSTM 5 device uses trench-gate superjunction architecture to achieve ultra-low RDS(on) × Qg figure-of-merit (FOM) of 240 Ω·nC. Its gate threshold voltage (2.2–3.8 V) ensures robust noise immunity while enabling standard 10 V gate drive compatibility.
The integrated body diode exhibits fast reverse recovery (trr = 40–80 ns, Qrr = 52–104 nC) and low forward voltage (VSD = 0.89–1.2 V @ 100 A), making it suitable for synchronous FET roles where diode conduction loss and switching loss must be minimized simultaneously.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage for 48 V and 60 V bus applications with ≥20 % margin |
| RDS(on), max | 2.5 mΩ @ VGS = 10 V, ID = 150 A - Enables <150 mW conduction loss at 100 A |
| ID, cont | 206 A @ TC = 25 °C - Supports high-current phase-legs in server VRMs and telecom PSUs |
| Qg | 96 nC - Low enough for efficient 500 kHz–1 MHz switching with standard gate drivers |
| Qoss | 123 nC - Critical for soft-switching performance in LLC and phase-shifted full-bridge topologies |
| RthJC | 0.4 °C/W - Allows >200 W power dissipation with modest heatsinking at case temperature |
| VGS(th) | 2.2–3.8 V - Ensures reliable turn-on with 5 V logic-level gate drivers while rejecting noise |
Pinout & Package
PG-HSOG-8-1 is a surface-mount, thermally enhanced 8-pin package with exposed drain tab on bottom side. The tab provides low-inductance, high-current path and primary thermal interface to PCB copper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TAB (Drain) | Main power drain connection | Exposed copper pad; carries full load current and serves as primary heat sink interface |
| Pin 1 | Gate | High-impedance control input; requires low-inductance routing to minimize ringing during fast switching |
| Pins 2–8 | Source | Parallel-source configuration reduces source inductance and improves current sharing across pins |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) × Qg FOM | 240 Ω·nC - Directly enables higher efficiency at 1 MHz+ switching frequencies in compact form factors |
| 100 % avalanche rated | EAS = 250 mJ @ ID = 150 A - Guarantees single-pulse ruggedness under inductive turn-off stress without derating |
| Optimized body diode | trr = 40–80 ns, Qrr = 52–104 nC - Reduces diode reverse recovery loss and EMI in synchronous rectifier mode |
| Thermally enhanced package | RthJC = 0.4 °C/W - Enables direct thermal coupling to 6 cm² PCB copper, eliminating need for external heatsink in many designs |
Applications
| Server VRM Phase Legs | Telecom 48 V Intermediate Bus Converters |
|---|---|
Use Scenario: High-density, multi-phase buck converters delivering up to 300 A to CPU/GPU cores in AI servers. IC Role / Device Role / Timing Role: High-side and low-side synchronous FET in 500 kHz–1 MHz multiphase topology. Use Value: 2.5 mΩ RDS(on) and 96 nC Qg reduce both conduction and switching losses, improving full-load efficiency by ≥0.8 % vs. prior-gen MOSFETs. | Use Scenario: Isolated or non-isolated 48 V-to-12 V/5 V DC-DC modules powering base station radios and optical line cards. IC Role / Device Role / Timing Role: Primary-side switch in hard-switched or resonant (LLC) topologies operating at 300–700 kHz. Use Value: 100 V rating with 20 % margin supports transient tolerance on 48 V bus; 0.4 °C/W RthJC sustains 150 A peak current without thermal throttling. |
| Industrial Motor Drive Inverters | EV On-Board Charger (OBC) PFC Stages |
Use Scenario: 3-phase inverter modules for servo drives and HVAC compressors rated up to 5 kW. IC Role / Device Role / Timing Role: Half-bridge leg switch handling 100–150 A RMS motor current with 10 kHz PWM. Use Value: Avalanche rating (250 mJ) protects against inductive kickback during fault conditions; parallel-source pins minimize loop inductance for clean gate waveforms. | Use Scenario: Boost PFC stage in 6.6 kW bi-directional OBCs converting AC grid to 400 V DC link. IC Role / Device Role / Timing Role: Fast-switching boost switch operating at 65–135 kHz with ZVS capability. Use Value: Low Qoss (123 nC) and fast body diode enable efficient ZVS transition; halogen-free, RoHS-compliant construction meets automotive qualification requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current, high-frequency MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXFH210N10T2 | RDS(on) = 2.1 mΩ, Qg = 115 nC, TO-247 package | Higher gate charge increases driver loss; through-hole mounting limits board density | Preferred when maximum RDS(on) is critical and thermal mass outweighs switching speed needs |
| STL220N10F7 | RDS(on) = 2.4 mΩ, Qg = 85 nC, PowerFLAT 8x8 package | Lower Qg improves high-frequency efficiency but lacks 100 % avalanche test validation | Better for cost-sensitive, non-safety-critical 1 MHz SMPS where avalanche margin is secondary |
Compared with IXFH210N10T2 and STL220N10F7, IPTG025N10NM5 uniquely balances ultra-low RDS(on), industry-leading Qoss, full avalanche qualification, and surface-mount thermal performance-making it optimal for space-constrained, high-reliability industrial and telecom power stages.
Availability
IPTG025N10NM5 is available at Aetrix Electronics and suitable for server VRMs, telecom DC-DC converters, and industrial motor drives requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp.
Supply support for IPTG025N10NM5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This device belongs to the OptiMOSTM 5 family-engineered specifically for high-efficiency, high-frequency power conversion in datacenter, telecom, and industrial systems where thermal density and switching loss dominate design constraints.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The absolute maximum junction temperature is 175 °C per JEDEC qualification. For continuous industrial operation, derating is required above TC = 100 °C per Figure 2 in the datasheet; at TC = 125 °C, the continuous drain current drops to 123 A to maintain safe thermal margin.
Is the PG-HSOG-8-1 package compatible with standard reflow profiles?
Yes-the PG-HSOG-8-1 package is qualified for lead-free reflow per J-STD-020D. Peak temperature must not exceed 260 °C for ≤30 seconds, and the thermal pad must be soldered to ≥6 cm² of 70 µm copper to achieve specified RthJC and current ratings.
Does the device support gate drive with 5 V logic-level controllers?
Yes-VGS(th) ranges from 2.2 V to 3.8 V, ensuring reliable turn-on with 5 V gate drivers. However, RDS(on) is specified at VGS = 10 V (2.5 mΩ); at VGS = 5 V, RDS(on) rises to ~5.5 mΩ, increasing conduction loss significantly.
How does the body diode performance compare to discrete Schottky alternatives?
The integrated body diode achieves VSD = 0.89 V @ 100 A and trr = 40–80 ns-comparable to medium-voltage Schottkys but with lower leakage and no reverse recovery tail. Unlike Schottkys, it shares the same thermal path as the MOSFET channel, simplifying thermal design in synchronous rectifiers.
IPTG025N10NM5ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerSMD, Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 27A (Ta), 206A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.5mOhm @ 150A 10V
- Vgs(th) (Max) @ Id:
- 3.8V @ 158µA
- Gate Charge (Qg) (Max) @ Vgs:
- 120 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 8800 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 214W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-HSOG-8-1
IPTG025N10NM5ATMA1 FAQ
1.How can I place an order for IPTG025N10NM5ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPTG025N10NM5ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPTG025N10NM5ATMA1 reliable?
The price and inventory of IPTG025N10NM5ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPTG025N10NM5ATMA1 is usually 5 days.
3.What payment methods are accepted for IPTG025N10NM5ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPTG025N10NM5ATMA1 transactions.
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4.How is shipping managed for IPTG025N10NM5ATMA1?
IPTG025N10NM5ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPTG025N10NM5ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPTG025N10NM5ATMA1?
For technical support, including IPTG025N10NM5ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPTG025N10NM5ATMA1 requirements.
6.How does Aetrix verify that IPTG025N10NM5ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPTG025N10NM5ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPTG025N10NM5ATMA1 meets industry standards.
7.What is the process for return or replacement of IPTG025N10NM5ATMA1?
All IPTG025N10NM5ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPTG025N10NM5ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPTG025N10NM5ATMA1 part is unused and in its original packaging.
Return procedure for IPTG025N10NM5ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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