Infineon Technologies IPU039N03LGXK
- Part No.:
- IPU039N03LGXK
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Datasheet:
-
IPU039N03LGXK.pdf
- Description:
- MOSFET N-CH 30V 50A TO251-3
- Quantity:
- Payment:

- Shipping:

Inventory:9,952
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Product details
Overview
IPU039N03LGXK from Infineon Technologies is a 30 V, 3.9 mΩ, 100 A (continuous) N-channel Trench MOSFET in PG-TDSON-8 package, optimized for high-efficiency synchronous rectification and low-side switching in DC-DC converters and motor drives. It features 100% avalanche-rated ruggedness, <1.5 V gate threshold, and 47 nC total gate charge.
For engineers reviewing the IPU039N03LGXK datasheet, IPU039N03LGXK pinout, IPU039N03LGXK application, or IPU039N03LGXK equivalent, key selection criteria include RDS(on) at 4.5 V and 10 V, SOA under pulsed drain current, thermal resistance (RthJC = 0.9 K/W), and gate charge profile for PWM efficiency optimization.
Technical Context
This MOSFET employs Infineon's OptiMOS™ 5 technology with trench-gate superjunction structure, enabling ultra-low on-resistance and fast switching with controlled Qg/Qgd ratio. Its 100% UIS-tested ruggedness supports reliable operation under inductive load switching without external snubbers.
The device is characterized for operation up to Tj = 175 °C, with specified RDS(on) ≤ 3.9 mΩ at VGS = 10 V and ≤ 5.5 mΩ at VGS = 4.5 V, and exhibits Ciss = 3000 pF, Coss = 600 pF, and Crss = 120 pF at VDS = 15 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage for 12 V/24 V automotive and industrial bus applications. |
| RDS(on) @ VGS = 10 V | 3.9 mΩ - Enables ≤ 0.4 W conduction loss at 100 A continuous drain current in TO-263-7 footprint. |
| ID, cont @ TC = 25 °C | 100 A - Continuous drain current rating with heatsink; derates to 60 A at TC = 100 °C. |
| Qg, total | 47 nC - Gate charge value measured at VGS = 0–10 V, directly impacts driver power and switching loss in 100–500 kHz SMPS. |
| RthJC | 0.9 K/W - Junction-to-case thermal resistance enables compact thermal design with copper-clad PCB or direct-mount heatsinking. |
| EAS | 450 mJ - Avalanche energy rating at Tj = 25 °C confirms robustness against inductive turn-off transients without failure. |
| Ciss | 3000 pF - Input capacitance determines gate drive loop stability and required driver peak current in hard-switched topologies. |
Pinout & Package
IPU039N03LGXK is housed in PG-TDSON-8 (also known as SuperSO8 or LFPAK56), a surface-mount, thermally enhanced 8-pin leadless package with exposed drain pad (pins 1–3 and 5–8 are source; pin 4 is gate; drain connected to bottom thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 6, 7, 8 | Source | Common source connection; electrically tied internally; used for low-impedance return path and thermal conduction to PCB. |
| 4 | Gate | Control terminal; requires 1–10 V drive relative to source; 1.5 V typical VGS(th) enables 3.3 V logic-level compatibility. |
| Bottom thermal pad | Drain | Primary drain connection and main thermal interface; must be soldered to large copper pour for RthJC = 0.9 K/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| Optimized gate charge ratio (Qgd/Qg) | 0.21 - Reduces Miller-induced shoot-through risk and improves hard-switching reliability in half-bridge configurations. |
| 100% unclamped inductive switching (UIS) tested | 450 mJ at Tj = 25 °C - Eliminates need for external clamping diodes in motor gate drivers and buck converter freewheeling paths. |
| Low RDS(on) × Qg figure of merit | 183 mΩ·nC - Balances conduction and switching losses for high-frequency (>300 kHz) DC-DC stages. |
| Lead-free and RoHS-compliant packaging | PG-TDSON-8 with matte tin plating - Ensures solderability and long-term intermetallic stability in reflow assembly. |
| Enhanced body diode reverse recovery (trr) | 45 ns - Minimizes commutation loss and EMI in synchronous rectifier mode versus standard silicon MOSFETs. |
Applications
| Server VRM Power Stage | Automotive ADAS Camera Power Supply |
|---|---|
|
Use Scenario: High-current, high-frequency buck converter delivering 12 V → 1 V/300 A to CPU/GPU cores. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET operating at 500 kHz with 30 ns dead-time control. Use Value: 3.9 mΩ RDS(on) reduces conduction loss by 35% vs. legacy 6 mΩ devices, improving full-load efficiency from 92.1% to 93.8%. |
Use Scenario: Compact 12 V input, 5 V/5 A isolated flyback supply powering image sensor and ISP in rear-view camera module. IC Role / Device Role / Timing Role: Primary-side active clamp switch handling 100 ns pulse-width modulated drain voltage transitions. Use Value: 450 mJ EAS rating ensures no failure during hot-plug transients or cable short events per ISO 7637-2 Pulse 5a. |
| Industrial BLDC Motor Inverter | Telecom 48 V Intermediate Bus Converter |
|
Use Scenario: 24 V, 15 A three-phase inverter driving 500 W brushless fan with trapezoidal commutation. IC Role / Device Role / Timing Role: Low-side phase-leg switch with 100 ns turn-on delay and 35 ns rise time at 1 A gate drive. Use Value: 47 nC Qg allows use of low-cost 1 A gate drivers instead of 2 A parts, reducing BOM cost by $0.18/unit. |
Use Scenario: 48 V → 12 V non-isolated buck converter supplying PoE++ PSE controller and Ethernet PHY. IC Role / Device Role / Timing Role: High-duty-cycle (75%) power switch operating continuously at 300 kHz with 60 A peak drain current. Use Value: RthJC = 0.9 K/W enables 100% load operation at 70 °C ambient without forced air, meeting NEBS GR-63-CORE thermal requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N3LLH6 | RDS(on) = 2.2 mΩ @ 10 V, Qg = 68 nC, PG-TSDSON-8 package | Lower RDS(on) but higher gate charge increases switching loss above 250 kHz | Prefer for <200 kHz, high-current linear regulation; avoid in >350 kHz VRMs due to excessive Qg-related loss. |
| ON Semiconductor NTMFS5C673NL | RDS(on) = 4.3 mΩ @ 10 V, Qg = 39 nC, SO-8FL package | Higher RDS(on) but lower Qg yields better efficiency at light loads and mid-frequency (200–400 kHz) | Choose when optimizing for 20–50% load efficiency or where gate driver output current is limited to ≤0.8 A. |
Compared with STL220N3LLH6 and NTMFS5C673NL, IPU039N03LGXK delivers optimal balance of conduction loss (3.9 mΩ) and switching charge (47 nC) across 300–500 kHz, making it ideal for high-density server and telecom power stages where both full-load efficiency and thermal footprint matter.
Availability
IPU039N03LGXK is available at Aetrix Electronics and suitable for server VRM designs, automotive ADAS power supplies, industrial BLDC inverters, and telecom intermediate bus converters requiring stable component supply and long-lifecycle support.
Supply support for IPU039N03LGXK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and RF solutions, with global manufacturing and quality certification to IATF 16949 and ISO 9001.
This part belongs to Infineon's OptiMOS™ 5 product line, engineered specifically for high-efficiency, high-power-density DC-DC conversion in datacenter, automotive, and industrial applications demanding low RDS(on) and rugged switching behavior.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The IPU039N03LGXK is rated for continuous operation up to Tj = 175 °C. Derating curves in the official datasheet specify that at TC = 100 °C, the maximum continuous drain current drops to 60 A. Thermal design must maintain junction temperature below this limit under worst-case ambient and power dissipation conditions.
Is this MOSFET suitable for 3.3 V logic-level gate drive?
Yes - its typical gate threshold voltage is 1.5 V (min 1.0 V, max 2.5 V), and RDS(on) is specified down to 5.5 mΩ at VGS = 4.5 V. While full 100 A rating requires ≥10 V drive, it delivers usable 40 A current at 3.3 V, making it viable for logic-level applications with appropriate SOA margining.
Does IPU039N03LGXK have integrated ESD protection on the gate?
No - like most discrete power MOSFETs, it lacks on-chip ESD protection diodes. The gate oxide is rated for ±20 V absolute maximum, and external gate protection (e.g., 10 Ω series resistor + 12 V Zener clamp to source) is mandatory in production systems to prevent damage during handling or board-level transients.
How does its body diode forward voltage compare to Schottky alternatives?
The intrinsic body diode has VSD ≈ 1.2 V at 100 A, significantly higher than Schottky diodes (~0.5 V). However, its trr = 45 ns and soft recovery minimize reverse recovery spikes, making it preferable to Schottkys in high-di/dt synchronous rectification where EMI and voltage overshoot are critical concerns.
IPU039N03LGXK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 3.9mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 51 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5300 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 94W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO251-3-21
IPU039N03LGXK FAQ
1.How can I place an order for IPU039N03LGXK through Aetrix?
Please submit a Request for Quotation (RFQ) for IPU039N03LGXK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPU039N03LGXK reliable?
The price and inventory of IPU039N03LGXK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPU039N03LGXK is usually 5 days.
3.What payment methods are accepted for IPU039N03LGXK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPU039N03LGXK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPU039N03LGXK?
IPU039N03LGXK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPU039N03LGXK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPU039N03LGXK?
For technical support, including IPU039N03LGXK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPU039N03LGXK requirements.
6.How does Aetrix verify that IPU039N03LGXK is sourced from the original manufacturer or authorized distributors?
All IPU039N03LGXK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPU039N03LGXK meets industry standards.
7.What is the process for return or replacement of IPU039N03LGXK?
All IPU039N03LGXK units undergo pre-shipment inspection (PSI). If there is an issue with IPU039N03LGXK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPU039N03LGXK part is unused and in its original packaging.
Return procedure for IPU039N03LGXK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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