Infineon Technologies IQDH35N03LM5CGSCATMA1
- Part No.:
- IQDH35N03LM5CGSCATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 9-PowerWDFN
- Datasheet:
-
IQDH35N03LM5CGSCATMA1.pdf
- Description:
- OPTIMOS POWER MOSFETS 25 V - 150
- Quantity:
- Payment:

- Shipping:

Inventory:3,499
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Product details
Overview
IQDH35N03LM5CGSCATMA1 from Infineon is an N-channel logic-level OptiMOS™ 5 power MOSFET rated at 30 V, with a maximum RDS(on) of 0.35 mΩ at VGS = 10 V, 700 A continuous drain current (TC = 25 °C), and PG-WHTFN-9 package optimized for double-side cooling in high-current DC/DC converters and motor drives.
For engineers reviewing the IQDH35N03LM5CGSCATMA1 datasheet, IQDH35N03LM5CGSCATMA1 pinout, IQDH35N03LM5CGSCATMA1 application, or IQDH35N03LM5CGSCATMA1 equivalent, key selection criteria include ultra-low on-resistance, 100% avalanche-tested ruggedness, dual thermal path capability, and gate charge profile suited for synchronous rectification and high-frequency switching topologies.
Technical Context
This device implements a trench-based silicon MOSFET architecture with optimized cell pitch and deep-trench gate structure to achieve sub-0.4 mΩ RDS(on) while maintaining low Qg (91 nC typical) and Qgd (18–27 nC). Its dual-sided thermal interface enables simultaneous heat extraction from both top and bottom surfaces.
The integrated body diode exhibits trr = 49–98 ns (VDD = 15 V, IF = 25 A) and Qrr = 64–128 nC, supporting efficient hard-switched and synchronous FET operation in buck, half-bridge, and multiphase VRMs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 24 V nominal bus systems with margin for transients |
| RDS(on), max | 0.35 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 700 A, critical for high-efficiency power stages |
| ID, cont | 700 A @ TC = 25 °C - Supports single-device implementation in server VRMs and industrial inverters |
| Qg, total | 91 nC - Low gate drive energy reduces driver losses and simplifies gate driver selection |
| RthJC, bottom | 0.45 °C/W - Enables >250 W dissipation with 112.5 °C ΔT across junction-to-case (bottom) |
| Avalanche energy | 1200 mJ - Withstands single-pulse inductive turn-off events without failure |
| Package | PG-WHTFN-9 - Exposed top and bottom copper pads support double-side cooling on PCBs |
Pinout & Package
PG-WHTFN-9 is a 9-terminal thermally enhanced thin-wafer package with exposed top and bottom copper thermal pads. It supports double-side cooling via soldered interfaces to both PCB layers and heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–4 | Source | Low-inductance parallel source connection; tied internally to bottom thermal pad |
| 5–8 | Drain | High-current drain node connected to top thermal pad; forms primary current path |
| 9 | Gate | Control terminal with 0.47 Ω internal gate resistance; requires low-impedance drive |
| Tab (top) | Drain | Exposed copper area electrically and thermally connected to pins 5–8 |
| Tab (bottom) | Source | Exposed copper area electrically and thermally connected to pins 1–4 |
Key Features
| Feature | Design Value |
|---|---|
| Double-side cooling interface | Simultaneous thermal extraction from top (drain) and bottom (source) pads reduces total RthJA by up to 40% vs. standard SO-8 |
| 100% avalanche tested | Guarantees robustness against inductive switching stress without derating |
| Logic-level gate drive | VGS(th) = 1.2–2.0 V enables direct drive from 3.3 V or 5 V controllers without level-shifting |
| Pb-free & halogen-free | Complies with RoHS and IEC61249-2-21; suitable for automotive and industrial end-equipment |
| Optimized Qgd/Qg ratio | Qgd = 18–27 nC / Qg = 91 nC improves Miller immunity and dV/dt ruggedness |
Applications
| Server Voltage Regulator Modules | Industrial Motor Drives |
|---|---|
Use Scenario: High-density 48 V input → 0.8 V/500 A output VRM in AI accelerators and CPU power delivery. IC Role / Device Role / Timing Role: Synchronous high-side FET in multiphase buck converter; switched at 500–1000 kHz. Use Value: 0.35 mΩ RDS(on) cuts conduction loss by >35% vs. legacy 0.6 mΩ devices, enabling higher power density without forced air. | Use Scenario: 24–48 V BLDC inverter for servo drives and robotic joints requiring peak currents >400 A. IC Role / Device Role / Timing Role: Low-side switching element in three-phase inverter leg; operated in hard-switched PWM mode. Use Value: 1200 mJ avalanche rating ensures reliable commutation during short-circuit fault conditions without external snubbers. |
| Telecom DC/DC Converters | EV Onboard Chargers (OBC) |
Use Scenario: 48 V intermediate bus converter delivering 12 V/100 A to baseband processing units. IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge topology; gated at 200–400 kHz. Use Value: Dual thermal interface allows mounting on both primary and secondary side PCBs, reducing overall thermal stack-up and improving reliability. | Use Scenario: Secondary-side synchronous rectifier in 3.3 kW AC/DC stage of bidirectional OBC. IC Role / Device Role / Timing Role: Low-VDS rectifying FET replacing Schottky diodes in LLC resonant converter output stage. Use Value: 0.72 V typ. body diode VSD and fast trr (49 ns) minimize reverse recovery loss and EMI generation during zero-voltage switching transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB033N03L3 | RDS(on) = 0.33 mΩ (typ), same 30 V rating, but PG-HSOF-8 package with single-side cooling only | Lacks top-side thermal interface; unsuitable where double-side cooling is required for thermal budget | Select when board layout restricts top-side heatsinking and lower cost is prioritized over thermal headroom |
| IRFH5020TRPBF | RDS(on) = 0.42 mΩ (max), 30 V, PQFN 5×6 mm, no avalanche rating specified | No JEDEC-qualified avalanche testing; limited to non-fault-tolerant applications | Choose only for cost-sensitive consumer-grade DC/DC where fault robustness is not mandated |
Compared with IPB033N03L3 and IRFH5020TRPBF, IQDH35N03LM5CGSCATMA1 delivers superior thermal management via dual thermal paths and guaranteed avalanche ruggedness-critical for industrial and telecom systems where field reliability and long-term stability under transient stress are mandatory.
Availability
IQDH35N03LM5CGSCATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial motor drives, and telecom DC/DC converters requiring stable component supply, high-current handling, and JEDEC-qualified industrial reliability.
Supply support for IQDH35N03LM5CGSCATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security ICs, with global manufacturing and R&D infrastructure.
This device belongs to the OptiMOS™ 5 product line-designed specifically for high-efficiency, high-current power conversion in datacenter, industrial, and e-mobility applications where low RDS(on), fast switching, and thermal resilience are essential.
FAQ
What is the maximum allowable case temperature for continuous operation?
The datasheet specifies TC = 150 °C as the absolute maximum case temperature. At this temperature, the continuous drain current is derated to 414 A (VGS = 10 V). Thermal design must ensure junction temperature remains ≤175 °C using the given RthJC values and actual cooling conditions.
Does IQDH35N03LM5CGSCATMA1 support gate drive from 3.3 V logic?
Yes-its logic-level gate threshold (VGS(th) = 1.2–2.0 V) and low RDS(on) at VGS = 4.5 V (0.36 mΩ max) enable functional switching with 3.3 V gate drive, though conduction loss increases ~15% versus 10 V drive; gate drive strength must exceed 2 A peak to manage 91 nC Qg.
How is the PG-WHTFN-9 package mounted for double-side cooling?
Mounting requires soldering both top (drain) and bottom (source) copper pads to dedicated PCB copper areas-top pad to a heatsink or secondary layer, bottom pad to primary ground plane. The datasheet recommends 40 mm × 40 mm × 1.5 mm FR4 with 6 cm² 70 μm copper for source-side thermal reference.
Is the body diode suitable for synchronous rectification?
Yes-the body diode has trr = 49–98 ns and Qrr = 64–128 nC at 25 °C, enabling use in synchronous rectification where reverse recovery loss must be minimized. However, external Schottky or GaN FETs may offer lower VF in ultra-high-efficiency designs.
IQDH35N03LM5CGSCATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™ 5
- Package/Case:
- 9-PowerWDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 66A (Ta), 700A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 0.35mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1.46mA
- Gate Charge (Qg) (Max) @ Vgs:
- 114 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 18000 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta), 278W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-WHTFN-9-U02
IQDH35N03LM5CGSCATMA1 FAQ
1.How can I place an order for IQDH35N03LM5CGSCATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IQDH35N03LM5CGSCATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IQDH35N03LM5CGSCATMA1 reliable?
The price and inventory of IQDH35N03LM5CGSCATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IQDH35N03LM5CGSCATMA1 is usually 5 days.
3.What payment methods are accepted for IQDH35N03LM5CGSCATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IQDH35N03LM5CGSCATMA1 transactions.
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IQDH35N03LM5CGSCATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IQDH35N03LM5CGSCATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IQDH35N03LM5CGSCATMA1?
For technical support, including IQDH35N03LM5CGSCATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IQDH35N03LM5CGSCATMA1 requirements.
6.How does Aetrix verify that IQDH35N03LM5CGSCATMA1 is sourced from the original manufacturer or authorized distributors?
All IQDH35N03LM5CGSCATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IQDH35N03LM5CGSCATMA1 meets industry standards.
7.What is the process for return or replacement of IQDH35N03LM5CGSCATMA1?
All IQDH35N03LM5CGSCATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IQDH35N03LM5CGSCATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IQDH35N03LM5CGSCATMA1 part is unused and in its original packaging.
Return procedure for IQDH35N03LM5CGSCATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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