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International Test Instruments Corporation IR3505ZMTRPBF

Part No.:
IR3505ZMTRPBF
Manufacturer:
International Test Instruments Corporation
Category:
Power Management - Specialized
Package:
16-VFQFN Exposed Pad
Datasheet:
AetrixIR3505ZMTRPBF.pdf
Description:
XPHASE3 CONTROLLER 2.5A
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,000

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Product details

Overview

IR3505ZMTRPBF from Infineon Technologies is a multiphase synchronous buck gate driver Phase IC designed for CPU/ASIC VRMs in high-performance computing systems. It delivers 7V/2A high-side and 7V/4A low-side gate drive, supports up to 5.1V output with lossless inductor current sensing, implements feed-forward voltage-mode PWM control, and integrates bootstrap PFET - enabling compact, efficient 3–8 phase power stages.

For engineers reviewing the IR3505ZMTRPBF datasheet, IR3505ZMTRPBF pinout, IR3505ZMTRPBF application, or IR3505ZMTRPBF equivalent, key selection criteria include its 3×3 mm MLPQ package thermal performance, daisy-chain digital timing bus (PHSIN/PHSOUT), single-wire average current sharing (ISHARE), and self-calibrating current sense amplifier with ±1 mV offset.

Technical Context

The IR3505ZMTRPBF operates as a slave phase controller in XPhase3™ architecture, receiving DACIN reference, EAIN error signal, and CLKIN timing from a master Control IC (e.g., IR3520). Its PWM ramp slope dynamically adjusts with input voltage via feed-forward sensing at CSIN+/CSIN−, ensuring stable regulation across line/load transients.

It implements three critical analog buses: ISHARE for average current sharing, DACIN for PWM ramp referencing, and EAIN for error amplifier feedback. Digital phase synchronization uses PHSIN/PHSOUT daisy-chaining without external delay components, while GATEL/GATEH non-overlap logic prevents shoot-through with programmable dead time derived from VCCL/BOOST/SW node voltages.

Key Specifications

Parameter Value and Actual Design Meaning
GATEL Sink Current 4.0 A peak - drives low-side MOSFETs with fast turn-off for high-efficiency synchronous rectification.
GATEH Source/Sink 2.0 A each - enables robust driving of high-side N-channel MOSFETs in buck topologies.
Current Sense Gain 32.5 V/V - provides precise inductor current measurement with <±1 mV input offset for accurate current sharing.
PWM Ramp Slope 52.5 mV/%DC - feed-forward slope scales with VIN to maintain loop stability across input voltage variation.
ISHARE Bandwidth 6.8 MHz - supports fast average current sharing across multiple phases with minimal latency.
Minimum Pulse Width 75 ns - allows fine-grained duty cycle control down to ~0.75% at 1 MHz switching frequency.
VCCL Operating Range 4.75–7.5 V - powers low-side driver and internal bootstrap PFET, defining max output voltage as VCCL − 1.4 V.

Pinout & Package

IR3505ZMTRPBF is housed in a thermally enhanced 16-lead MLPQ package (3 × 3 mm body, 0.5 mm pitch) with exposed thermal pad on underside for PCB heat sinking.

Pin/Terminal Circuit Role Design Meaning
1 ISHARE Current share bus output Outputs V(DACIN) + 32.5×(CSIN+ − CSIN−); connected across all phases to enable average current sharing and OVP detection.
2 DACIN PWM reference input Reference voltage from Control IC; sets PWM ramp baseline and current sense common-mode point.
4 PHSIN / 5 PHSOUT Digital phase timing interface Enables daisy-chained phase alignment without external delay components; supports up to 8-phase synchronization.
8 GATEL / 11 GATEH Gate drive outputs GATEL sinks 4 A for low-side N-MOS; GATEH sources/sinks 2 A for high-side N-MOS with integrated non-overlap logic.
10 BOOST / 9 VCCL / 12 SW High-side driver supply nodes BOOST (up to 34 V) and VCCL (4.75–7.5 V) power high-side driver; SW is switch-node return for bootstrap charging.
14 CSIN+ / 15 CSIN− Current sense differential inputs Accept lossless inductor DCR or resistor-based current sense; enable ±50 nA bias mismatch for precision sharing.

Key Features

Feature Design Value
Integrated bootstrap PFET Eliminates external bootstrap diode; reduces BOM count and improves reliability in high-frequency VRMs.
Self-calibrating amplifiers Automatically corrects PWM ramp, current sense, and current share amplifier offsets during startup - no factory trim required.
Body braking comparator Activates low-side FET conduction when EAIN falls below DACIN, improving transient response during load step-down events.
Single-wire average current sharing ISHARE bus enables precise per-phase current balancing across ≥2 phases using only one pin per device - no external op-amps or resistors.
Debug isolation function Allows individual phase ICs to be electrically isolated from the converter during validation - simplifies fault tracing in multi-phase designs.

Applications

Server CPU VRM AI Accelerator Power

Use Scenario: 3–8 phase VRM supplying 0.8–1.8 V @ 100–600 A to dual-socket Xeon Scalable or AMD EPYC processors.

IC Role / Device Role / Timing Role: Phase IC executing PWM generation, gate drive, and current sensing per phase under IR3520/IR3567 Control IC coordination.

Use Value: Enables <1% current imbalance across phases and <50 ns phase timing skew - critical for thermal derating and ripple cancellation.

Use Scenario: High-density power delivery to NVIDIA A100/H100 GPU modules with dynamic load steps exceeding 1000 A/µs.

IC Role / Device Role / Timing Role: Gate driver with feed-forward PWM and body braking to minimize undershoot during rapid load decreases.

Use Value: Achieves <150 mV undershoot at 500 A/µs load step due to sub-100 ns propagation delay in current sense and comparator paths.

FPGA Core Voltage Regulator Network ASIC Power Stage

Use Scenario: 4-phase VRM powering Xilinx Versal or Intel Agilex FPGA core rails (0.75–0.95 V) with tight voltage tolerance (±10 mV).

IC Role / Device Role / Timing Role: Precision current sensing and DACIN-referenced PWM ramp ensure consistent regulation despite board-level VIN droop.

Use Value: Maintains ±0.5% output regulation over 0–100°C junction temperature via self-calibrating current sense amplifier and ramp generator.

Use Scenario: Compact 3-phase power stage for Broadcom Tomahawk or Marvell Prestera network switches operating at 12 V input.

IC Role / Device Role / Timing Role: High-efficiency gate driver with integrated bootstrap PFET and low RDS(on) drive capability minimizes conduction losses.

Use Value: Reduces total phase component count by 4 parts per phase versus discrete gate driver + bootstrap solutions - saving >12 mm² PCB area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multiphase gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
IR35203MTRPBF Integrated PWM controller + gate driver in single chip; no external Control IC needed; supports up to 6 phases. Reduces system complexity for ≤6-phase designs but lacks daisy-chain scalability beyond 6 phases. Select when consolidating control and phase functions saves board space and simplifies firmware integration.
MP8765GQ-Z Monolithic 3-phase buck controller with integrated drivers; fixed 500 kHz–1.2 MHz frequency; no ISHARE bus or daisy-chain timing. Suitable for cost-sensitive, lower-current applications (<120 A) where phase count and current sharing accuracy are less critical. Choose for entry-level server or storage applications where full XPhase3™ flexibility is unnecessary.

Compared with IR3505ZMTRPBF, IR35203 offers higher integration but less scalable phase count, while MP8765 sacrifices current sharing precision and daisy-chain timing for lower BOM cost and simpler layout.

Availability

IR3505ZMTRPBF is available at Aetrix Electronics and suitable for server CPU VRMs, AI accelerator power supplies, and FPGA core voltage regulators requiring stable component supply across extended product lifecycles.

Supply support for IR3505ZMTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in high-efficiency power conversion solutions.

The IR3505Z belongs to Infineon's XPhase3™ multiphase controller family, engineered specifically for high-current, low-voltage CPU/ASIC VRMs demanding precise current sharing, fast transient response, and thermal efficiency in datacenter and AI hardware.

FAQ

What is the maximum supported output voltage for IR3505ZMTRPBF?

The IR3505ZMTRPBF supports converter output voltage up to 5.1 V, limited by the VCCL supply voltage minus 1.4 V (i.e., VOUT(max) = VVCCL − 1.4 V). With VCCL operating between 4.75 V and 7.5 V, the practical maximum output is 5.1 V when VCCL = 6.5 V. This constraint ensures safe operation of the internal bootstrap PFET and gate drive circuitry.

How does the ISHARE bus enable current sharing across multiple phases?

The ISHARE pin outputs a voltage equal to V(DACIN) + 32.5 × (V(CSIN+) − V(CSIN−)), which represents scaled inductor current. When all ISHARE pins are tied together, the resulting bus voltage equals the average of all phase currents. The Control IC monitors this bus to adjust DACIN per phase, forcing individual currents toward the average - achieving <1% imbalance in typical implementations.

Can IR3505ZMTRPBF operate without an external Control IC?

No. The IR3505ZMTRPBF is a dedicated Phase IC and requires a companion Control IC (e.g., IR3520, IR3567, or IR3584) to provide DACIN reference, EAIN error signal, CLKIN timing, and system-level protection logic. It lacks internal PWM oscillator, VID interface, or telemetry processing - all handled externally by the Control IC.

What thermal considerations apply to the 3×3 mm MLPQ package?

The IR3505ZMTRPBF's 16-lead MLPQ package features an exposed thermal pad on the underside. For reliable operation at full 4 A GATEL sink current, the pad must be soldered to a minimum 100 mm² copper pour with ≥4 thermal vias (0.3 mm diameter) connecting to inner ground planes. Junction-to-board thermal resistance is 22°C/W; without proper thermal design, TJ exceeds 125°C above 2.5 A continuous load.

IR3505ZMTRPBF Specifications

Product attributes
Attribute value
Manufacturer:
International Test Instruments Corporation
Series:
XPhase3™
Package/Case:
16-VFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Active
Applications:
Processor
Current - Supply:
3mA
Voltage - Supply:
-
Operating Temperature:
0°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-MLPQ (3x3)

IR3505ZMTRPBF FAQ

1.How can I place an order for IR3505ZMTRPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IR3505ZMTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IR3505ZMTRPBF reliable?

The price and inventory of IR3505ZMTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3505ZMTRPBF is usually 5 days.

3.What payment methods are accepted for IR3505ZMTRPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3505ZMTRPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IR3505ZMTRPBF?

IR3505ZMTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IR3505ZMTRPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IR3505ZMTRPBF?

For technical support, including IR3505ZMTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3505ZMTRPBF requirements.

6.How does Aetrix verify that IR3505ZMTRPBF is sourced from the original manufacturer or authorized distributors?

All IR3505ZMTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3505ZMTRPBF meets industry standards.

7.What is the process for return or replacement of IR3505ZMTRPBF?

All IR3505ZMTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3505ZMTRPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IR3505ZMTRPBF part is unused and in its original packaging.

Return procedure for IR3505ZMTRPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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